Provided is a cavitation processing apparatus for providing cavitation effects such as residual stress evenly on the surface and inner part of the component. The cavitation processing apparatus includes: a nozzle that ejects cavitation fluid to a workpiece; a direction changing member that changes a flow direction of the cavitation fluid that collided with the workpiece to be branched toward inside; a driving apparatus including a rotary shaft, the driving apparatus that rotates the workpiece together with the rotary shaft; and a support member supporting one end of the rotary shaft.

A substrate processing apparatus includes a substrate stage that supports a substrate, a follower stage disposed on a same plane as the substrate stage, a first driving unit that moves the follower stage in parallel with a first direction, and a second driving unit that moves the substrate stage in parallel with the first direction. The second driving unit includes a voice magnet member disposed on the substrate stage, and a voice coil member disposed on the follower stage and spaced apart from the voice magnet member.

An integrated liquidjet system capable of stripping, prepping and coating a part includes a cell defining an enclosure, a jig for holding the part inside the cell, an ultrasonic nozzle having an ultrasonic transducer for generating a pulsed liquidjet, a coating particle source for supplying coating particles to the nozzle, a pressurized liquid source for supplying the nozzle with a pressurized liquid to enable the nozzle to generate the pulsed liquidjet to sequentially strip, prep and coat the part, a high-voltage electrode and a ground electrode inside the nozzle for charging the coating particles, and a human-machine interface external to the cell for receiving user commands and for controlling the pulsed liquidjet exiting from the nozzle in response to the user commands.

A fall-proof apparatus for cleaning semiconductor devices is provided. The fall-proof apparatus comprises: a nozzle (102) connecting with a carrier (101); a megasonic/ultrasonic device (105) fixing on the carrier (101); and a sensor (104) detecting the distance between the megasonic/ultrasonic device (105) and the carrier (101) to determine whether the megasonic/ultrasonic device (105) is loose and going to fall. The megasonic/ultrasonic device works with the nozzle during a cleaning process. A chamber with the fall-proof apparatus is also provided.

An ultrasonic wave applying liquid is supplied to one principal surface of a substrate while a liquid film of a first liquid being formed on another principal surface of the substrate. The ultrasonic wave applying liquid is obtained by applying ultrasonic waves to a second liquid. Ultrasonic vibration is transmitted to the other principal surface and the liquid film, thereby ultrasonically cleaning the other principal surface. The first liquid has a higher cavitation intensity, which is a stress per unit area acting on the substrate by cavitation caused in the liquid when ultrasonic waves are transmitted to the liquid present on the principal surface of the substrate, than the second liquid.

An integrated liquidjet system capable of stripping, prepping and coating a part includes a cell defining an enclosure, a jig for holding the part inside the cell, an ultrasonic nozzle having an ultrasonic transducer for generating a pulsed liquidjet, a coating particle source for supplying coating particles to the nozzle, a pressurized liquid source for supplying the nozzle with a pressurized liquid to enable the nozzle to generate the pulsed liquidjet to sequentially strip, prep and coat the part, a high-voltage electrode and a ground electrode inside the nozzle for charging the coating particles, and a human-machine interface external to the cell for receiving user commands and for controlling the pulsed liquidjet exiting from the nozzle in response to the user commands.

An ultrasonic wave applying liquid is supplied to one principal surface of a substrate while a liquid film of a first liquid being formed on another principal surface of the substrate. The ultrasonic wave applying liquid is obtained by applying ultrasonic waves to a second liquid. Ultrasonic vibration is transmitted to the other principal surface and the liquid film, thereby ultrasonically cleaning the other principal surface. The first liquid has a higher cavitation intensity, which is a stress per unit area acting on the substrate by cavitation caused in the liquid when ultrasonic waves are transmitted to the liquid present on the principal surface of the substrate, than the second liquid.

An electrodischarge apparatus has a nozzle that includes a discharge chamber that has an inlet for receiving a liquid and an outlet. The apparatus has a first electrode extending into the discharge chamber that is electrically connected to one or more high-voltage capacitors. A second electrode is proximate to the first electrode to define a gap between the first and second electrodes. A switch causes the one or more capacitors to discharge across the gap between the electrodes to create a plasma bubble which expands to form a shockwave that escapes from the nozzle ahead of the plasma bubble.

An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

A method of stripping, prepping and coating a surface comprises first stripping the exiting coating from a surface, using continuous or pulsed fluid jet, followed by prepping the surface by the same fluid jet. The method also provides entraining particles into a fluid stream, if desired to generate a particle-entrained fluid stream that is directed at the surface to be stripped and prepped. The particles act as abrasive particles for prepping the surface to a prescribed surface roughness required for subsequent application of a coating to the surface. The method then entails coating the surface by electrically charging particles having the same chemical composition as the particles used to prep the surface. Finally, a charged-particle-entrained fluid stream is directed at high speed at the charged surface to coat the surface. The particles form both mechanical and electronic bonds with the surface.