[Purpose] To provide is a method capable of producing a heat-dissipating unit easily and at low cost.

[Solution] The method of producing a heat-dissipating unit 12 includes: inserting pins 17 punched out of a second plate member 22 for pins into a plurality of through-holes 16 formed in a first plate member 20 for a substrate. In the first plate member 20, a plurality of substrate forming portions 25 is provided side by side in the longitudinal direction of the first plate member 20. In the second plate member 22, a plurality of pin punch-out portions 26 is provided side by side in the longitudinal direction of the second plate member 22. The method includes: a step A of forming the through-holes 16 in the substrate forming portion 25 of the first plate member 20; a step B of subjecting the pin punch-out portion 26 of the second plate member 22 to a half-punch out process to form half-punched-out pin forming portions 27 protruding from one surface side of the second plate member 22; a step C of forming the pins 17 by punching out the pin forming portions 27 from the second plate member 22 and simultaneously inserting the pins 17 into the through-holes 16 in the first plate member 20; and a step D of forming a substrate by cutting the substrate forming portion 25 with the pins 17 inserted in the through-holes 16 from the first plate member 20.

A heat exchanger may be manufactured using an apparatus which includes a rotating body configured to be disposed at one side of heat exchange fins having an insertion groove having one side formed to be depressed and placed to be downwardly directed to be rotatable. An inner side of the insertion groove of transferred heat exchange fins are seated on the rotating body. The apparatus also include a rotating blade configured to be connected to the rotating body to be rotatable together with the rotating body. The rotating blade supports the other side of the heat exchange fins to prevent the heat exchange fins from being deviated from the rotating body.

A plate fin heat exchanger 1 includes a corrugated fin 3 and tube plates 2. An intermediate portion 33 of the corrugated fin between crest and trough portion 31 and 32 thereof has a plurality of protruding ribs 34 protruding beyond a surface of the corrugated fin and arranged in a first direction. Surfaces of the crest and trough portions being in contact with the tube plates are configured as contact surfaces 310, 320 with no protruding rib. Gently sloping portions 341 are provided between the protruding ribs and the contact surfaces of the crest and trough portions to gradually protrude from the surface of the corrugated fin with increasing distance from the contact surfaces, and are continuous with the protruding ribs.

An method for forming a cooling apparatus for cooling an electronic component. The apparatus has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The planar top member has a plurality of stamped indent formations at a plurality of locations, each indent formation providing a contact surface such that the planar top member is affixed to the bottom member by braze or solder at each contact surface. Alternatively, the planar bottom member also has a plurality of stamped indent formations in alignment with indent formations of the top member. The planar top member is affixed to the bottom member by brazing or soldering each respective contact surface of an indent formation of the planar top member to an opposing contact surface of a corresponding indent formation of the parallel planar bottom member.

A manufacturing apparatus for heat dissipation fins can stably operate a stacker apparatus when stacking and collecting heat dissipation fins. Drop guide blades are provided above a holding apparatus for the heat dissipation fins disposed downstream of a cutoff apparatus that cuts a heat dissipation fin molding formed by a press apparatus into heat dissipation fins. When a stacker apparatus receives a heat dissipation fin from the holding apparatus, the drop guide blades approach the stacker apparatus and the heat dissipation fin is stacked and collected in the stacker apparatus by dropping to the stacker apparatus while being guided by the drop guide blades. After collecting the heat dissipation fins, only lowering operations of the stacker apparatus are performed.

A manufacturing apparatus for heat dissipation fins can stably operate a stacker apparatus when stacking and collecting heat dissipation fins. Drop guide blades are provided above a holding apparatus for the heat dissipation fins disposed downstream of a cutoff apparatus that cuts a heat dissipation fin molding formed by a press apparatus into heat dissipation fins. When a stacker apparatus receives a heat dissipation fin from the holding apparatus, the drop guide blades approach the stacker apparatus and the heat dissipation fin is stacked and collected in the stacker apparatus by dropping to the stacker apparatus while being guided by the drop guide blades. After collecting the heat dissipation fins, only lowering operations of the stacker apparatus are performed.

An apparatus for cooling an electronic component has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The planar top member has a plurality of stamped indent formations at a plurality of locations, each indent formation providing a contact surface such that the planar top member is affixed to the bottom member by braze or solder at each contact surface. Alternatively, the planar bottom member also has a plurality of stamped indent formations in alignment with indent formations of the top member. The planar top member is affixed to the bottom member by brazing or soldering each respective contact surface of an indent formation of the planar top member to an opposing contact surface of a corresponding indent formation of the parallel planar bottom member.

An offset fin manufacturing method for manufacturing offset fins includes a feeding step of feeding a strip plate, a connection forming step of forming a connection in the strip plate, and an offset fin forming step of bending a planar plate portion located between corresponding two of the connections. In the offset fin forming step, each offset fin is formed such that two of top surface portions, which are located at an upstream end and a downstream end, respectively, of the offset fin in a feed direction of the strip plate, are respectively and directly connected to corresponding two of the connections. One of two of lateral surface portions joined to a corresponding one of the two of the top surface portions is not offset, and thereby a length of the corresponding one of the two of the top surface portions measured along a wave continuation direction is increased.

Systems for cooling semiconductor devices that can comprise a heatsink and a cleaning element for the heatsink. The heatsink can have fins spaced apart from each other by channels. The cleaning element can have a base and one or more arms extending from the base. The cleaning element can be positioned with respect to the heatsink such that each arm is aligned with a corresponding channel between the fins, and the arms are moveable between a flow configuration in which the arms are in the channels and a cleaning configuration in which the arms are outside of the channels.

A heat exchanger comprises a seamless body, and the seamless body may include a substantially cylindrical configuration defining a radial direction, a circumferential direction, a longitudinal axis, a first cylindrical wall and a plurality of fins. Each fin may extend at least partially in the radial direction and helically along the longitudinal axis. Also, each fin may be at least partially hollow defining an internal flow passage, and each fin of the plurality of fins may be at least partially spaced away from an adjacent fin, defining an external flow passage.