A polymer-assisted 3D printing method and ink compositions are used to manufacture magnetocaloric devices having many applications including in heat pumps, refrigerators, etc. The ink compositions and printing methods can produce compositionally graded, anisotropically aligned magnetocaloric architectures with designed pores and channels, to bring forth significant improvement in heat exchange efficiency.

A polymer-assisted 3D printing method and ink compositions are used to manufacture magnetocaloric devices having many applications including in heat pumps, refrigerators, etc. The ink compositions and printing methods can produce compositionally graded, anisotropically aligned magnetocaloric architectures with designed pores and channels, to bring forth significant improvement in heat exchange efficiency.

A composition for forming a contiguous conductive feature on a substrate includes silver nanoparticles, a titanium precursor compound, a first non-aqueous polar protic solvent, and a second non-aqueous polar protic solvent. The concentration of the titanium precursor compound in the composition is in a range of 2 vol % to 13 vol %. A method of forming a contiguous conductive feature on a substrate includes dispensing the composition on the substrate to form a contiguous precursor feature and sintering the contiguous precursor feature at a sintering temperature in a range of 300° C. to 500° C. to form the contiguous conductive feature. Example titanium precursor compounds are: titanium(IV) butoxide, titanium(IV) isopropoxide, titanium(IV) chloride, tetrakis(diethylamido)titanium(IV), and dimethyltitanocene.

A composition for forming a contiguous conductive feature on a substrate includes silver nanoparticles, a titanium precursor compound, a first non-aqueous polar protic solvent, and a second non-aqueous polar protic solvent. The concentration of the titanium precursor compound in the composition is in a range of 2 vol % to 13 vol %. A method of forming a contiguous conductive feature on a substrate includes dispensing the composition on the substrate to form a contiguous precursor feature and sintering the contiguous precursor feature at a sintering temperature in a range of 300° C. to 500° C. to form the contiguous conductive feature. Example titanium precursor compounds are: titanium(IV) butoxide, titanium(IV) isopropoxide, titanium(IV) chloride, tetrakis(diethylamido)titanium(IV), and dimethyltitanocene.

One object of the present invention is to provide a bonding material capable of forming a highly reliable bond, the present invention provides a bonding material having a plate shape or a sheet shape, wherein the bonding material includes: fine copper particles having an average particle diameter of 300 nm or less; coarse copper particles having an average particle diameter of 3 .Math.m or more and 11 .Math.m or less; and a reducing agent which reduces the fine copper particles and the coarse copper particles.

A method for preparing an oxygen-free passivated titanium or titanium-alloy powder product by means of gas-solid fluidization is provided. The new method includes placing the metal halide and the titanium powder which meet formula requirements into a gasifier and a fluidized bed reactor respectively; heating the gasifier to gasify the metal halide, and introducing dry argon and halide gas into the fluidized bed reactor; opening the fluidized bed, heating the fluidized bed, fluidizing the titanium powder after the introduction of the argon and the metal halide gas, and cooling the product to obtain the titanium powder subjected to oxygen-free passivation using metal chloride; molding the oxygen-free passivated titanium powder into a green body with powder metallurgy technology; and sintering the green body in vacuum or argon atmosphere according to the molding technology, and after temperature rise treatment, performing a densification sintering operation to obtain a high-performance titanium product component.

A method for preparing an oxygen-free passivated titanium or titanium-alloy powder product by means of gas-solid fluidization is provided. The new method includes placing the metal halide and the titanium powder which meet formula requirements into a gasifier and a fluidized bed reactor respectively; heating the gasifier to gasify the metal halide, and introducing dry argon and halide gas into the fluidized bed reactor; opening the fluidized bed, heating the fluidized bed, fluidizing the titanium powder after the introduction of the argon and the metal halide gas, and cooling the product to obtain the titanium powder subjected to oxygen-free passivation using metal chloride; molding the oxygen-free passivated titanium powder into a green body with powder metallurgy technology; and sintering the green body in vacuum or argon atmosphere according to the molding technology, and after temperature rise treatment, performing a densification sintering operation to obtain a high-performance titanium product component.

A high-temperature component of a refractory metal or a refractory metal alloy has an emissivity-increasing coating. The coating is formed of tantalum nitride and/or zirconium nitride; and tungsten with a tungsten content between 0 and 98 wt. %.

A high-temperature component of a refractory metal or a refractory metal alloy has an emissivity-increasing coating. The coating is formed of tantalum nitride and/or zirconium nitride; and tungsten with a tungsten content between 0 and 98 wt. %.

A plasticization device includes: a rotor rotated by a drive motor and having a groove forming surface in which a first groove portion is formed along a rotation direction; a rotor case configured to accommodate the rotor; a barrel facing the groove forming surface and having a through hole; a first heating unit configured to heat the rotor or the barrel; and a cooling mechanism configured to cool a side surface of the rotor. In the plasticization device, a material supplied between the first groove portion and the barrel is plasticized by rotation of the rotor and heating by the first heating unit to flow out from the through hole, and the side surface of the rotor has a material guiding port configured to guide the material to the first groove portion, and a second groove portion configured to feed the material supplied between the rotor and the rotor case to the material guiding port.