Patent classifications
B22F1/052
ALKALINE CELL WITH IMPROVED RELIABILITY AND DISCHARGE PERFORMANCE
A negative electrode for an alkaline battery cell which includes zinc-based particles, wherein less than 20% of the zinc-based particles, by weight relative to the total zinc in the electrode, have a particle size of greater than about 150 micrometers, is provided. An alkaline electrochemical cell that includes the negative electrode and a method for reducing the gassing of the electrochemical cell is also provided.
Electrically conductive paste and sintered body
An object of the present invention is to provide an electrically conductive paste and a sintered body thereof having a low electric resistance value and excellent electrical conductivity when made into a sintered body. An electrically conductive paste comprising: a flake-like silver powder having a median diameter D50 of 15 μm or less; a silver powder having a median diameter D50 of 25 μm or more; and a solvent, wherein the content of the flake-like silver powder is 15 to 70 parts by mass and the content of the silver powder having a median diameter D50 of 25 μm or more is 30 to 85 parts by mass based on 100 parts by mass in total of the flake-like silver powder and the silver powder having a median diameter D50 of 25 μm or more.
Electrically conductive paste and sintered body
An object of the present invention is to provide an electrically conductive paste and a sintered body thereof having a low electric resistance value and excellent electrical conductivity when made into a sintered body. An electrically conductive paste comprising: a flake-like silver powder having a median diameter D50 of 15 μm or less; a silver powder having a median diameter D50 of 25 μm or more; and a solvent, wherein the content of the flake-like silver powder is 15 to 70 parts by mass and the content of the silver powder having a median diameter D50 of 25 μm or more is 30 to 85 parts by mass based on 100 parts by mass in total of the flake-like silver powder and the silver powder having a median diameter D50 of 25 μm or more.
Electrically conductive paste and sintered body
An object of the present invention is to provide an electrically conductive paste and a sintered body thereof having a low electric resistance value and excellent electrical conductivity when made into a sintered body. An electrically conductive paste comprising: a flake-like silver powder having a median diameter D50 of 15 μm or less; a silver powder having a median diameter D50 of 25 μm or more; and a solvent, wherein the content of the flake-like silver powder is 15 to 70 parts by mass and the content of the silver powder having a median diameter D50 of 25 μm or more is 30 to 85 parts by mass based on 100 parts by mass in total of the flake-like silver powder and the silver powder having a median diameter D50 of 25 μm or more.
PASTE COMPOSITION AND SEMICONDUCTOR DEVICE
This paste composition includes silver particles (A), a thermosetting resin (B), a curing agent (C), and a solvent (D). A shrinkage rate after curing of the paste composition is 15% or less.
BONDING SHEET AND BONDED STRUCTURE
A bonding sheet includes a copper foil and sinterable bonding films formed on both faces of the copper foil. The bonding films each contain copper particles and a solid reducing agent. The bonding sheet is used to bond to a target object to be bonded having at least one metal selected from gold, silver, copper, and nickel on a surface thereof. A bonded structure includes: a bonded object having at least one metal selected from gold, silver, copper, and nickel on a surface thereof; a copper foil; and a bonding layer including a sintered structure of copper particles; and the bonded object and the copper foil are electrically connected to each other via the bonding layer.
BONDING SHEET AND BONDED STRUCTURE
A bonding sheet includes a copper foil and sinterable bonding films formed on both faces of the copper foil. The bonding films each contain copper particles and a solid reducing agent. The bonding sheet is used to bond to a target object to be bonded having at least one metal selected from gold, silver, copper, and nickel on a surface thereof. A bonded structure includes: a bonded object having at least one metal selected from gold, silver, copper, and nickel on a surface thereof; a copper foil; and a bonding layer including a sintered structure of copper particles; and the bonded object and the copper foil are electrically connected to each other via the bonding layer.
Dust core and inductor element
A dust core includes large particles having an average particle size of 8-15 μm, medium particles having an average particle size of 1-5 μm, and small particles having an average particle size of 300-900 nm when a cross section thereof is observed. An area ratio occupied by the large particles is 50% to 90%, an area ratio occupied by the medium particles is 0% to 30%, and an area ratio occupied by the small particles is 5% to 30%, when a total area ratio occupied by the large particles, the medium particles and the small particles is 100% in the cross section. Vickers hardness (Hv) of the large particles, the medium particles and the small particles is 150-600 respectively. The small particles are alloy powder containing Fe and at least Si or N. The dust core may be included in an inductor element.
Dust core and inductor element
A dust core includes large particles having an average particle size of 8-15 μm, medium particles having an average particle size of 1-5 μm, and small particles having an average particle size of 300-900 nm when a cross section thereof is observed. An area ratio occupied by the large particles is 50% to 90%, an area ratio occupied by the medium particles is 0% to 30%, and an area ratio occupied by the small particles is 5% to 30%, when a total area ratio occupied by the large particles, the medium particles and the small particles is 100% in the cross section. Vickers hardness (Hv) of the large particles, the medium particles and the small particles is 150-600 respectively. The small particles are alloy powder containing Fe and at least Si or N. The dust core may be included in an inductor element.
SILVER PASTE, AND METHOD OF PRODUCING JOINED ARTICLE
This silver paste includes a silver powder and a solvent, in which the silver powder includes first silver particles having a particle size of 100 nm or more and less than 500 nm, second silver particles having a particle size of 50 nm or more and less than 100 nm, and third silver particles having a particle size of 1000 nm or more and less than 10000 nm, and the content of the first silver particles is 12% by volume or more and 90% by volume or less, the content of the second silver particles is 1% by volume or more and 38% by volume or less, and the content of the third silver particles is 5% by volume or more and 80% by volume or less, regarding a total amount of the silver powder as 100% by volume.