A method for preparing copper-solver and copper-gold porous microsheets with specific pore sizes, the method including the steps of providing a solution of copper microsheets and adding a silver or gold solution under controlled temperature, the reaction conditions can be changed to determine pore sizes.

A method for preparing copper-solver and copper-gold porous microsheets with specific pore sizes, the method including the steps of providing a solution of copper microsheets and adding a silver or gold solution under controlled temperature, the reaction conditions can be changed to determine pore sizes.

The present invention relates to compositions, comprising platelet-shaped transition metal particles, wherein the number mean diameter of the platelet-shaped transition metal particles, present in the composition, is in the range of 15 nm to 1000 nm and the number mean thickness of the platelet-shaped transition metal particles, present in the composition, is in the range of 2 to 40 nm, the transition metal is selected from silver, copper, gold and palladium and the platelet-shaped transition metal particles bear a surface modifying agent of formula A-(CHR.sup.9).sub.r—R.sup.10 (V), wherein if r is 1, A is a C.sub.1-C.sub.25alkyl group substituted with one, or more fluorine atoms; a C.sub.2-C.sub.25alkenyl substituted with one, or more fluorine atoms; a C.sub.2-C.sub.25alkynyl group substituted with one, or more fluorine atoms; a C.sub.3-C.sub.20cycloalkyl group substituted with one, or more fluorine atoms; or a C.sub.6-C.sub.24aryl group substituted with one, or more fluorine atoms, CF.sub.3 or —O—CF.sub.3 groups; if r is 0, A is a C.sub.6-C.sub.24aryl group substituted with one, or more fluorine atoms, CF.sub.3 or —O—CF.sub.3 groups; or a C.sub.7-C.sub.24aralkyl group substituted with one, or more fluorine atoms, CF.sub.3 or —O—CF.sub.3 groups;

R.sup.9 is H, or a C.sub.1-C.sub.4alkyl group; and R.sup.10 is a thiol group, or an amino group.

Surface modification with fluorinated thiols/amines allows to tune the surface properties of silver nanoplatelets in such a way, as to, on the one hand, make them dispersible and colloidally stable in the finished printing ink system, and on the other hand, allow them to migrate to the substrate and print surfaces upon drying of the solvent in the printed layer.

A metal powder is an ensemble of fine metal particles. The fine metal particles include fine layered metal particles (2). Each of the fine layered metal particles (2) includes a center layer (4), an upper middle layer (6), an upper end layer (8), a lower middle layer (10), and a lower end layer (12). Each of the layers is a flake. The flakes belong to the same crystal. There is a space S1 between the center layer (4) and the upper middle layer (6). There is a space S2 between the upper middle layer (6) and the upper end layer (8). There is a space S3 between the center layer (4) and the lower middle layer (10). There is a space S4 between the lower middle layer (10) and the lower end layer (12).

A composition for pressure bonding contains a metal powder and a solid reducing agent and has a compressibility of 10% to 90%, the compressibility being expressed by a relationship formula using the thickness A of a dried coating film formed by drying the composition in an air atmosphere at 110° C. under atmospheric pressure for 20 minutes and the thickness B of a sintered body formed by treating the dried coating film in a nitrogen atmosphere at 280° C. under a pressure of 6 MPa for 20 minutes. The solid reducing agent may be BIS-TRIS. Also provided is a bonded structure of conductors in which a bonding portion via which two conductors are bonded together is formed by treating, under pressure, the two conductors and a coating film formed of the composition for pressure bonding provided therebetween.

A composition for pressure bonding contains a metal powder and a solid reducing agent and has a compressibility of 10% to 90%, the compressibility being expressed by a relationship formula using the thickness A of a dried coating film formed by drying the composition in an air atmosphere at 110° C. under atmospheric pressure for 20 minutes and the thickness B of a sintered body formed by treating the dried coating film in a nitrogen atmosphere at 280° C. under a pressure of 6 MPa for 20 minutes. The solid reducing agent may be BIS-TRIS. Also provided is a bonded structure of conductors in which a bonding portion via which two conductors are bonded together is formed by treating, under pressure, the two conductors and a coating film formed of the composition for pressure bonding provided therebetween.

A bonding material includes: a copper foil; and a sinterable bonding film formed on one surface of the copper foil. The bonding film contains a copper powder and a solid reducing agent. The bonding material is used for bonding to a bonding target having, on its surface, at least one metal selected from the group consisting of gold, silver, copper, nickel, and aluminum. The bonding material is also used as a material for wire bonding. A bonded structure is also provided in which a bonding target having a metal layer formed on its surface and a copper foil are electrically connected to each other via a bonding layer formed of a sintered structure of a copper powder, wherein the metal layer contains at least one metal selected from the group consisting of gold, silver, copper, nickel, and aluminum.

According to an embodiment, a composite permanent magnet includes a matrix of magnetically hard phase grains having an average grain size of 10 nm to 50 μm; and magnetically soft phase grains embedded within the matrix, and having an average grain size of at least 50 nm, each grain having an elongated shape with an aspect ratio of at least 2:1. According to another embodiment, a composite permanent magnet includes a matrix of magnetically hard phase grains having an average grain size of 10 nm to 50 μm; and magnetically soft phase grains embedded within the matrix, and having an average grain width of at least 50 nm, an average grain height of 20 to 500 nm, and an aspect ratio of at least 2:1. According to yet another embodiment, a method of forming a composite permanent magnet is also provided.

According to an embodiment, a composite permanent magnet includes a matrix of magnetically hard phase grains having an average grain size of 10 nm to 50 μm; and magnetically soft phase grains embedded within the matrix, and having an average grain size of at least 50 nm, each grain having an elongated shape with an aspect ratio of at least 2:1. According to another embodiment, a composite permanent magnet includes a matrix of magnetically hard phase grains having an average grain size of 10 nm to 50 μm; and magnetically soft phase grains embedded within the matrix, and having an average grain width of at least 50 nm, an average grain height of 20 to 500 nm, and an aspect ratio of at least 2:1. According to yet another embodiment, a method of forming a composite permanent magnet is also provided.

In various embodiments, additive manufacturing is utilized to fabricate three-dimensional metallic parts using metallic alloy wire as a feedstock material.