Disclosed are a liquid treating apparatus and a liquid treating method. The liquid treating apparatus includes a chamber that provides a space for processing a substrate, a support unit that is provided in the chamber to support the substrate, an ejection unit that has a nozzle for supplying a cleaning medium to the substrate supported by the support unit, and an auxiliary ejection unit that has an auxiliary nozzle for supplying a contamination prevention liquid to the substrate supported by the support unit.

Disclosed is a method for liquid-treating a substrate. In a method for treating a substrate, the substrate may be treated by supplying a treatment liquid onto the rotating substrate by using a first nozzle and a second nozzle, the first nozzle supplies the treatment liquid to an area including a central area on the substrate, and the second nozzle supplies the treatment liquid to a peripheral area of the substrate.

A cleaning vehicle generally has a grey water reservoir having a pre-filter; an aspiration conduit leading into the grey water reservoir upstream from the pre-filter and a vacuum pump adapted to create a vacuum inside the grey water reservoir to draw grey water; a vortex separation subsystem connected downstream from the pre-filter; a filtration bag subsystem connected downstream from the vortex separation subsystem; a filtrate reservoir connected downstream from the filtration bag subsystem; a high pressure hose having an end connected downstream from the filtrate reservoir and another end having a high pressure spray nozzle; a filtrate path extending from the grey water reservoir to the high pressure spray nozzle via the pre-filter, the vortex separation subsystem, the filtration bag subsystem and the high pressure hose; and at least one pump adapted to entrain a flow of fluid along the filtrate path.

A wafer processing system has a ring maintenance module for loading wafers into a chuck assembly, and for cleaning and inspecting the chuck assembly used in electroplating processors of the system. A shaft is attached to a rotor plate. A rotation motor rotates the shaft and a rotor plate on the shaft. A chuck clamp on an upper end of the shaft holds the chuck assembly onto the rotor plate. A lift motor raises and lowers the rotor plate and the shaft, to move open the chuck assembly for wafer loading and unloading, and to move the chuck assembly into different process positions. A swing arm having spray nozzles may be provided for cleaning the chuck assembly.

A device for cleaning and drying a spraying unit, the device containing: a top end and a bottom end; the top and bottom end connected to each other by a housing; the housing having an opening proximate the top end, for receiving at least a portion of a spraying unit; a first liner within the housing; a second liner within the first liner; the first liner fitting within the housing forming a space between an outside wall of the first liner and an inside wall of the housing; the second liner fitting within the first liner forming a space between an outside wall of the second liner and an inside wall of the first liner; the opening further containing an open cap, proximate the top end; the device having at least one vacuum air supply influent port, at least one drying air supply influent port and at least one solvent supply influent port.

The wafer processing system includes a rotatable wafer support member for supporting a wafer and a plurality of collections trays disposed about a peripheral edge of the wafer support member. The collection trays are arranged in a stacked configuration, each collection tray having an inner wall portion and an outer wall portion that converge to define a trough section for collecting fluid. The system includes a chamber exhaust outlet that is formed in the housing for venting gas from the interior of the housing outside of the collection trays and a chemical exhaust outlet that is formed in the housing for venting gas that flows through the collection chamber to the chemical exhaust outlet. The chemical exhaust outlet is fluidly isolated from the chamber exhaust outlet.

A high-pressure cleaning apparatus including a high-pressure pump that includes a suction chamber, at least one pump chamber in which liquid is pressurized, and a pressure chamber arranged downstream of the pump chamber is disclosed. The high-pressure pump includes a return line via which the pressure chamber is in flow communication with the suction chamber, and a valve unit by which a free cross-sectional area of the return line is changeable. The high-pressure cleaning apparatus also includes a drive unit associated with the valve unit, a control unit coupled to the drive unit and a pressure sensor coupled to the control unit for detecting liquid pressure on the pressure side of the pump chamber. Depending on the signal of the pressure sensor, the liquid pressure can be controllable to a predetermined or predeterminable liquid pressure by changing of the free cross-sectional area of the return line.

The present invention provides techniques to more accurately control the process performance of treatments in which microelectronic substrates are treated by pressurized fluids that are sprayed onto the substrates in a vacuum process chamber. control strategies are used that adjust mass flow rate responsive to pressure readings in order to hold the pressure of a pressurized feed constant. In these embodiments, the mass flow rate will tend to vary in order to maintain pressure uniformity.

A substrate processing system includes multiple assemblies framed and including such that each of the assemblies includes a substrate processing apparatus which supplies a processing fluid to a substrate and processes the substrate, a fluid supply control apparatus including a fluid control device which controls flow of the processing fluid supplied to the substrate processing apparatus, and a drive equipment apparatus including a drive device which drives movement of the fluid control device in the fluid supply control apparatus.

A device for sanitizing a unit of an air conditioning system having a source of sanitizing fluid, means for the controlled delivery of a jet of sanitizing fluid, suctioning means to generate suction flow is provided. The device has suction opening shaped to direct the suction flow towards a determined direction with respect to the direction of the jet of sanitizing fluid. The suction opening is smaller than the unit of the air conditioning to be sanitized in order to be alternately moved from a first portion of the unit towards a second portion of the same unit.