Patent classifications
B21C3/025
Single-crystal diamond material, single-crystal diamond chip, and perforated tool
In a single-crystal diamond material, a concentration of non-substitutional nitrogen atoms is not more than 200 ppm, a concentration of substitutional nitrogen atoms is lower than the concentration of the non-substitutional nitrogen atoms, and the single-crystal diamond material has a crystal growth main surface having an off angle of not more than 20. A perforated tool includes a single-crystal diamond die, wherein in the single-crystal diamond die, a concentration of non-substitutional nitrogen atoms is not more than 200 ppm, a concentration of substitutional nitrogen atoms is lower than the concentration of the non-substitutional nitrogen atoms, and the single-crystal diamond die has a low-index plane represented by a Miller index of not less than 5 and not more than 5 in an integer, a perpendicular line of the low-index plane having an off angle of not more than 20 relative to an orientation of a hole for wire drawing.
Polycrystalline diamond compacts
Embodiments of the invention relate to polycrystalline diamond (PCD) exhibiting enhanced diamond-to-diamond bonding. In an embodiment, PCD includes a plurality of diamond grains defining a plurality of interstitial regions. A metal-solvent catalyst occupies at least a portion of the plurality of interstitial regions. The plurality of diamond grains and the metal-solvent catalyst collectively exhibit a coercivity of about 115 Oersteds (Oe) or more and a specific magnetic saturation of about 15 Gauss.Math.cm.sup.3/grams (G.Math.cm.sup.3/g) or less. Other embodiments are directed to polycrystalline diamond compacts (PDCs) employing such PCD, methods of forming PCD and PDCs, and various applications for such PCD and PDCs in rotary drill bits, bearing apparatuses, and wire-drawing dies.
Single-crystal diamond, tool using same, and method of producing single-crystal diamond
A single-crystal diamond includes a pair of main surfaces facing each other, an impurity concentration being changed along a first direction in each of the main surfaces.
SHAPED DIAMOND DIE
A shaped diamond die includes a polycrystalline diamond, the polycrystalline diamond having a machining hole, wherein a length D of a side of the machining hole is 100 m or less, a corner R is 20 m or less, the shaped diamond die includes a bearing portion, a surface roughness Sa of the bearing portion is 0.05 m or less, and an average grain size of the polycrystalline diamond is 500 nm or less.
Composite sintered body
A composite sintered body includes a diamond phase and a non-diamond carbon phase. A non-diamond carbon phase occupancy rate is higher than 0% and not higher than 30%. The non-diamond carbon phase occupancy rate is a percentage of an area of the non-diamond carbon phase to a total area of one arbitrarily specified cross section of the composite sintered body. As a result, there is provided a high wear-resistant, high local wear-resistant and high chipping-resistant diamond-containing composite sintered body suitably used as a material for a wear-resistant tool, a cutting tool and the like.
SINGLE-CRYSTAL DIAMOND MATERIAL, SINGLE-CRYSTAL DIAMOND CHIP, AND PERFORATED TOOL
In a single-crystal diamond material, a concentration of non-substitutional nitrogen atoms is not more than 200 ppm, a concentration of substitutional nitrogen atoms is lower than the concentration of the non-substitutional nitrogen atoms, and the single-crystal diamond material has a crystal growth main surface having an off angle of not more than 20. A perforated tool includes a single-crystal diamond die, wherein in the single-crystal diamond die, a concentration of non-substitutional nitrogen atoms is not more than 200 ppm, a concentration of substitutional nitrogen atoms is lower than the concentration of the non-substitutional nitrogen atoms, and the single-crystal diamond die has a low-index plane represented by a Miller index of not less than 5 and not more than 5 in an integer, a perpendicular line of the low-index plane having an off angle of not more than 20 relative to an orientation of a hole for wire drawing.
Single-crystal diamond material, single-crystal diamond chip, and perforated tool
In a single-crystal diamond material, a concentration of non-substitutional nitrogen atoms is not more than 200 ppm, a concentration of substitutional nitrogen atoms is lower than the concentration of the non-substitutional nitrogen atoms, and the single-crystal diamond material has a crystal growth main surface having an off angle of not more than 20. A perforated tool includes a single-crystal diamond die, wherein in the single-crystal diamond die, a concentration of non-substitutional nitrogen atoms is not more than 200 ppm, a concentration of substitutional nitrogen atoms is lower than the concentration of the non-substitutional nitrogen atoms, and the single-crystal diamond die has a low-index plane represented by a Miller index of not less than 5 and not more than 5 in an integer, a perpendicular line of the low-index plane having an off angle of not more than 20 relative to an orientation of a hole for wire drawing.
WEAR-RESISTANT TOOL
A wear-resistant tool includes composite polycrystalline diamond as a core, the composite polycrystalline diamond being composed of polycrystalline diamond in which particulate diamond is directly bonded and non diamond carbon. The polycrystalline diamond in the composite polycrystalline diamond is three-dimensionally continuous in composite polycrystal and primary particles have an average particle size from 10 to 500 nm.
SAW WIRE AND CUTTING APPARATUS
A saw wire and various methods of use and manufacture are provided. The saw wire includes a metal wire containing at least one of tungsten and a tungsten alloy. A surface roughness Ra of the metal wire is at most 0.15 m. A tensile strength of the metal wire is at least 3500 MPa. A diameter of the metal wire is at most 60 m.
SAW WIRE AND CUTTING APPARATUS
A saw wire and various methods of use and manufacture are provided. The saw wire includes a metal wire containing one of tungsten and a tungsten alloy. A surface roughness Ra of the metal wire is at most 0.15 m. A diameter of the metal wire is at most 60 m.