A system and method for treating a portion of a food flow path in a food processor having a freezer chamber includes imparting a continuous flow of solution through a portion of the food flow path with sufficient flow rate, temperature and flow duration to impart at least one of (i) impart at least a 6 log reduction in inoculum count and (ii) extend the necessary time for manual cleaning of the portion of a food flow path exposed to the continuous flow of solution to at least 7 days.

Methods and systems for removing a gel from wellbore equipment. An example method includes introducing a cleaning fluid into the wellbore equipment comprising the gel disposed therein or thereon. The cleaning fluid includes a brine having a total dissolved solids concentration of between about 30K ppm to about 300K ppm. The method further includes contacting the gel with the cleaning fluid in the wellbore equipment, and removing the gel and the cleaning fluid from the wellbore equipment.

A cleaning method of a heat sterilization system includes: a step of causing a fluid formed of a cleaning liquid or a rinse liquid to flow through the heat sterilization system; a step of supplying hot water to a second-stage heating unit to heat the second-stage heating unit; and a step of measuring fluid temperatures of the fluid at the fluid inlet and the fluid outlet of the second-stage heating unit, and medium temperatures of the hot water at a medium inlet of the second-stage heating unit and a medium outlet of the second-stage heating unit. An overall heat transfer coefficient (U value) of a heating pipe of the second-stage heating unit is calculated based on the fluid temperatures at the fluid inlet and the fluid outlet of the second-stage heating unit and the medium temperatures at the medium inlet and the medium outlet of the second-stage heating unit.

A reusable apparatus, such as a medical instrument or tool, is decontaminated by applying at least one of pressure waves, shockwaves, and ultrasound waves in a sufficient dosage to remove contamination but without adversely affecting the ability to reuse the apparatus.

A surface cleaning apparatus includes an upright body and a base adapted for movement across a surface to be cleaned, a fluid delivery system, and a recovery system. The surface cleaning apparatus can be configured to clean multiple surfaces, including hard and soft surfaces, and for different cleaning modes, including wet cleaning, dry vacuum cleaning, and self-cleaning. Methods for self-cleaning a surface cleaning apparatus are also provided.

A reusable apparatus, such as a medical instrument or tool, is decontaminated by applying pressure waves with direct contact of the pressure wave applicator to the reusable apparatus in an open bath in a sufficient dosage to remove contamination but without adversely affecting the ability to reuse the apparatus.

A cleaning apparatus for cleaning of medical machine components of machines such as CPAP machines, nebulizers, PEEP machines, and the like is disclosed herein. The cleaning apparatus comprises a container body. A carousel is configured for placement within the container body. The carousel comprises a support structure. The carousel further comprises a helical ramp attached to the support structure and extending helically from an operative top end of the support structure to an operative bottom end of the support structure along a periphery of the support structure.

A method is provided for cleaning of a processing system comprising a wafer processing chamber and a pumping line in fluid connection with the wafer processing chamber. The method includes initiating cleaning of the wafer processing chamber by activating a chamber cleaning source and initiating cleaning of at least a portion of the pumping line by activating a foreline cleaning source coupled to the pumping line. The method also includes monitoring, at a downstream endpoint detector coupled to the pumping line, a level of a signature substance. The method further includes determining, by the downstream endpoint detector, at least one of a first endpoint of the cleaning of the wafer processing chamber or a second endpoint of the cleaning of the pumping line based on the monitoring.

Passive brushes formed from plastics, rubbers or other suitable materials may be inserted into openings of aerial vehicles or other machines and subjected to excitation at natural frequencies of vibration of the passive brushes. Where surfaces of the passive brushes are in contact with surfaces of components that are fouled by dust, dirt, grime, or other substances, the vibration of the passive brushes resulting from the excitation causes the dust, dirt, grime or other substances to be released from such surfaces. The passive brushes may have dimensions or shapes that are selected to correspond to internal dimensions of the aerial vehicles or specific components, and may be formed by 3D printing, nanolithography, or in any other suitable manner.

There is provided a substrate processing apparatus which includes: an exhaust pipe configured to selectively discharge an exhaust gas generated by a substrate process to a first pipe or a second pipe; a liquid supply part configured to supply a cleaning liquid to the exhaust pipe; a discharge destination setting part configured to set a discharge destination of the exhaust gas to the first pipe or the second pipe by rotating the exhaust pipe; and a controller configured to control the discharge destination setting part to rotate the exhaust pipe. The controller is further configured to control the liquid supply part to supply the cleaning liquid to the rotating exhaust pipe.