B21D43/025

Production method for integrated circuits

An integrated circuit production method. In some examples, the method includes receiving a leadframe comprising a plurality of in-production ICs in a forming machine, singulating the plurality of in-production ICs, forming leads of at least some of the plurality of in-production ICs to comply with dimensions and tolerances corresponding to an intended form factor of the plurality of in-production ICs, and separating, automatically by the forming machine, formed ICs from unformed ICs after the forming.

COMPONENT FORMING MACHINE WITH JAMMED COMPONENT MITIGATION

A component forming machine with jammed component mitigation. In some examples, the component forming machine can include a platform configured to receive a lower die that supports a plurality of components for forming and includes a void through which at least some of the plurality of components pass subsequent to the forming, a die press positioned above the lower die and configured to lower an upper die to exert downward pressure on the plurality of components to form unformed components and formed components, and a separation system. In some examples, the separation system is configured to interact with the lower die to permit the formed components to fall into the void and prevent the unformed components from falling into the void.

METHOD AND SYSTEM FOR GRIPPING AND MOVING OBJECTS

A method for gripping and moving worked pieces obtained by cutting and/or punching at least one sheet metal and arranged on a work surface includes positioning a gripping assembly at a piece to be picked up and at the same time positioning a sensor device by moving it along a first direction in a first position in which the sensor device is aligned with a projection of a peripheral edge of the piece along a second direction orthogonal to first direction, and grasping and lifting the piece at a defined height with respect to the work surface by the gripping assembly. The method also includes activating the sensor device and moving it to a second position to scan a settled portion of work surface that is below the lifted piece in order to detect a gap or a residual connection between lifted piece and the sheet metal.