A substrate processing apparatus includes a substrate stage that supports a substrate, a follower stage disposed on a same plane as the substrate stage, a first driving unit that moves the follower stage in parallel with a first direction, and a second driving unit that moves the substrate stage in parallel with the first direction. The second driving unit includes a voice magnet member disposed on the substrate stage, and a voice coil member disposed on the follower stage and spaced apart from the voice magnet member.

According to one embodiment, a substrate processing apparatus includes: a removing part (D1) configured to remove liquid droplets present in a recess (30); a drain hole (30a) located at the bottom of the recess (30) of a nozzle head (32), and configured to discharge the liquid droplets as a target to be removed out of the recess (30); and a controller configured to control the discharge state of a gas discharge nozzle (33) such that there is a period in which a gas is discharged from the gas discharge nozzle (33) at a flow rate, at which the gas discharged does not reach a surface to be processed of s substrate W, in a period from the end of the rinsing process using a treatment liquid to the start of the drying process using the gas.

A cleaning module for cleaning a wafer comprises a wafer gripping device configured to support a wafer in a vertical orientation and comprises a catch cup and a gripper assembly. The catch cup comprises a wall that has an annular inner surface that defines a processing region and has an angled portion that is symmetric about a central axis of the wafer gripping device. The gripper assembly comprises a first plate assembly, a second plate assembly, a plurality of gripping pin, and a plurality of loading pin. The gripping pins are configured to grip a wafer during a cleaning process and the loading pins are configured to grip the wafer during a loading and unloading process. The cleaning module further comprises a sweep arm coupled to a nozzle mechanism configured to deliver liquids to the front and back side of the wafer.

A substrate processing apparatus includes a substrate stage that supports a substrate, a follower stage disposed on a same plane as the substrate stage, a first driving unit that moves the follower stage in parallel with a first direction, and a second driving unit that moves the substrate stage in parallel with the first direction. The second driving unit includes a voice magnet member disposed on the substrate stage, and a voice coil member disposed on the follower stage and spaced apart from the voice magnet member.

A substrate cleaning device includes a rotation mechanism that rotates the substrate, a first cleaning solution supply nozzle that discharges a cleaning solution to which ultrasonic vibration is applied to the surface of the substrate, and a swing mechanism that swings the first cleaning solution supply nozzle from a vicinity of a rotation center of the substrate toward an outer peripheral edge of the substrate in a range narrower than a half-surface of the substrate.

The invention relates to methods for restoring well productivity and to devices for cleaning downhole mesh filters without disassembling water-lifting equipment. Well productivity is restored and maintained using an acoustic method based on generating an ultrasonic fluid flow directed at a filter to clean the pre-filter zone of clogging deposits by moving an acoustic emitter along the filter. The acoustic emitter is placed within the lower portion of a casing string, downstream of a submersible downhole pump, and is connected to a means for delivering thereof into the filter zone. The acoustic emitter device comprises an ultrasonic transducer block, which is disposed between two supporting plates and is connected therewith by a rotary unit and an electric motor. The ultrasonic transducer block is configured in the form of two ultrasonic vibration systems located inside separate cylindrical housings positioned transverse to the axis of the filter, while the working surfaces of the waveguide tools of the vibration systems are oriented in the opposite directions toward the inside surface of the filter. The rotary unit and electric motor are connected to the ultrasonic transducer block and are mounted on the upper and lower supporting plates, respectively. The faces of the supporting plates are perpendicular to the filter axis and have bracing elements along the perimeter for anchoring inside the filter. The electric motor is used to facilitate rotary oscillations of the ultrasonic transducers within a 180-degree range (similar to a clock pendulum). In this case, the waveguide tools sweep the inner surface of the filter with an ultrasonic fluid flow along the circumference of the filter within a 360-degree range. Concurrently with this process, the delivery means causes the acoustic emitter to perform reciprocating movement along the filter axis, thus, providing a subsequent treatment of the entire inner surface of the downhole filter with a directed ultrasonic fluid flow, as well as a regular cleaning of the pre-filter zone of the well without disassembling the water-lifting string and submersible pump.

A substrate treatment apparatus includes: a first bath storing a cleaning solution and having a first opening formed in an upper surface thereof; and a first ultrasonic oscillator installed in the first bath and providing ultrasonic waves toward a surface of the cleaning solution exposed by the first opening to form a water film protruding from the surface of the cleaning solution, wherein a substrate is not immersed in the first bath, and a surface of the substrate is placed adjacent to the first opening and cleaned by the water film.

A method for cleaning an object includes steps of delivering a cleaning medium to a surface of the object, delivering ultrasonic waves to the object to atomize the cleaning medium, and applying a vacuum airflow to collect atomized cleaning medium.

A support device for a substrate and a substrate cleaning apparatus, the support device including a support on which the substrate is loadable; a rotor that rotates the support; and an oscillator that oscillates the substrate in a direction perpendicular to a surface of the substrate, wherein the substrate oscillates according to a natural frequency of the substrate or a natural frequency of particles on the substrate.

A system for cleaning an object may include a cleaning medium dispenser configured to deliver a cleaning medium to a surface of the object, wherein the cleaning medium dislodges and captures debris from the surface, an ultrasonic device configured to deliver ultrasonic waves to the object, wherein the ultrasonic waves generate ultrasonic vibrations in the object to atomize the cleaning medium from the surface and a vacuum configured to provide a vacuum airflow, wherein the vacuum airflow collects atomized cleaning medium and debris from the surface.