B21D53/022

Device for manufacturing fins and method for manufacturing fins

A fin manufacturing apparatus includes: a progressive pressing device that forms, by forming in a metal plate having thermal conductivity a plurality of openings for tube-insertion and a plurality of slits while leaving uncut portions, strips that each have openings along a longitudinal direction of the strip and are partially coupled to each other in a width direction; an inter-row cutting device that separates, by cutting the portions via which the strips are coupled to each other, the strips such that each strip has a width of the fin; a cutoff device that cuts the separated strips to a predetermined length; and a guiding device between the inter-row cutting device and an inter-row slit device that guides and supplies, to the inter-row cutting device, the strips that are partially coupled to each other in the width direction, are arranged in the width direction, and are conveyed in the longitudinal direction.

Thermal component, method for producing same, and heat exchanger

In a method for producing a thermal component (1, 1′) a pipe (2, 2′,2″) having a fluid channel (3, 3′, 3″) with an inner profile (4, 4′) is provided, and a swirler (6, 6′) having an outer profile (5, 5′) corresponding to the inner profile (4, 4′) is inserted into the fluid channel (3, 3′, 3″). A thermal component (1, 1′) manufactured in this manner includes a pipe (2, 2′, 2″) having a fluid channel (3, 3′, 3″), and a swirler. The fluid channel (3, 3′, 3″) of the pipe (2, 2′, 2″) includes an inner profile (4, 4′) corresponding to an outer profile (5, 5′) of the swirler (6, 6′), and the swirler is disposed in the fluid channel (3, 3′, 3″).

Fixture facilitating heat sink fabrication

A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.

Method of manufacturing heat sink and heat sink
11389911 · 2022-07-19 · ·

A method of manufacturing a heat sink includes a rib portion forming step of forming a rib portion on a substrate having a flat plate shape in such a manner that a first groove and a second groove are formed on a front surface side of the substrate by plastically deforming the substrate by a press thus forming the rib portion in a region sandwiched between the first groove and the second groove. The method further includes a back surface protruding ridge portion cutting removal step of removing protruding ridge portions formed on a back surface side of the substrate by cutting. The method further includes a fin forming step of forming a plurality of fins by working the rib portion; and a heat sink separating step of obtaining the heat sink by separating a portion within a predetermined range which includes the fins from the substrate.

METHOD FOR PRODUCING A HEAT EXCHANGER
20220250136 · 2022-08-11 ·

The invention relates to a method for producing a heat exchanger (1) having tubes (2), which are each received at the longitudinal end side in an associated header (3), wherein the tubes (2) and the headers (3) are formed out of aluminium and are soldered to one another and, in a state soldered to one another, form a coolant-conducting channel structure (4).

Here it is substantial for the invention that the heat exchanger (1), following the soldering of the tubes (2) to the headers (3), is cold-formed and the strength thereby increased.

By way of this, the weight and the costs can be reduced and the performance and the strength increased.

HEAT EXCHANGER FIN AND MANUFACTURING METHOD OF THE SAME
20220290928 · 2022-09-15 ·

A method includes providing a first metal sheet and a second metal sheet, printing patterns of a plurality of obstructers, a plurality of channels, an evaporator channel, a condenser channel, and a connecting channel on the first metal sheet, bonding the first metal sheet and the second metal sheet to each other, separating the first metal sheet and the second metal sheet from each other to form the plurality of channels, the evaporator channel, the condenser channel, and the connecting channel by introducing a fluid between the first metal sheet and the second metal sheet, introducing working fluid in the plurality of channels, and sealing the first metal sheet and the second metal sheet.

Burst resistant thin wall heat sink

An method for forming a cooling apparatus for cooling an electronic component. The apparatus has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The planar top member has a plurality of stamped indent formations at a plurality of locations, each indent formation providing a contact surface such that the planar top member is affixed to the bottom member by braze or solder at each contact surface. Alternatively, the planar bottom member also has a plurality of stamped indent formations in alignment with indent formations of the top member. The planar top member is affixed to the bottom member by brazing or soldering each respective contact surface of an indent formation of the planar top member to an opposing contact surface of a corresponding indent formation of the parallel planar bottom member.

SELF-CLEANING HEATSINK FOR ELECTRONIC COMPONENTS
20210257271 · 2021-08-19 ·

Systems for cooling semiconductor devices that can comprise a heatsink and a cleaning element for the heatsink. The heatsink can have fins spaced apart from each other by channels. The cleaning element can have a base and one or more arms extending from the base. The cleaning element can be positioned with respect to the heatsink such that each arm is aligned with a corresponding channel between the fins, and the arms are moveable between a flow configuration in which the arms are in the channels and a cleaning configuration in which the arms are outside of the channels.

Aircraft Heat Exchanger Finned Plate Manufacture

A method for forming a heat exchanger plate includes: securing a wave form metallic sheet to a heat exchanger plate substrate, the substrate comprising a first face and a second face opposite the first face, the securing of the wave form metallic sheet being to the first face; and removing peaks of the sheet.

Heat exchanger with turbulating inserts

A heat exchanger has a turbulating insert arranged between a pair of plates. The turbulating insert is permeable to fluid flow in both a high-pressure-drop direction and a low-pressure drop direction. One portion of the turbulating insert has the high-pressure-drop direction oriented at a non-zero angle to the high-pressure-drop direction of another portion. A method of making the heat exchanger includes forming a turbulating insert, removing a portion of the turbulating insert to create a cavity within the turbulating insert, placing the remaining turbulating insert into a stamped first plate, and placing the removed portion of the turbulating insert into the cavity at a non-zero angle of rotation relative to the remaining turbulating insert.