B22F1/068

SILVER NANOPLATE COMPOSITIONS AND METHODS

Embodiments of the present invention relate to methods for preparing high optical density solutions of nanoparticle, such as nanoplates, silver nanoplates or silver platelet nanoparticles, and to the solutions and substrates prepared by the methods. The process can include the addition of stabilizing agents (e.g., chemical or biological agents bound or otherwise linked to the nanoparticle surface) that stabilize the nanoparticle before, during, and/or after concentration, thereby allowing for the production of a stable, high optical density solution of silver nanoplates. The process can also include increasing the concentration of silver nanoplates within the solution, and thus increasing the solution optical density.

Particle and composition of particles with controlled dimensions

A particle and a composition including a plurality of particles are provided, wherein the particles are platelets exhibiting a planar geometry which is circular or which is made up of a number (x) of planar (y)-sided polygon(s), wherein x is from 1 to 20 and y is at least 3 wherein if x is greater than 1 then said planar (y)-sided polygons are fused along one or more sides thereof, wherein the width (W.sub.P) of the platelets (P) at their widest point is no more than about 250 pm and the thickness of the platelets (P) is in the range of 10 nm to 50 nm.

ELECTRICALLY CONDUCTIVE FINE PARTICLES

[Object] To provide fine particles 2 having good printing characteristics, good thermal conductivity, and good electrical conductivity.

[Solution] The fine particles 2 are flake-like. A main component of the fine particles 2 is an electrically conductive metal. A typical metal is silver. A particle diameter D50 of particles including a large number of the fine particles 2 is equal to or greater than 0.10 μm but equal to or less than 0.50 μm, a particle diameter D95 of the particles is equal to or less than 1.00 μm, and a maximum particle diameter Dmax of the particles is equal to or less than 3.00 μm. A particle diameter D10 of the particles is equal to or greater than 0.05 μm. A BET specific surface area of the particles is equal to or greater than 2.0 m.sup.2/g. A tap density TD of the particles is equal to or greater than 2.0 g/cm.sup.3. An average Tave of thicknesses of the fine particles 2 is equal to or less than 0.05 μm.

COMPRESSED POWDER BODY

A compressed powder body comprises metal particles and an interposed substance which is interposed between the metal particles. Each of the metal particles is made of FeSiAl-based soft magnetic alloy and has a flat shape when seen along a predetermined direction. The metal particles include one or more of the metal particles each of which is formed with one or more predetermined holes. Each of the predetermined holes passes through the metal particle in the predetermined direction. Each of the predetermined holes has a maximum width in a predetermined plane perpendicular to the predetermined direction the maximum width being equal to or larger than a thickness of the metal particle with the predetermined hole in the predetermined direction.

Soft Magnetic Flattened Powder and Method for Producing the Same
20170301442 · 2017-10-19 ·

In accordance with the present invention, there are provided: a soft magnetic flattened powder having an average particle diameter, excellent sheet moldability, and a high magnetic permeability; and a method for producing the soft magnetic flattened powder. The soft magnetic flattened powder according to the present invention includes an Fe—Si—Al-based alloy, an average particle diameter D.sub.50 being 30 to less than 50 μm; a coercive force Hc measured by applying a magnetic field in the longitudinal direction of the flattened powder being 176 A/m or less; the ratio of a tap density to a true density being 0.18 or less; a specific surface area BET value being 0.6 m.sup.2/g or more; the amount of contained oxygen being 0.6 mass % or less; and the BET value and oxygen value of the soft magnetic powder satisfying expression (1): [oxygen value/BET value 0.50 (excluding zero)].

SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME
20170294396 · 2017-10-12 ·

An objective of the present invention is to provide a sinterable bonding material excellent in sinterability. The present invention relates to a sinterable bonding material comprising a silver filler and an organic base compound as a sintering promoter.

SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME
20170294404 · 2017-10-12 ·

An objective of the present invention is to provide a sinterable bonding material capable of providing a bonded article having a long-term reliability. The present invention relates to a sinterable bonding material comprising a silver filler and resin particles, wherein the silver filler comprises a flake-shaped filler having an arithmetic average roughness (Ra) of 10 nm or less; and the resin particles have an elastic modulus (E) of 10 GPa or less, and a heat decomposition temperature of 200° C. or more. The sintered product of the sinterable bonding material of the present invention is excellent in bonding strength and heat-release characteristics, and has an improved stress relaxation ability.

Material With Directional Microstructure

A material comprises at least one layer of a plurality of domains, each domain being flattened in a first direction and elongated in a second direction normal to the first direction. The flattened and elongated domains define an anisotropic microstructure that facilitates a magnetic flux flow in the second direction.

Material With Directional Microstructure

A material comprises at least one layer of a plurality of domains, each domain being flattened in a first direction and elongated in a second direction normal to the first direction. The flattened and elongated domains define an anisotropic microstructure that facilitates a magnetic flux flow in the second direction.

HYBRID DISINTEGRABLE ARTICLES
20170291222 · 2017-10-12 ·

A hybrid article comprises a disintegrable metal comprising one or more of the following: Mg; Al; Zn; Mn; an alloy thereof; or a composite thereof; and a disintegrable polymer comprising one or more of the following: an epoxy polymer derived from an epoxy base and a curing agent having cleavable bonds; a cured cyanate ester; or a poly(hexahydrotriazine).