B22F1/068

Sintered bearing and method for manufacturing same

Provided is a sintered bearing that is capable of reducing cost through reduction in usage amount of copper, excellent in initial running-in characteristics and quietness, and is high in durability. Raw material powders including iron powder, flat copper powder, low-melting point metal powder, and graphite are loaded into a mold, and a green compact is formed under a state in which the flat copper powder is caused to adhere onto a molding surface. Subsequently, sintering is carried out without causing iron in the green compact to react with carbon so that an iron structure is formed of a ferrite phase. In this manner, a sintered bearing (1) including a base part (S2) including copper at a uniform content, and a surface layer (S1) covering a surface of the base part (S2) and including copper at a larger content than the base part (S2) can be obtained.

Sintered bearing and method for manufacturing same

Provided is a sintered bearing that is capable of reducing cost through reduction in usage amount of copper, excellent in initial running-in characteristics and quietness, and is high in durability. Raw material powders including iron powder, flat copper powder, low-melting point metal powder, and graphite are loaded into a mold, and a green compact is formed under a state in which the flat copper powder is caused to adhere onto a molding surface. Subsequently, sintering is carried out without causing iron in the green compact to react with carbon so that an iron structure is formed of a ferrite phase. In this manner, a sintered bearing (1) including a base part (S2) including copper at a uniform content, and a surface layer (S1) covering a surface of the base part (S2) and including copper at a larger content than the base part (S2) can be obtained.

Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device

Provided is a metal paste for joints, containing: metal particles; and linear or branched monovalent aliphatic alcohol having 1 to 20 carbon atoms, in which the metal particles include sub-micro copper particles having a volume average particle diameter of 0.12 μm to 0.8 μM.

Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device

Provided is a metal paste for joints, containing: metal particles; and linear or branched monovalent aliphatic alcohol having 1 to 20 carbon atoms, in which the metal particles include sub-micro copper particles having a volume average particle diameter of 0.12 μm to 0.8 μM.

CONSTRUCTION METHOD FOR 3D MICRO/NANOSTRUCTURE
20220258243 · 2022-08-18 ·

A construction method for 3D micro/nanostructure, comprising: Step (1), fixing and vacuuming a material source on a substrate; Step (2), focusing an electron beam to ensure that a position of a focus is 0-100 nm away from a surface of material source, and an interface local domain including the focus of electron beam and surface atoms is formed; and Step (3), controlling the focus of electron beam to move point by point according to a shape of a designed 3D micro/nanostructure, and realizing the construction of 3D micro/nanostructure. This disclosure realizes real-time construction of 3D micro/nanostructure through the migration of atoms driven by uneven atomic density and electric potential difference in interface local domain. This disclosure promotes integrative development of nanotechnology and 3D printing and has good value of application and promotion.

CONSTRUCTION METHOD FOR 3D MICRO/NANOSTRUCTURE
20220258243 · 2022-08-18 ·

A construction method for 3D micro/nanostructure, comprising: Step (1), fixing and vacuuming a material source on a substrate; Step (2), focusing an electron beam to ensure that a position of a focus is 0-100 nm away from a surface of material source, and an interface local domain including the focus of electron beam and surface atoms is formed; and Step (3), controlling the focus of electron beam to move point by point according to a shape of a designed 3D micro/nanostructure, and realizing the construction of 3D micro/nanostructure. This disclosure realizes real-time construction of 3D micro/nanostructure through the migration of atoms driven by uneven atomic density and electric potential difference in interface local domain. This disclosure promotes integrative development of nanotechnology and 3D printing and has good value of application and promotion.

Method of making nanocrystalline metal flakes and nanocrystalline flakes made therefrom

A method of producing flakes containing nanostructures from a part made of a material. The method includes subjecting the part made of the material to peening by shots driven by ultrasonic energy for a period of time, wherein nano structures form on the surface of the part and, subsequently, damage to the part caused by continued peening of the part by the shots driven by ultrasonic energy results in separation of flakes containing nanostructures from the part made of the material. Nanocrystalline flakes containing fractured surfaces, microcracks, nanograins and nanolamellae. Sensors comprising nanocrystalline flakes containing fractured surfaces, microcracks, nanograins and nanolamellae.

Method of making nanocrystalline metal flakes and nanocrystalline flakes made therefrom

A method of producing flakes containing nanostructures from a part made of a material. The method includes subjecting the part made of the material to peening by shots driven by ultrasonic energy for a period of time, wherein nano structures form on the surface of the part and, subsequently, damage to the part caused by continued peening of the part by the shots driven by ultrasonic energy results in separation of flakes containing nanostructures from the part made of the material. Nanocrystalline flakes containing fractured surfaces, microcracks, nanograins and nanolamellae. Sensors comprising nanocrystalline flakes containing fractured surfaces, microcracks, nanograins and nanolamellae.

Silver powder mixture, method for producing same, and conductive paste

A silver powder mixture that is suitable for forming a conductive film on a surface of a member having stretchability, a method for producing the same, and a conductive paste using the silver powder mixture is provided. A silver powder mixture containing filamentous silver powder including spherical and filamentous parts and flaky silver powder having an average particle diameter of 1 μm or more and 50 μm or less and an aspect ratio, which is defined by a ratio of an average long diameter and an average thickness, of 1.5 or more is obtained by adding one kind or two or more kinds of a salt of copper and aluminum and ethylenediaminetetraacetic acid to a silver nitrate aqueous solution, for 60 seconds or more, and then adding a reducing agent containing one kind or two or more kinds of L-ascorbic acid, erythorbic acid, and salts thereof.

Silver powder mixture, method for producing same, and conductive paste

A silver powder mixture that is suitable for forming a conductive film on a surface of a member having stretchability, a method for producing the same, and a conductive paste using the silver powder mixture is provided. A silver powder mixture containing filamentous silver powder including spherical and filamentous parts and flaky silver powder having an average particle diameter of 1 μm or more and 50 μm or less and an aspect ratio, which is defined by a ratio of an average long diameter and an average thickness, of 1.5 or more is obtained by adding one kind or two or more kinds of a salt of copper and aluminum and ethylenediaminetetraacetic acid to a silver nitrate aqueous solution, for 60 seconds or more, and then adding a reducing agent containing one kind or two or more kinds of L-ascorbic acid, erythorbic acid, and salts thereof.