A food processing and/or packaging device comprises at least one food chamber. Via a conduit system, the at least one food chamber is connected to a vacuum pump for generating vacuum in the at least one food chamber. For sterilizing the conduit system and/or the food chamber, a sterilization device is provided. The sterilization device comprises e.g. spray nozzles for introducing cleaning liquid into the conduit system. The cleaning liquid is separated by a liquid separator arranged upstream of the vacuum pump in flow direction.

A food processing and/or packaging device comprises at least one food chamber. Via a conduit system, the at least one food chamber is connected to a vacuum pump for generating vacuum in the at least one food chamber. For sterilizing the conduit system and/or the food chamber, a sterilization device is provided. The sterilization device comprises e.g. spray nozzles for introducing cleaning liquid into the conduit system. The cleaning liquid is separated by a liquid separator arranged upstream of the vacuum pump in flow direction.

There is provided a substrate processing apparatus which includes: an exhaust pipe configured to selectively discharge an exhaust gas generated by a substrate process to a first pipe or a second pipe; a liquid supply part configured to supply a cleaning liquid to the exhaust pipe; a discharge destination setting part configured to set a discharge destination of the exhaust gas to the first pipe or the second pipe by rotating the exhaust pipe; and a controller configured to control the discharge destination setting part to rotate the exhaust pipe. The controller is further configured to control the liquid supply part to supply the cleaning liquid to the rotating exhaust pipe.

There is provided a substrate processing apparatus which includes: an exhaust pipe configured to selectively discharge an exhaust gas generated by a substrate process to a first pipe or a second pipe; a liquid supply part configured to supply a cleaning liquid to the exhaust pipe; a discharge destination setting part configured to set a discharge destination of the exhaust gas to the first pipe or the second pipe by rotating the exhaust pipe; and a controller configured to control the discharge destination setting part to rotate the exhaust pipe. The controller is further configured to control the liquid supply part to supply the cleaning liquid to the rotating exhaust pipe.

A cleaning solution for the removal of asphaltene deposits includes a first dispersant comprising a quaternary ammonium compound and a second dispersant comprising a pyridinium compound.

A two-piece sterilizable vessel is sealed together containing devices and a solution that cleans and/or lubricates devices during heat sterilization. When placed inside a heat sterilizer, the vessel becomes pressurized and isolates the solution from the sterilizer's environment. This vessel has two parts: a base and a top.

The base has an internal calibrated reservoir to measure the amount of solution within the vessel.

The base's external dimensions, larger than the top, creates a lengthwise tilt of the vessel when placed on a flat surface. The top is positioned lower than the base. The purpose of the tilt is to allow the solution to flow from the reservoir to the vessel's top. This solution immerses the mechanics of the device.

After sterilization is completed, the pressure relief valve in the vessel's top is activated to release the pressure within the vessel.

A fluid dispensing assembly includes a dispenser that may be attached to an air conditioning unit. A container is provided to contain a liquid clog remover. The container is removably attached to the dispenser thereby facilitating the container to be fluidly coupled to the dispenser. A hose is fluidly coupled between the dispenser and a condensation drain on the air conditioning unit such that the liquid clog remover inhibits the condensation drain from becoming clogged.

A fluid dispensing assembly includes a dispenser that may be attached to an air conditioning unit. A container is provided to contain a liquid clog remover. The container is removably attached to the dispenser thereby facilitating the container to be fluidly coupled to the dispenser. A hose is fluidly coupled between the dispenser and a condensation drain on the air conditioning unit such that the liquid clog remover inhibits the condensation drain from becoming clogged.

A method is provided for cleaning of a processing system comprising a wafer processing chamber and a pumping line in fluid connection with the wafer processing chamber. The method includes initiating cleaning of the wafer processing chamber by activating a chamber cleaning source and initiating cleaning of at least a portion of the pumping line by activating a foreline cleaning source coupled to the pumping line. The method also includes monitoring, at a downstream endpoint detector coupled to the pumping line, a level of a signature substance. The method further includes determining, by the downstream endpoint detector, at least one of a first endpoint of the cleaning of the wafer processing chamber or a second endpoint of the cleaning of the pumping line based on the monitoring.

A method is provided for cleaning of a processing system comprising a wafer processing chamber and a pumping line in fluid connection with the wafer processing chamber. The method includes initiating cleaning of the wafer processing chamber by activating a chamber cleaning source and initiating cleaning of at least a portion of the pumping line by activating a foreline cleaning source coupled to the pumping line. The method also includes monitoring, at a downstream endpoint detector coupled to the pumping line, a level of a signature substance. The method further includes determining, by the downstream endpoint detector, at least one of a first endpoint of the cleaning of the wafer processing chamber or a second endpoint of the cleaning of the pumping line based on the monitoring.