Copper particles are provided that each include a core particle made of copper and a coating layer that coats the surface of the core particle, wherein the coating layer is made of a copper salt of an aliphatic organic acid. It is also preferable that the copper particles have an infrared absorption peak in a range of 1504 to 1514 cm.sup.−1 and no infrared absorption peak in a range of 1584 to 1596 cm.sup.−1. It is also preferable that, in thermogravimetric analysis of the copper particles, the temperature at which the ratio of the mass loss value to the mass loss value at 500° C. reaches 10% is from 150° C. to 220° C. A method is also provided for producing copper particles, the method including bringing core particles made of copper into contact with a solution containing a copper salt of an aliphatic organic acid to thereby coat the surface of the core particles.

Fluorinated metal nanoparticles (f-MNPs) are metal nanoparticles and/or semiconductor nanoparticles having a plurality of fluorinated alkyl ligands attached to the surfaces of the nanoparticles where the f-MNPs are greater than 20 nm in cross-section. The f-MNPs can be used as a surfactant to form active f-MNPs stabilized aqueous droplet, which can be used in a light-mediated microfluidic device where droplet movement, merging, splitting, and sorting can be carried out as directed by one or more laser beams focused onto one or more spots of light-mediated microfluidic device.

Fluorinated metal nanoparticles (f-MNPs) are metal nanoparticles and/or semiconductor nanoparticles having a plurality of fluorinated alkyl ligands attached to the surfaces of the nanoparticles where the f-MNPs are greater than 20 nm in cross-section. The f-MNPs can be used as a surfactant to form active f-MNPs stabilized aqueous droplet, which can be used in a light-mediated microfluidic device where droplet movement, merging, splitting, and sorting can be carried out as directed by one or more laser beams focused onto one or more spots of light-mediated microfluidic device.

This invention relates to a silver sintering composition. In particular, the present invention relates to a silver sintering composition containing a copper alloy, which is capable of being stably sintered on various metal substrates such as copper, gold or silver with good adhesion and sintering strength.

According to some aspects, techniques are provided for fabricating sinterable metallic parts through the application of directed energy to a build material. In particular, applying energy to a build material comprising a polymer mixed with a metal powder may cause the polymer to form a cohesive structure with the metal powder. As a result, the polymer acts as a “glue” to produce a metallic green part without local melting of the metal. The green part may subsequently be sintered to remove the polymer and produce a fully dense metal part. Optionally, a step of debinding may also be performed prior to, or simultaneously with, sintering.

According to some aspects, techniques are provided for fabricating sinterable metallic parts through the application of directed energy to a build material. In particular, applying energy to a build material comprising a polymer mixed with a metal powder may cause the polymer to form a cohesive structure with the metal powder. As a result, the polymer acts as a “glue” to produce a metallic green part without local melting of the metal. The green part may subsequently be sintered to remove the polymer and produce a fully dense metal part. Optionally, a step of debinding may also be performed prior to, or simultaneously with, sintering.

A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains C particles containing C as a main component. A mass fraction of the C particles in a total mass of the metal body and the C particles is 5.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. The C particles may be graphite particles.

A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains C particles containing C as a main component. A mass fraction of the C particles in a total mass of the metal body and the C particles is 5.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. The C particles may be graphite particles.

A method for treating additive manufacturing powder particles is provided. The method includes exposing the additive manufacturing powder particles to plasma radiation, where the plasma radiation forms functional groups, on surfaces of the additive manufacturing powder particles, having molecular bonds that vibrate in response to irradiation by laser energy of an additive manufacturing process, and moving the additive manufacturing powder particles to expose the additive manufacturing powder particles to the plasma radiation.

A method for manufacturing a dense layer that includes: supplying a substrate and a suspension of non-agglomerated nanoparticles of a material P; depositing a layer on the substrate using the suspension; drying the layer thus obtained; and densifying the dried layer by mechanical compression and/or heat treatment. The method is characterised in that the suspension of non-agglomerated nanoparticles of material P includes nanoparticles of material P having a size distribution having a value of D50. The distribution includes nanoparticles of material P of a first size D1 between 20 nm and 50 nm, and nanoparticles of material P of a second size D2 characterised by the value D50 being at least five times less than that of D1, or the distribution has a mean size of nanoparticles of material P less than 50 nm, and a standard deviation to mean size ratio greater than 0.6.