Patent classifications
B21D28/26
PUNCHER
There is provided a puncher that punches a flat plate-shaped workpiece with a punch and a die facing each other, the puncher including: at least four sensors that are provided on a same plane orthogonal to a punching direction and measure loads in three-axis directions; a drive table for driving the die that is loaded and the at least four sensors in two-axis directions orthogonal to the punching direction and a rotation direction around the punching direction; and a controller.
PUNCHER
There is provided a puncher that punches a flat plate-shaped workpiece with a punch and a die facing each other, the puncher including: at least four sensors that are provided on a same plane orthogonal to a punching direction and measure loads in three-axis directions; a drive table for driving the die that is loaded and the at least four sensors in two-axis directions orthogonal to the punching direction and a rotation direction around the punching direction; and a controller.
Systems and methods for trimming powered cards and devices
Cards may be manufactured in a lamination process, such that interior portions of the cards may be visible. Punch alignment queues within the card may be scanned by a punch machine and rendered onto a display of the punch machine. The punch alignment queues may be aligned with targets also rendered onto the display so that the card may be properly aligned within a punch machine to prepare the card for a trimming process. A Venturi system may temporarily adhere the card to a punch of the punch machine while the punch is engaged with a die to trim the card. The cutting surface of the die may be offset with respect to a surface of the punch, so that the card may be sequentially trimmed along a perimeter of the card.
Systems and methods for trimming powered cards and devices
Cards may be manufactured in a lamination process, such that interior portions of the cards may be visible. Punch alignment queues within the card may be scanned by a punch machine and rendered onto a display of the punch machine. The punch alignment queues may be aligned with targets also rendered onto the display so that the card may be properly aligned within a punch machine to prepare the card for a trimming process. A Venturi system may temporarily adhere the card to a punch of the punch machine while the punch is engaged with a die to trim the card. The cutting surface of the die may be offset with respect to a surface of the punch, so that the card may be sequentially trimmed along a perimeter of the card.
MANUFACTURING METHOD AND MANUFACTURING DEVICE FOR LINK PART
This manufacturing method for a link part is a method of manufacturing a link part having one end portion having a connecting hole and provided on one side in one direction from an intermediate part which is long in the one direction and has a first side wall and a second side wall each having a pilot hole at least at one end portion and disposed to face each other and a connecting wall connecting one side edge of the first side wall and one side edge of the second side wall, and the other end portion provided on the other side therefrom in the one direction. The method includes a reinforcing process of inserting a metal core into the pilot hole, and an O-bending process of O-bending the first side wall and the second side wall so that the other side edge of the first side wall and the other side edge of the second side wall are brought into contact with each other after the reinforcing process.
METHOD FOR OFFSET MEASURE COMPENSATION
A method for recognition and compensation of an offset measure between stamping coordinates of a stamping device and laser coordinates of a laser device in a combined stamping-laser machine for processing a plate-shaped workpiece, particularly a metal sheet, includes introducing a structure into the plate-shaped workpiece by respectively using the stamping device or the laser device. A measurement variable of the introduced structure is determined respectively by the laser device or the stamping device. The measurement variable is compared with an expected variable, and a deviation of the measurement variable from the expected variable corresponds to an offset measure. The offset measure is balanced with the coordinates of the laser device in the laser coordinate system or with the coordinates of the stamping device in the stamping coordinate system in order to compensate for the offset measure between the stamping coordinates and the laser coordinates.
METHOD FOR OFFSET MEASURE COMPENSATION
A method for recognition and compensation of an offset measure between stamping coordinates of a stamping device and laser coordinates of a laser device in a combined stamping-laser machine for processing a plate-shaped workpiece, particularly a metal sheet, includes introducing a structure into the plate-shaped workpiece by respectively using the stamping device or the laser device. A measurement variable of the introduced structure is determined respectively by the laser device or the stamping device. The measurement variable is compared with an expected variable, and a deviation of the measurement variable from the expected variable corresponds to an offset measure. The offset measure is balanced with the coordinates of the laser device in the laser coordinate system or with the coordinates of the stamping device in the stamping coordinate system in order to compensate for the offset measure between the stamping coordinates and the laser coordinates.
METHOD FOR PREPARING MODULAR PLANAR INTERCONNECT PLATE
A method for preparing a modular planar interconnect plate includes steps of a) providing a metal blank sheet having a main region and two first lateral regions, b) forming two openings respectively in the first lateral regions, and c) stamping to form protrusions and depressions at the main region on lower and upper surfaces of the metal blank sheet. In the stamping step, each of two lower surrounding protrusions and two upper surrounding depressions is formed to surround a corresponding one of the openings, and each of an upper surrounding protrusion and a lower surrounding depression is formed to surround the corresponding ones of the protrusions and depressions formed at the main region and the first lateral regions.
METHOD FOR PREPARING MODULAR PLANAR INTERCONNECT PLATE
A method for preparing a modular planar interconnect plate includes steps of a) providing a metal blank sheet having a main region and two first lateral regions, b) forming two openings respectively in the first lateral regions, and c) stamping to form protrusions and depressions at the main region on lower and upper surfaces of the metal blank sheet. In the stamping step, each of two lower surrounding protrusions and two upper surrounding depressions is formed to surround a corresponding one of the openings, and each of an upper surrounding protrusion and a lower surrounding depression is formed to surround the corresponding ones of the protrusions and depressions formed at the main region and the first lateral regions.
Method for operating a fine blanking system
A method for operating a fine blanking system comprises at least one fine blanking press having a first press unit, a second press unit, and one or more sensors. The method comprises obtaining parameter data from the one or more sensors for at least one of the first press unit, the second press unit, and another component of the fine blanking system during a first fine blanking process step. Adjustments are determined for control parameters of at least one of the first press unit, the second press unit, and the other component based on the parameter data. The adjustments are applied to the control parameters in a second fine blanking process step subsequent to the first fine blanking process step.