B22F1/107

SILVER PASTE, AND METHOD OF PRODUCING JOINED ARTICLE

This silver paste includes a silver powder and a solvent, in which the silver powder includes first silver particles having a particle size of 100 nm or more and less than 500 nm, second silver particles having a particle size of 50 nm or more and less than 100 nm, and third silver particles having a particle size of 1000 nm or more and less than 10000 nm, and the content of the first silver particles is 12% by volume or more and 90% by volume or less, the content of the second silver particles is 1% by volume or more and 38% by volume or less, and the content of the third silver particles is 5% by volume or more and 80% by volume or less, regarding a total amount of the silver powder as 100% by volume.

SILVER PASTE, AND METHOD OF PRODUCING JOINED ARTICLE

This silver paste includes a silver powder and a solvent, in which the silver powder includes first silver particles having a particle size of 100 nm or more and less than 500 nm, second silver particles having a particle size of 50 nm or more and less than 100 nm, and third silver particles having a particle size of 1000 nm or more and less than 10000 nm, and the content of the first silver particles is 12% by volume or more and 90% by volume or less, the content of the second silver particles is 1% by volume or more and 38% by volume or less, and the content of the third silver particles is 5% by volume or more and 80% by volume or less, regarding a total amount of the silver powder as 100% by volume.

Bonding structure and method of manufacturing bonding structure
11702725 · 2023-07-18 · ·

A bonding structure includes: a plurality of carbon nanotubes; a first bonded member, and a first metal sintered compact bonding first end portions of the plurality of carbon nanotubes and the first bonded member, wherein the first metal sintered compact enters spaces between the first end portions of the plurality of carbon nanotubes, and bonds to the plurality of carbon nanotubes while covering side faces and end faces of the first end portions of the plurality of carbon nanotubes.

Bonding structure and method of manufacturing bonding structure
11702725 · 2023-07-18 · ·

A bonding structure includes: a plurality of carbon nanotubes; a first bonded member, and a first metal sintered compact bonding first end portions of the plurality of carbon nanotubes and the first bonded member, wherein the first metal sintered compact enters spaces between the first end portions of the plurality of carbon nanotubes, and bonds to the plurality of carbon nanotubes while covering side faces and end faces of the first end portions of the plurality of carbon nanotubes.

Bonding structure and method of manufacturing bonding structure
11702725 · 2023-07-18 · ·

A bonding structure includes: a plurality of carbon nanotubes; a first bonded member, and a first metal sintered compact bonding first end portions of the plurality of carbon nanotubes and the first bonded member, wherein the first metal sintered compact enters spaces between the first end portions of the plurality of carbon nanotubes, and bonds to the plurality of carbon nanotubes while covering side faces and end faces of the first end portions of the plurality of carbon nanotubes.

THREE-DIMENSIONAL (3D) PRINTING

In a three-dimensional printing method example, a liquid functional agent is selectively applied. The liquid functional agent includes an alloying agent. A metallic build material is applied. The liquid functional agent is selectively applied before the metallic build material, after the metallic build material, or both before and after the metallic build material. The liquid functional agent patterns the metallic build material to form a composite layer. At least some of the metallic build material is exposed to energy to melt the at least some of the metallic build material to form a layer. Upon contact or after energy exposure, the alloying agent and the build material alter a composition of the composite layer.

ALUMINUM SLURRY
20230220221 · 2023-07-13 · ·

Provided is a VMP aluminum slurry that can satisfy metallic texture achieving high designability and demand characteristics of adhesion level with a base material. It has been found that when a coating material formed using a VMP aluminum slurry containing a specific dicarboxylic acid is made into a coating film, the adhesion with a base material is particularly excellent, and the VMP aluminum slurry of the present invention has been completed. The VMP aluminum slurry contains a dicarboxylic acid having an octanol/water partition coefficient (log Pow) of −1 to 1 and a carbon chain of 2 to 5 carbon atoms between two carboxy groups, a VMP (vacuum metallized pigment) aluminum pigment, and a solvent.

ALUMINUM SLURRY
20230220221 · 2023-07-13 · ·

Provided is a VMP aluminum slurry that can satisfy metallic texture achieving high designability and demand characteristics of adhesion level with a base material. It has been found that when a coating material formed using a VMP aluminum slurry containing a specific dicarboxylic acid is made into a coating film, the adhesion with a base material is particularly excellent, and the VMP aluminum slurry of the present invention has been completed. The VMP aluminum slurry contains a dicarboxylic acid having an octanol/water partition coefficient (log Pow) of −1 to 1 and a carbon chain of 2 to 5 carbon atoms between two carboxy groups, a VMP (vacuum metallized pigment) aluminum pigment, and a solvent.

METAL POWDER SINTERING PASTE AND METHOD OF PRODUCING THE SAME, AND METHOD OF PRODUCING CONDUCTIVE MATERIAL
20230215596 · 2023-07-06 · ·

There is a problem that when a silver powder sintering paste that is substantially free from resin is used, an organic solvent used as a dispersion medium bleeds, which results in contamination and wire bonding defects. In order to solve the problem, provided is a metal powder sintering paste that contains, as a principal component, silver particles having an average particle diameter (a median diameter) of 0.3 μm to 5 μm and further contains an anionic surfactant but is substantially free from resin.

METAL POWDER SINTERING PASTE AND METHOD OF PRODUCING THE SAME, AND METHOD OF PRODUCING CONDUCTIVE MATERIAL
20230215596 · 2023-07-06 · ·

There is a problem that when a silver powder sintering paste that is substantially free from resin is used, an organic solvent used as a dispersion medium bleeds, which results in contamination and wire bonding defects. In order to solve the problem, provided is a metal powder sintering paste that contains, as a principal component, silver particles having an average particle diameter (a median diameter) of 0.3 μm to 5 μm and further contains an anionic surfactant but is substantially free from resin.