B22F3/087

Densification Methods and Apparatuses
20200130314 · 2020-04-30 ·

An apparatus includes a first electrode exhibiting a first Seebeck coefficient, a second electrode exhibiting a second Seebeck coefficient greater than the first Seebeck coefficient, and particles between the first and second electrodes exhibiting a third Seebeck coefficient between the first and second Seebeck coefficients. An alternating current power supply is electrically connected to the first and second electrodes. Heat is generated due to the Peltier effect at a junction between the first electrode and the particles and at a junction between the second electrode and the particles. Heat is removed due to the Peltier effect at the junction between the first electrode and the particles and at the junction between the second electrode and the particles. The particles are densified due to heating and cooling phase transitions between a higher-temperature solid phase and a lower-temperature solid phase while compressing the particles.

Processes for producing and treating thin-films composed of nanomaterials
10632534 · 2020-04-28 · ·

Processes for producing and treating thin-films comprising nanomaterials are provided. A process of producing a transparent conducting film includes printing nanomaterials on a substrate, and directing a laser beam onto the nanomaterials to weld junctions between the nanomaterials. A process for tightly integrating nanomaterials with 2D material includes locating the 2D material over the nanomaterials, and directing a laser beam towards the 2D material to produce laser shock pressure sufficient to wrap the 2D material on the nanomaterials. A process of reducing the resistivity of a transparent conducting film includes directing a first laser beam towards a transparent conducting film having nanomaterials thereon such that the nanomaterials experience laser shock pressure sufficient to compress the nanomaterials, and then directing a second laser beam towards the transparent conducting film such that junctions between the nanomaterials are fused.

Processes for producing and treating thin-films composed of nanomaterials
10632534 · 2020-04-28 · ·

Processes for producing and treating thin-films comprising nanomaterials are provided. A process of producing a transparent conducting film includes printing nanomaterials on a substrate, and directing a laser beam onto the nanomaterials to weld junctions between the nanomaterials. A process for tightly integrating nanomaterials with 2D material includes locating the 2D material over the nanomaterials, and directing a laser beam towards the 2D material to produce laser shock pressure sufficient to wrap the 2D material on the nanomaterials. A process of reducing the resistivity of a transparent conducting film includes directing a first laser beam towards a transparent conducting film having nanomaterials thereon such that the nanomaterials experience laser shock pressure sufficient to compress the nanomaterials, and then directing a second laser beam towards the transparent conducting film such that junctions between the nanomaterials are fused.

SUPERALLOY TARGET
20200048738 · 2020-02-13 ·

A superalloy target wherein the superalloy target has a polycrystalline structure of random grain orientation, the average grain size in the structure is smaller than 20 m, and the porosity in the structure is smaller than 10%. Furthermore, the invention includes a method of producing a superalloy target by powder metallurgical production, wherein the powder-metallurgical production starts from alloyed powder(s) of a superalloy and includes the step of spark plasma sintering (SPS) of the alloyed powder(s).

SUPERALLOY TARGET
20200048738 · 2020-02-13 ·

A superalloy target wherein the superalloy target has a polycrystalline structure of random grain orientation, the average grain size in the structure is smaller than 20 m, and the porosity in the structure is smaller than 10%. Furthermore, the invention includes a method of producing a superalloy target by powder metallurgical production, wherein the powder-metallurgical production starts from alloyed powder(s) of a superalloy and includes the step of spark plasma sintering (SPS) of the alloyed powder(s).

PRESSING ORIENTED PELLETS IN A MAGNETIC FIELD

Disclosed herein is a method and apparatus for forming pellets in a non-ambient environment such as a strong magnetic field. The apparatus includes a die body, a die bottom, a short push pin, a long push pin, a press tube, and an extended push pin. A powder is loaded into the die body, which is then positioned in the non-ambient environment, and the powder allowed to equilibrate. A pellet is then formed by pressing on the extended push pin while the powder is in the non-ambient environment.

PRESSING ORIENTED PELLETS IN A MAGNETIC FIELD

Disclosed herein is a method and apparatus for forming pellets in a non-ambient environment such as a strong magnetic field. The apparatus includes a die body, a die bottom, a short push pin, a long push pin, a press tube, and an extended push pin. A powder is loaded into the die body, which is then positioned in the non-ambient environment, and the powder allowed to equilibrate. A pellet is then formed by pressing on the extended push pin while the powder is in the non-ambient environment.

Densification methods and apparatuses
10549497 · 2020-02-04 · ·

A method includes a first electrode exhibiting a first Seebeck coefficient, a second electrode exhibiting a second Seebeck coefficient greater than the first Seebeck coefficient, and particles between the first and second electrodes exhibiting a third Seebeck coefficient between the first and second Seebeck coefficients. Heat is generated due to the Peltier effect at a junction between the first electrode and the particles and at a junction between the second electrode and the particles. Heat is removed due to the Peltier effect at the junction between the first electrode and the particles and at the junction between the second electrode and the particles. The particles are densified due to heating and cooling phase transitions between a higher-temperature solid phase and a lower-temperature solid phase while compressing the particles. An apparatus includes the first and second electrodes and an alternating current power supply electrically connected to the first and second electrodes.

Densification methods and apparatuses
10549497 · 2020-02-04 · ·

A method includes a first electrode exhibiting a first Seebeck coefficient, a second electrode exhibiting a second Seebeck coefficient greater than the first Seebeck coefficient, and particles between the first and second electrodes exhibiting a third Seebeck coefficient between the first and second Seebeck coefficients. Heat is generated due to the Peltier effect at a junction between the first electrode and the particles and at a junction between the second electrode and the particles. Heat is removed due to the Peltier effect at the junction between the first electrode and the particles and at the junction between the second electrode and the particles. The particles are densified due to heating and cooling phase transitions between a higher-temperature solid phase and a lower-temperature solid phase while compressing the particles. An apparatus includes the first and second electrodes and an alternating current power supply electrically connected to the first and second electrodes.

METHODS AND SYSTEMS FOR ADDITIVE MANUFACTURING
20200001533 · 2020-01-02 ·

Additive manufacturing (AM) exploits materials added layer by layer to form consecutive cross sections of desired shape. However, prior art AM suffers drawbacks in employable materials and final piece-part quality. Embodiments of the invention introduce two new classes of methods, solidification and trapping, to create complex and functional structures of macro/micro and nano sizes using configurable fields irrespective of whether they need a medium or not for transmission. Selective Spatial Solidification forms the piece-part directly within the selected build material whilst Selective Spatial Trapping injects the build material into the chamber and selectively directs it to accretion points in a continuous manner. In each a localized spatiotemporal concentrated field is established by configuring or maneuvering field emitters. These methods are suitable to create any 3D part with high mechanical properties and complex geometries. These layerless methods may be used discretely or in combination with conventional AM and non-AM manufacturing processes.