B08B9/46

ENDPOINT DETECTION FOR A CHAMBER CLEANING PROCESS

Embodiments of the present invention provide an apparatus and methods for detecting an endpoint for a cleaning process. In one example, a method of determining a cleaning endpoint includes performing a cleaning process in a plasma processing chamber, directing an optical signal to a surface of a shadow frame during the cleaning process, collecting a return reflected optical signal reflected from the surface of the shadow frame, determining a change of reflectance intensity of the return reflected optical signal as collected, and determining an endpoint of the cleaning process based on the change of the reflected intensity. In another example, an apparatus for performing a plasma process and a cleaning process after the plasma process includes an optical monitoring system coupled to a processing chamber, the optical monitoring system configured to direct an optical beam light to a surface of a shadow frame disposed in the processing chamber.

ENDPOINT DETECTION FOR A CHAMBER CLEANING PROCESS

Embodiments of the present invention provide an apparatus and methods for detecting an endpoint for a cleaning process. In one example, a method of determining a cleaning endpoint includes performing a cleaning process in a plasma processing chamber, directing an optical signal to a surface of a shadow frame during the cleaning process, collecting a return reflected optical signal reflected from the surface of the shadow frame, determining a change of reflectance intensity of the return reflected optical signal as collected, and determining an endpoint of the cleaning process based on the change of the reflected intensity. In another example, an apparatus for performing a plasma process and a cleaning process after the plasma process includes an optical monitoring system coupled to a processing chamber, the optical monitoring system configured to direct an optical beam light to a surface of a shadow frame disposed in the processing chamber.

Inspection of containers
09867890 · 2018-01-16 · ·

An apparatus for inspecting empty containers in order to detect dirt therein is disclosed. A radiation source generates exciting radiation, and the exciting radiation is directed onto the inner wall of a container and excites dirt to be detected in such a way that the dirt emits luminescent radiation. At least one device detects the luminescent radiation emitted by the dirt, and another device analyzes the detected luminescent radiation. Also disclosed is a corresponding method for inspecting empty containers in order to detect dirt therein.

Inspection of containers
09867890 · 2018-01-16 · ·

An apparatus for inspecting empty containers in order to detect dirt therein is disclosed. A radiation source generates exciting radiation, and the exciting radiation is directed onto the inner wall of a container and excites dirt to be detected in such a way that the dirt emits luminescent radiation. At least one device detects the luminescent radiation emitted by the dirt, and another device analyzes the detected luminescent radiation. Also disclosed is a corresponding method for inspecting empty containers in order to detect dirt therein.

Optical spectrum sensor wafer or robot for chamber condition monitoring
12176188 · 2024-12-24 · ·

Embodiments disclosed herein include a diagnostic substrate. In an embodiment, the diagnostic substrate comprises a substrate, a circuit board on the substrate, and a spectrometer coupled to the circuit board. In an embodiment, the diagnostic substrate further comprises a processor on the circuit board and communicatively coupled to the spectrometer.

Optical spectrum sensor wafer or robot for chamber condition monitoring
12176188 · 2024-12-24 · ·

Embodiments disclosed herein include a diagnostic substrate. In an embodiment, the diagnostic substrate comprises a substrate, a circuit board on the substrate, and a spectrometer coupled to the circuit board. In an embodiment, the diagnostic substrate further comprises a processor on the circuit board and communicatively coupled to the spectrometer.

Variable speed profile extrusion portion cutting head and control system
12182987 · 2024-12-31 · ·

The invention is directed to a foodstuff extrusion portioning device and more specifically a cutter head assembly on such an extruder having a servo motor, a cutter shuttle coupled to a cutting element, a controller and being programmed via a product variable to provide a velocity profile. The cutter in the velocity profile has a first velocity and it reduces speed to a second velocity and goes more slowly through the last portion of the foodstuff. The at least two velocities being fully programmable and the controller can provide for instantaneous and additional programmed velocities throughout the cutting profile. The cutter further providing tilt control so it can drop the portion at the moment the portion detaches from the extruded foodstuff stream. It cuts and/or breaks off portions in a far more uniform and controllable manner to more accurately portion and better place the cut portions. This also provides the portion with minimal residual energy pushing it forward as it drops through the effect of gravity and the cutter can be used so as to further direct and push the portion downward so as to optimally place it.

Variable speed profile extrusion portion cutting head and control system
12182987 · 2024-12-31 · ·

The invention is directed to a foodstuff extrusion portioning device and more specifically a cutter head assembly on such an extruder having a servo motor, a cutter shuttle coupled to a cutting element, a controller and being programmed via a product variable to provide a velocity profile. The cutter in the velocity profile has a first velocity and it reduces speed to a second velocity and goes more slowly through the last portion of the foodstuff. The at least two velocities being fully programmable and the controller can provide for instantaneous and additional programmed velocities throughout the cutting profile. The cutter further providing tilt control so it can drop the portion at the moment the portion detaches from the extruded foodstuff stream. It cuts and/or breaks off portions in a far more uniform and controllable manner to more accurately portion and better place the cut portions. This also provides the portion with minimal residual energy pushing it forward as it drops through the effect of gravity and the cutter can be used so as to further direct and push the portion downward so as to optimally place it.

OPTICAL SPECTRUM SENSOR WAFER OR ROBOT FOR CHAMBER CONDITION MONITORING
20250069868 · 2025-02-27 ·

Embodiments disclosed herein include a diagnostic substrate. In an embodiment, the diagnostic substrate comprises a substrate, a circuit board on the substrate, and a spectrometer coupled to the circuit board. In an embodiment, the diagnostic substrate further comprises a processor on the circuit board and communicatively coupled to the spectrometer.

OPTICAL SPECTRUM SENSOR WAFER OR ROBOT FOR CHAMBER CONDITION MONITORING
20250069868 · 2025-02-27 ·

Embodiments disclosed herein include a diagnostic substrate. In an embodiment, the diagnostic substrate comprises a substrate, a circuit board on the substrate, and a spectrometer coupled to the circuit board. In an embodiment, the diagnostic substrate further comprises a processor on the circuit board and communicatively coupled to the spectrometer.