The present invention discloses a method for fabricating a porous spherical iron-based alloy powder, a powder thereof and a sintered body thereof. The method comprises steps: mixing an iron oxide powder and an alloying powder to form a mixed powder;

spray-granulating the mixed powder to form a spherical spray-granulated powder; and placing the spherical spray-granulated powder in a reducing environment and heating it to a temperature of lower than 700° C. to obtain a porous spherical iron-based alloy powder having high flowability, high compressibility, superior sinterability and low cost.

Systems and methods for forming near net-shape metal parts from binderless metal powder are disclosed. Systems include a mold die that defines a die cavity and may include one or more ultrasonic transducers operatively coupled to the mold die. Systems may be configured to introduce binderless metal powder into a die cavity and/or to compact the binderless metal powder within the die cavity. Methods include introducing binderless metal powder into a die cavity of a mold die and compacting the binderless metal powder within the die cavity to form a green part within the die cavity. The binderless metal powder may include spheroidal metal particles and angular metal particles. The methods may further include separating the green part from the mold die and sintering the green part, after separating, to form a sintered near net-shape metal part.

Aiming at providing a metal particle, an electro-conductive paste, a formed article, and a laminated article that are able to form a highly reliable and high-quality electric interconnect, an electro-conductive bonding portion, or a three-dimensional structure that is less likely to produce the Kirkendall void, this invention discloses a metal particle which include an outer shell and a core part, the outer shell including an intermetallic compound and covering the core part.

The present disclosure generally relates to metallic powders for use in multilayer ceramic capacitors, to multilayer ceramic capacitors containing same and to methods of manufacturing such powders and capacitors. The disclosure addresses the problem of having better controlled smaller particle size distribution, with minimal contaminant contents which can be implemented at an industrial scale.

The present invention relates to a method of making a cemented carbide or a cermet body comprising the steps of first forming a powder blend comprising powders forming hard constituents and metal binder. The powder blend is then subjected to a mixing operation using a non-contact mixer wherein acoustic waves achieving resonance conditions to form a mixed powder blend and then subjecting said mixed powder blend to a pressing and sintering operation. The method makes it possible to maintain the grain size, the grain size distribution and the morphology of the WC grains.

The present invention relates to a soft magnetic metal powder which contains B and has Fe and Ni as the main components, wherein the content of Ni in the soft magnetic metal powder is 30 to 80 mass %, the total content of Fe and Ni in the soft magnetic metal powder is 90 mass % or more, the content of B inside the metal particle of the soft magnetic metal powder is 10 to 150 ppm, and the particle has a film of boron nitride on the surface. The present invention also relates to a soft magnetic metal powder core prepared by using the soft magnetic metal powder.

A solder-coated ball (10A) includes a spherical core containing Ni and P; and a solder layer (12) formed to coat the core (11). A solder-coated ball (10B) further includes a Cu plating layer (13) formed between the core (11) and the solder layer (12). A solder-coated ball (10C) further includes an Ni plating layer (14) formed between the Cu plating layer (13) and the solder layer (12).

Provided are a Cu ball, a Cu core ball, a solder joint, solder paste and foamed solder, which are superior in the impact resistance to dropping and can inhibit any occurrence of poor joints a junction defect. An electronic component 60 is constructed by joining a solder bump 30 of a semiconductor chip 10 to an electrode 41 of a printed circuit board 40 with solder paste 12, 42. The solder bump 30 is formed by joining an electrode 11 of the semiconductor chip 10 to the Cu ball 20. The Cu ball 20 according to the present invention contains purity which is equal to or higher than 99.9% and equal to or lower than 99.995%, sphericity which is equal to or higher than 0.95, and Vickers hardness which is equal to or higher than 20 HV and equal to or less than 60 HV.

An L10-FeNi magnetic powder has an average particle size of 50 nm to 1 μm, and an average value of sphericity P of 0.9 or more. The sphericity P is defined as P=Ls/Lr, where Lr is a perimeter of an L10-FeNi magnetic powder particle on an image of a microscope, and Ls is a perimeter of a perfect circle that has a same area as the L10-FeNi magnetic powder particle on the image for which Lr is calculated.

A metal powder for powder metallurgy according to the invention contains Co as a principal component, Cr in a proportion of 25 to 32 mass %, Ni in a proportion of 5 to 15 mass %, Fe in a proportion of 0.5 to 2 mass %, W in a proportion of 4 to 10 mass %, Si in a proportion of 0.3 mass % to 1.5 mass %, and C in a proportion of 0.05 mass % to 0.8 mass %, wherein when one element selected from the group consisting of Ti, V, Y, Zr, Nb, Hf, and Ta is defined as a first element, and one element selected from the group and having a higher group number in the periodic table than that of the first element or having the same group number as that of the first element and a higher period number than that of the first element is defined as a second element, the first element is contained in a proportion of 0.01 to 0.5 mass %, and the second element is contained in a proportion of 0.01 to 0.5 mass %.