A production method for a refined product of a metal nanoparticle-containing composition, including causing a metal nanoparticle-containing composition to pass in a liquid state from one side to the other side of a porous polyimide and/or polyamide-imide membrane having interconnection pores with differential pressure, and a production method for a refined product of a metal nanoparticle dispersion liquid, including causing a metal nanoparticle dispersion liquid to pass from one side to the other side of a porous polyimide and/or polyamide-imide membrane having interconnection pores with differential pressure.

A production method for a refined product of a metal nanoparticle-containing composition, including causing a metal nanoparticle-containing composition to pass in a liquid state from one side to the other side of a porous polyimide and/or polyamide-imide membrane having interconnection pores with differential pressure, and a production method for a refined product of a metal nanoparticle dispersion liquid, including causing a metal nanoparticle dispersion liquid to pass from one side to the other side of a porous polyimide and/or polyamide-imide membrane having interconnection pores with differential pressure.

The present invention pertains to a process for preparing particles of rare earth sulfide comprising the steps of:—preparing a reaction mixture comprising at least one compound comprising at least one rare earth element (A) and at least one alkali metal sulfide (B),—submitting said reaction mixture to a mechanical stress so as to cause a chemical reaction that produces the particles of rare earth sulfide.

The present invention pertains to a process for preparing particles of rare earth sulfide comprising the steps of:—preparing a reaction mixture comprising at least one compound comprising at least one rare earth element (A) and at least one alkali metal sulfide (B),—submitting said reaction mixture to a mechanical stress so as to cause a chemical reaction that produces the particles of rare earth sulfide.

To provide novel low-temperature sinterable copper particles that can be sintered even at a low temperature of, for example, around 100° C. or less, and a method for producing a sintered body by using the same. The low-temperature sinterable copper particles according to the present invention are coated with a carboxylic acid, and a surface of the copper particle is oxidized so as to have a cuprous oxide fraction (Cu.sub.2O/(Cu+Cu.sub.2O)) in the copper particle of 4% by mass or less or so as to have an average coating thickness of cuprous oxide of 10 nm or less. The low-temperature sinterable copper particles are subjected to low-temperature firing in an atmosphere of 0.01 Pa or less.

To provide novel low-temperature sinterable copper particles that can be sintered even at a low temperature of, for example, around 100° C. or less, and a method for producing a sintered body by using the same. The low-temperature sinterable copper particles according to the present invention are coated with a carboxylic acid, and a surface of the copper particle is oxidized so as to have a cuprous oxide fraction (Cu.sub.2O/(Cu+Cu.sub.2O)) in the copper particle of 4% by mass or less or so as to have an average coating thickness of cuprous oxide of 10 nm or less. The low-temperature sinterable copper particles are subjected to low-temperature firing in an atmosphere of 0.01 Pa or less.

A monolithic substrate including a silica material fused to bulk copper is provided for coupling with electronic components, along with methods for making the same. The method includes arranging a base mixture in a die mold. The base mixture includes a bottom portion with copper micron powder and an upper portion with copper nanoparticles. The method includes arranging a secondary mixture on the upper portion of the base mixture. The secondary mixture includes a bottom portion with silica-coated copper nanoparticles and an upper portion with silica nanoparticles. The method includes heating and compressing the base mixture and the secondary mixture in the die mold at a temperature, pressure, and time sufficient to sinter and fuse the base mixture with the secondary mixture to form a monolithic substrate. The resulting monolithic substrate defines a first major surface providing thermal conductivity, and a second major surface providing an electrically resistive surface.

Methods of forming metal multipod nanostructures. The methods may include providing a mixture that includes a metal acetylacetonate, a reducing agent, and a carboxylic acid. The mixture may be contacted with microwaves to form the metal multipod nanostructures. The methods may offer control over the structure and/or morphology of the metal multipod nanostructures.

Methods of forming metal multipod nanostructures. The methods may include providing a mixture that includes a metal acetylacetonate, a reducing agent, and a carboxylic acid. The mixture may be contacted with microwaves to form the metal multipod nanostructures. The methods may offer control over the structure and/or morphology of the metal multipod nanostructures.

This silver paste is used to form a silver paste layer by applying the silver paste directly on the surface of a copper or copper alloy member, and the silver paste includes a silver powder, a fatty acid silver salt, an aliphatic amine, a high-dielectric-constant alcohol having a dielectric constant of 30 or more, and a solvent having a dielectric constant of less than 30. The content of the high-dielectric-constant alcohol is preferably 0.01% by mass to 5% by mass when an amount of the silver paste is taken as 100% by mass.