Patent classifications
B08B9/46
Variable speed profile extrusion portion cutting head and control system
The invention is directed to a foodstuff extrusion portioning device and more specifically a cutter head assembly on such an extruder having a servo motor, a cutter shuttle coupled to a cutting element, a controller and being programmed via a product variable to provide a velocity profile. The cutter in the velocity profile has a first velocity and it reduces speed to a second velocity and goes more slowly through the last portion of the foodstuff. The at least two velocities being fully programmable and the controller can provide for instantaneous and additional programmed velocities throughout the cutting profile. The cutter further providing tilt control so it can drop the portion at the moment the portion detaches from the extruded foodstuff stream. It cuts and/or breaks off portions in a far more uniform and controllable manner to more accurately portion and better place the cut portions. This also provides the portion with minimal residual energy pushing it forward as it drops through the effect of gravity and the cutter can be used so as to further direct and push the portion downward so as to optimally place it.
Variable speed profile extrusion portion cutting head and control system
The invention is directed to a foodstuff extrusion portioning device and more specifically a cutter head assembly on such an extruder having a servo motor, a cutter shuttle coupled to a cutting element, a controller and being programmed via a product variable to provide a velocity profile. The cutter in the velocity profile has a first velocity and it reduces speed to a second velocity and goes more slowly through the last portion of the foodstuff. The at least two velocities being fully programmable and the controller can provide for instantaneous and additional programmed velocities throughout the cutting profile. The cutter further providing tilt control so it can drop the portion at the moment the portion detaches from the extruded foodstuff stream. It cuts and/or breaks off portions in a far more uniform and controllable manner to more accurately portion and better place the cut portions. This also provides the portion with minimal residual energy pushing it forward as it drops through the effect of gravity and the cutter can be used so as to further direct and push the portion downward so as to optimally place it.
OPTICAL SPECTRUM SENSOR WAFER OR ROBOT FOR CHAMBER CONDITION MONITORING
Embodiments disclosed herein include a diagnostic substrate. In an embodiment, the diagnostic substrate comprises a substrate, a circuit board on the substrate, and a spectrometer coupled to the circuit board. In an embodiment, the diagnostic substrate further comprises a processor on the circuit board and communicatively coupled to the spectrometer.
OPTICAL SPECTRUM SENSOR WAFER OR ROBOT FOR CHAMBER CONDITION MONITORING
Embodiments disclosed herein include a diagnostic substrate. In an embodiment, the diagnostic substrate comprises a substrate, a circuit board on the substrate, and a spectrometer coupled to the circuit board. In an embodiment, the diagnostic substrate further comprises a processor on the circuit board and communicatively coupled to the spectrometer.
Endpoint detection of deposition cleaning in a pumping line and a processing chamber
A method is provided for cleaning of a processing system comprising a wafer processing chamber and a pumping line in fluid connection with the wafer processing chamber. The method includes initiating cleaning of the wafer processing chamber by activating a chamber cleaning source and initiating cleaning of at least a portion of the pumping line by activating a foreline cleaning source coupled to the pumping line. The method also includes monitoring, at a downstream endpoint detector coupled to the pumping line, a level of a signature substance. The method further includes determining, by the downstream endpoint detector, at least one of a first endpoint of the cleaning of the wafer processing chamber or a second endpoint of the cleaning of the pumping line based on the monitoring.
Endpoint detection of deposition cleaning in a pumping line and a processing chamber
A method is provided for cleaning of a processing system comprising a wafer processing chamber and a pumping line in fluid connection with the wafer processing chamber. The method includes initiating cleaning of the wafer processing chamber by activating a chamber cleaning source and initiating cleaning of at least a portion of the pumping line by activating a foreline cleaning source coupled to the pumping line. The method also includes monitoring, at a downstream endpoint detector coupled to the pumping line, a level of a signature substance. The method further includes determining, by the downstream endpoint detector, at least one of a first endpoint of the cleaning of the wafer processing chamber or a second endpoint of the cleaning of the pumping line based on the monitoring.
Moulding
A system for moulding three-dimensional products from a mass of one or more food starting materials which are suitable for consumption, in particular human consumption, has a production device having a frame, a mould member provided with at least one mould cavity, the frame supporting the mould member, mass feed means for feeding the mass to the one or more mould cavities of the mould member. The system also has at least one cleaning device for cleaning one or more parts of the production device which come into contact with the mass. The mould member is removable from the frame. The system has a storage device for storing a plurality of mould members, which may be provided with an identification, has recognition means for recognizing the identification of a mould member, and may have a memory for storing at least one history of a mould member.
FERMENTATION MANAGEMENT METHOD
The fermentation management method according to the present invention includes a sampling step of sampling a gas containing substances produced in association with fermentation, an analysis step of analyzing the sampled gas by ion mobility spectrometry, and an operation step of operating at least one of adjustment of the fermentation, termination of the fermentation, mixing of a fermented product, addition of materials or additives to the fermented product, temperature regulation for the fermented product, stirring regulation for the fermented product, firing of the fermented product, sedimentation, and filtration of the fermented product on the basis of at least one of a peak intensity, a peak area, and peak appearance in an IMS spectrum obtained in the analysis step. The analysis step is a step of ionizing and analyzing the substances produced in association with the fermentation by using electrons emitted from an electron emitting element.
FERMENTATION MANAGEMENT METHOD
The fermentation management method according to the present invention includes a sampling step of sampling a gas containing substances produced in association with fermentation, an analysis step of analyzing the sampled gas by ion mobility spectrometry, and an operation step of operating at least one of adjustment of the fermentation, termination of the fermentation, mixing of a fermented product, addition of materials or additives to the fermented product, temperature regulation for the fermented product, stirring regulation for the fermented product, firing of the fermented product, sedimentation, and filtration of the fermented product on the basis of at least one of a peak intensity, a peak area, and peak appearance in an IMS spectrum obtained in the analysis step. The analysis step is a step of ionizing and analyzing the substances produced in association with the fermentation by using electrons emitted from an electron emitting element.
APPARATUSES, SYSTEMS, AND METHODS FOR CLEANING
A cleaning apparatus includes a nozzle assembly and an arm supporting the nozzle assembly. In some embodiments, the arm includes a first rotatable arm member defining a first axis and a second rotatable arm member defining a second axis and connected to the first rotatable member. In certain examples, the first rotatable arm is rotatable about the first axis and the second rotatable arm is rotatable about the second axis. The cleaning apparatus also includes at least one sensor on the arm and configured to detect a position of the nozzle assembly based on rotation of the first rotatable arm or the second rotatable arm