B08B7/026

SYSTEM AND METHOD FOR COATING REMOVAL
20200179992 · 2020-06-11 ·

A system for removing a coating from an underlying layer can include a wave-based weakening system configured to weaken the coating by decreasing a coupling force between the coating and the substrate, a coating removal mechanism configured to remove the weakened coating from the underlying layer, and a sensor configured to determine a property associated with the coating. A method for removing a coating from an underlying layer can include generating a weakened coating and removing the weakened coating.

Method for removing dust in sound outlet hole of loudspeaker, and terminal device

A terminal device and a method for removing dust in a sound outlet hole of a loudspeaker are provided. The method includes the following: measuring a natural frequency of the loudspeaker, generating an audio file for removing dust according to the natural frequency, and prestoring the audio file for removing dust, wherein a vibration amplitude of a vibration diaphragm of the loudspeaker is at a maximum when the vibration diaphragm is driven to vibrates by an exciting current having the natural frequency; reading the prestored audio file for removing dust; and controlling the loudspeaker to play the audio file for removing dust, to generate air flow in the sound outlet hole, wherein when the loudspeaker plays the audio file for removing dust, a wind speed of the air flow through the sound outlet hole is at a maximum.

Method and apparatuses for disposing of excess material of a photolithographic mask

The present application relates to a method for disposing of excess material of a photolithographic mask, wherein the method comprises the following steps: (a) enlarging a surface of the excess material; (b) displacing the enlarged excess material on the photolithographic mask using at least one first probe of a scanning probe microscope; and (c) removing the displaced enlarged excess material from the photolithographic mask.

METHOD AND APPARATUSES FOR DISPOSING OF EXCESS MATERIAL OF A PHOTOLITHOGRAPHIC MASK
20200103751 · 2020-04-02 ·

The present application relates to a method for disposing of excess material of a photolithographic mask, wherein the method comprises the following steps: (a) enlarging a surface of the excess material; (b) displacing the enlarged excess material on the photolithographic mask using at least one first probe of a scanning probe microscope; and (c) removing the displaced enlarged excess material from the photolithographic mask.

Method for Removing Dust in Sound Outlet Hole of Loudspeaker, and Terminal Device
20190394591 · 2019-12-26 ·

A terminal device and a method for removing dust in a sound outlet hole of a loudspeaker are provided. The method includes the following: measuring a natural frequency of the loudspeaker, generating an audio file for removing dust according to the natural frequency, and prestoring the audio file for removing dust, wherein a vibration amplitude of a vibration diaphragm of the loudspeaker is at a maximum when the vibration diaphragm is driven to vibrates by an exciting current having the natural frequency; reading the prestored audio file for removing dust; and controlling the loudspeaker to play the audio file for removing dust, to generate air flow in the sound outlet hole, wherein when the loudspeaker plays the audio file for removing dust, a wind speed of the air flow through the sound outlet hole is at a maximum.

METHOD AND SYSTEM FOR CLEANING A FIELD EMISSION CATHODE DEVICE
20240079197 · 2024-03-07 ·

A method and system for cleaning a field emission cathode device, the field emission cathode device including a substrate having a field emission layer engaged therewith, includes engaging the field emission cathode device with a vibration device such that the substrate is disposed above the field emission layer. The field emission cathode device is then vibrated with the vibration device in an X, Y, or Z direction at a predetermined frequency and at a predetermined amplitude for a predetermined time duration so as to clean the field emission cathode device by dislodging non-embedded particles from the field emission layer.

APPARATUS FOR AND A METHOD OF DEICING A DUCTED FAN ENGINE
20240076059 · 2024-03-07 ·

A ducted fan engine is deiced using a ground support deicing apparatus having a support structure, a plurality of sonic wave transmitters, an imaging device, and a controller that controls the sonic wave transmitters to emit sonic waves at varying frequencies. A deicing program causes the controller to control (a) providing imaging signals to obtain image data from imaging sensors, (b) receiving image data provided by each of the imaging sensors, and generates images of at least one component part of the engine, (c) detecting a presence or an absence of ice on the at least one component part of the engine, and (d) controlling the plurality of sonic wave transmitters to emit sonic waves in a given frequency range so as to remove the ice from the component part of the engine.

SEFL-CLEANING DEVICE AND METHOD USING ELECTRICAL OSCILLATION AND MECHANICAL OSCILLATION

A self-cleaning device comprises at least one first electrode disposed on a solid material layer, a first dielectric layer disposed on the first electrode, a hydrophobic layer disposed on the first dielectric layer, and at least one mechanical oscillation unit. Electrical oscillation for oscillating a droplet in a horizontal direction is generated by applying a first electric signal to the first electrode, thereby merging droplets formed on the hydrophobic layer, the mechanical oscillation unit moves the merged droplets in a specific direction or atomizes the merged droplets to remove the merged droplets by generating mechanical oscillation for oscillating the droplet in a vertical direction, and each of the droplets has a volume smaller than 3 l, and new droplet having a volume more than 3 l is generated by the merging.

CMP wafer cleaning equipment, wafer transfer robot and wafer flipping method

Disclosed are a CMP wafer cleaning apparatus, and a wafer transfer manipulator and a wafer overturn method for same. The wafer transfer manipulator includes: a transverse transfer shaft, with same only being located at a side of a cleaning unit; a transverse transfer carriage provided on the transverse transfer shaft, and capable of transversely moving along the transverse transfer shaft; a first vertical lifting shaft provided on the transverse transfer carriage, and capable of vertically moving on the transverse transfer carriage; a rotary table provided on the first vertical lifting shaft; and a first claw clamping arm connected to the rotary table, and driven by the rotary table to move in a rotational manner. The CMP wafer cleaning apparatus is provided, and when the CMP wafer cleaning apparatus fails, safe storage of a polished wafer can be realized.

REPROCESSING OF CONTAMINATED REUSABLE DEVICES WITH DIRECT CONTACT OF PRESSURE WAVES
20240042073 · 2024-02-08 · ·

Reusable instrumentation, such as a medical instrument or tool, is decontaminated by applying pressure waves from multiple shockwave applicators and/or reflectors.