A method for treating waste printed circuit board includes carbonizing waste printed circuit board together with a calcium compound at 400° C. to 600° C. in a non-oxidizing atmosphere to fix a halogen contained in the board as calcium halide and to melt a solder of the board to allow mounted parts to be easily separated from the board, performing crushing after the carbonizing, and sieving crushed materials into fine particles of less than 0.5 mm containing the calcium compounds, medium particles containing the mounted parts, and coarse particles containing board pieces such that the crushed materials are sorted into the calcium compounds, the mounted parts, and the board pieces.

A system for the physical-mechanical recovery and refining of non-ferrous metals from electronic scrap, with means for the separation of the interest metals from the polymeric and resin support frames, which does not require the addition of solvents or temperature rise, for the disintegration and separation of materials, so that no toxic waste is produced for the environment.

An automated method for sorting circuit boards for recycling is described. The method includes scanning a layout design for a circuit board and comparing the scanned layout design with a database of circuit board layout designs. Each of the layout designs being associated with a respective precious metal content value. A match between the scanned layout design and one of the circuit board layout designs in the database is identified. The method then assigns a precious metal designation to the scanned circuit board based on the identified match. The precious metal designation corresponds to the precious metal content value associated with the matched circuit board layout from the database. The method also includes sorting the scanned circuit board into a group associated with the assigned precious metal designation.

A system for processing compounds having constituent materials of different mechanical characteristics to extract their constituent materials. The system includes a kinetic impactor configured to impact, via a shockwave, compound particles of a preimpact mixture, thereby creating a postimpact mixture including (i) subparticles of 1st-constituent-material and (ii) reduced-compound particles including a 2nd constituent material.

A system for the physical-mechanical recovery and refining of non-ferrous metals from electronic scrap, with means for the separation of the interest metals from the polymeric and resin support frames, which does not require the addition of solvents or temperature rise, for the disintegration and separation of materials, so that no toxic waste is produced for the environment.

A method of delamination of a printed circuit board includes comminuting the printed circuit board, and soaking the comminuted PCB in a solvent system comprising at least two solvents. Once soaking has been completed the method includes separating solids, and electrostatically separating different specific solids from the separated solids.

A system for processing compounds having constituent materials of different mechanical characteristics to extract their constituent materials. The system includes a kinetic impactor configured to impact, via a shockwave, compound particles of a preimpact mixture, thereby creating a postimpact mixture including (i) subparticles of 1.sup.st-constituent-material and (ii) reduced-compound particles including a 2nd constituent material.

A green resource-based method of thermal mass synergy in waste Integrated circuit board mainly includes carbonization cracking system, crushing and separation system, gasification cracking system and heat value utilization and comprehensive recovery system. Compared with existing techniques, carbonization cracking system can realize the dry distillation cracking of organic matter in waste integrated circuit board which converts carbon, hydrogen and other elements into fuel carbonized cracking gas and cracking oil, the heat from the combustion of the carbonization cracking gas of the invention provides the energy needed for the carbonization cracking to realize self-heating carbonization cracking. Carbonization cracking products are cracked and separated to solve the problems such as hard to break and organic coating metal caused by direct crushing and separation of traditional circuit boards which Improves crushing and separation effect; gasification cracking system achieves the comprehensive utilization of carbon, the gasified cracking gas can be used as a heat source for subsequent valuable metal recovery to further improve the utilization rate of calorific value. The invention has the characteristics of: high heat value utilization rate, low energy consumption, high metal recovery rate, short process recovery of valuable metal and no pollution of flue gas.

A system for processing compounds having constituent materials of different mechanical characteristics to extract their constituent materials. The system includes a kinetic impactor configured to impact, via a shockwave, compound particles of a preimpact mixture, thereby creating a postimpact mixture including (i) subparticles of 1.sup.st-constituent-material and (ii) reduced-compound particles including a 2nd constituent material.

Provided is a method for processing electronic and electrical device component scrap, which can improve an efficiency of sorting of raw materials fed to the smelting step from electronic and electrical device component scrap, and reduce losses of valuable metals. A method for processing electronic and electrical device component scrap which includes sorting electronic and electrical device component scrap by wind powder sorting to remove plate-shaped materials containing valuable metals included in the electronic and electrical device component scrap, and then sorting the resulting sorted objects by magnetic sorting.