A molding material is provided which, despite containing a ceramic, enables efficient molding for producing high-density molded articles. The present invention provides a molding material to be used in powder laminate molding. This molding material contains a first powder which contains a ceramic, and a second powder which contains a metal. Further, the first powder and the second powder configure granulated particles. Ideally, the ratio of the content of the second powder to the total content of the first powder and the second powder is greater than 10 mass % and less than 90 mass %.

A method for assembling multi-component nano-structures that includes dispersing a plurality of nano-structures in a fluid medium, and applying an electric field having an alternating current (AC) component and a direct current (DC) component to the fluid medium containing the plurality of nano-structures. The electric field causes a first nano-structure from the plurality of nano-structures to move to a predetermined position and orientation relative to a second nano-structure of the plurality of nano-structures such that the first and second nano-structures assemble into a multi-component nano-structure.

A method of manufacturing an elongated electrically conducting element having functionalized carbon nanotubes and at least one metal, includes the steps of mixing functionalized carbon nanotubes with at least one metal, to obtain a composite mixture, and forming a solid mass from the composite mixture from step (i). A solid element obtained from the solid mass from step (ii) is inserted into a metal tube, and the metal tube from step (iii) is deformed, to obtain an elongated electrically conducting element.

A method of manufacturing an elongated electrically conducting element having functionalized carbon nanotubes and at least one metal, includes the steps of mixing functionalized carbon nanotubes with at least one metal, to obtain a composite mixture, and forming a solid mass from the composite mixture from step (i). A solid element obtained from the solid mass from step (ii) is inserted into a metal tube, and the metal tube from step (iii) is deformed, to obtain an elongated electrically conducting element.

A method for synthesizing a reagent complex includes a step of ball-milling a mixture that includes: a powder of a zero-valent element; a hydride molecule; and a nitrile ligand. The method produces a reagent complex having a formula Q.sup.0.X.sub.y.L.sub.z, where Q.sup.0 is the zero-valent element, X is the hydride molecule, and L is the nitrile ligand. A process for synthesizing nanoparticles composed of the zero-valent element includes a step of adding solvent to the reagent complex. Crystal texture of the nanoparticles is modulated by appropriate selection of the molar ratio nitrile ligand in the reagent complex.

A method for synthesizing a reagent complex includes a step of ball-milling a mixture that includes: a powder of a zero-valent element; a hydride molecule; and a nitrile ligand. The method produces a reagent complex having a formula Q.sup.0.X.sub.y.L.sub.z, where Q.sup.0 is the zero-valent element, X is the hydride molecule, and L is the nitrile ligand. A process for synthesizing nanoparticles composed of the zero-valent element includes a step of adding solvent to the reagent complex. Crystal texture of the nanoparticles is modulated by appropriate selection of the molar ratio nitrile ligand in the reagent complex.

Embodiments can relate to an improved hydroflux, additive or electroless plating assisted densification cold sintering process to densify powdered metals at lower compaction pressures and lower temperatures (e.g., 520 MPa and 140° C.). The process can involve inducing dissolution precipitation mechanisms at powder interfaces by introducing a transport phase (formed by the introduction of water during the process to suppress melting temperatures) that is not an aqueous solution. Particle interfaces in the cold sinter fuse together by the presence of the additional transport phase, thereby reducing the temperatures and pressures needed for compaction. Some embodiments involve the use of elements to form a eutectic at the desired low temperature, thereby stabilizing certain crystal structure shapes of isometric crystal systems, inducing rapid densification, and facilitating pore smoothing. Embodiments of the process can be used to generate a green compact via sintering that exhibits improved green strength.

Embodiments can relate to an improved hydroflux, additive or electroless plating assisted densification cold sintering process to densify powdered metals at lower compaction pressures and lower temperatures (e.g., 520 MPa and 140° C.). The process can involve inducing dissolution precipitation mechanisms at powder interfaces by introducing a transport phase (formed by the introduction of water during the process to suppress melting temperatures) that is not an aqueous solution. Particle interfaces in the cold sinter fuse together by the presence of the additional transport phase, thereby reducing the temperatures and pressures needed for compaction. Some embodiments involve the use of elements to form a eutectic at the desired low temperature, thereby stabilizing certain crystal structure shapes of isometric crystal systems, inducing rapid densification, and facilitating pore smoothing. Embodiments of the process can be used to generate a green compact via sintering that exhibits improved green strength.

There is provided a powder material that is for densifying a molded article manufactured by an additive layer manufacturing method and improving harness of the molded article. There is provided a powder material for use in additive layer manufacturing containing ceramics and metals, in which a tapped filling rate defined by (tapped density/theoretical density)×100% is 40% or more.

There is provided a powder material that is for densifying a molded article manufactured by an additive layer manufacturing method and improving harness of the molded article. There is provided a powder material for use in additive layer manufacturing containing ceramics and metals, in which a tapped filling rate defined by (tapped density/theoretical density)×100% is 40% or more.