The embodiments disclosed herein are directed to systems and methods for manufacturing recycled copper alloy powder particles from used or deficient copper alloy powder particles. In some embodiments, used copper alloy powder particles comprising near-surface oxygen are introduced into a microwave plasma torch. In some embodiments, the used copper alloy powder particles are heated within the microwave plasma torch to at least partially remove the oxygen and form recycled copper alloy powder particles, without melting the used copper alloy powder particles.

There are provided a spherical silver powder which has the same diameter as that of a spherical silver powder produced by a conventional wet reduction method and which can sufficiently sinter the silver particles thereof to cause the silver particles to be adhered to each other at a relatively low temperature to form a conductive film having a low volume resistivity when it is used for a baked type conductive paste, and a method for producing the same. A spherical silver powder, which contains a neutral or basic amino acid having a carbon number of not less than 5 in each of particles thereof and which has an average particle diameter D.sub.50 of 0.2 to 5 μm based on a laser diffraction method, is produced by adding the neutral or basic amino acid having the carbon number of not less than 5 (such as proline, tyrosine, tryptophan, phenylalanine, arginine or histidine) to a water reaction system containing silver ions to mix a reducing agent therewith to deposit silver particles by reduction.

There are provided a spherical silver powder which has the same diameter as that of a spherical silver powder produced by a conventional wet reduction method and which can sufficiently sinter the silver particles thereof to cause the silver particles to be adhered to each other at a relatively low temperature to form a conductive film having a low volume resistivity when it is used for a baked type conductive paste, and a method for producing the same. A spherical silver powder, which contains a neutral or basic amino acid having a carbon number of not less than 5 in each of particles thereof and which has an average particle diameter D.sub.50 of 0.2 to 5 μm based on a laser diffraction method, is produced by adding the neutral or basic amino acid having the carbon number of not less than 5 (such as proline, tyrosine, tryptophan, phenylalanine, arginine or histidine) to a water reaction system containing silver ions to mix a reducing agent therewith to deposit silver particles by reduction.

There are provided a spherical silver powder which has the same diameter as that of a spherical silver powder produced by a conventional wet reduction method and which can sufficiently sinter the silver particles thereof to cause the silver particles to be adhered to each other at a relatively low temperature to form a conductive film having a low volume resistivity when it is used for a baked type conductive paste, and a method for producing the same. A spherical silver powder, which contains a neutral or basic amino acid having a carbon number of not less than 5 in each of particles thereof and which has an average particle diameter D.sub.50 of 0.2 to 5 μm based on a laser diffraction method, is produced by adding the neutral or basic amino acid having the carbon number of not less than 5 (such as proline, tyrosine, tryptophan, phenylalanine, arginine or histidine) to a water reaction system containing silver ions to mix a reducing agent therewith to deposit silver particles by reduction.

A caster assembly configured to process and store a material includes a reaction chamber, a storage assembly configured to store material processed in the reaction chamber, and a blower configured to process and store the material. The reaction chamber includes a vessel configured to hold the material in a melted state prior to processing and a powder generating assembly configured to receive the material from the melting vessel. The powder generating assembly includes a feeding chamber and a feeding device disposed at least partially within the feeding chamber. The feeding device includes at least one nozzle configured to inject inert fluid, where the fluid is a gas, liquid, or combination of the two into the feeding chamber and a material inlet through which the material is configured to flow into the feeding chamber to be exposed to the inert fluid, where the fluid is a gas, liquid, or combination of the two.

Methodologies, systems, and devices are provided for producing metal spheroidal powder products. By utilizing a microwave plasma, control over spheriodization and resulting microstructure can be tailored to meet desired demands.

Methodologies, systems, and devices are provided for producing metal spheroidal powder products. By utilizing a microwave plasma, control over spheriodization and resulting microstructure can be tailored to meet desired demands.

Provided is a method of producing spherical silver powder, which makes it possible to easily produce spherical silver powder having primary particle diameters with less variation than conventional powder and spherical silver powder obtained by the method. The method of producing spherical silver powder includes a reduction precipitation step of precipitating silver particles by reduction by adding a reductant including hydrazine carbonate to an aqueous reaction system containing silver ions.

Tantalum powder that is highly spherical is described. The tantalum powder can be useful in additive manufacturing and other uses. Methods to make the tantalum powder are further described as well as methods to utilize the tantalum powder in additive manufacturing processes. Resulting products and articles using the tantalum powder are further described.

Tantalum powder that is highly spherical is described. The tantalum powder can be useful in additive manufacturing and other uses. Methods to make the tantalum powder are further described as well as methods to utilize the tantalum powder in additive manufacturing processes. Resulting products and articles using the tantalum powder are further described.