B22F3/1003

DIAMOND SINTERED MATERIAL AND TOOL INCLUDING DIAMOND SINTERED MATERIAL

A diamond sintered material includes diamond grains, wherein a content ratio of the diamond grains is more than or equal to 80 volume % and less than or equal to 99 volume % with respect to the diamond sintered material, an average grain size of the diamond grains is more than or equal to 0.1 μm and less than or equal to 50 μm, and a dislocation density of the diamond grains is more than or equal to 8.1×10.sup.13 m.sup.−2 and less than 1.0×10.sup.16 m.sup.−2.

METHOD OF MAKING CERMET OR CEMENTED CARBIDE POWDER

The present disclosure relates to a method of making a powder of dense and spherically shaped cemented carbide or cermet granules. The present disclosure also relates to a powder produced by the method and use of said powder in additive manufacturing such as 3D printing by the binder jetting technique. Furthermore, the present disclosure relates to a Hot Isostatic Pressing (HIP) process for manufacturing a product by using said powder.

METHOD OF MAKING CERMET OR CEMENTED CARBIDE POWDER

The present disclosure relates to a method of making a powder of dense and spherically shaped cemented carbide or cermet granules. The present disclosure also relates to a powder produced by the method and use of said powder in additive manufacturing such as 3D printing by the binder jetting technique. Furthermore, the present disclosure relates to a Hot Isostatic Pressing (HIP) process for manufacturing a product by using said powder.

Method for heat treating a preform made of titanium alloy powder

A method for heat treating a powder part preform including a titanium-based alloy, wherein the method includes the heat treatment of the preform in a furnace at a predetermined temperature, wherein the preform is on a holder during the heat treatment, wherein the holder includes a zirconium-based alloy having a zirconium content greater than or equal to 95% by weight, wherein the holder material has a melting temperature higher than the predefined temperature of the heat treatment, and wherein an anti-diffusion barrier is arranged between the preform and the holder in order to prevent welding of the preform to the holder.

Method of producing semiconductor sintered body, electrical/electronic member, and semiconductor sintered body
11404620 · 2022-08-02 · ·

A semiconductor sintered body comprising a polycrystalline body, wherein the polycrystalline body comprises magnesium silicide or an alloy containing magnesium silicide, and the average grain size of the crystal grains constituting the polycrystalline body is 1 μm or less, and the electrical conductivity is 10,000 S/m or higher.

THREE-DIMENSIONAL PRINTING

A three-dimensional printing formulation can include polymeric powder. The polymeric powder can include high aspect ratio composite particles including glass fibers coated with an encapsulating polymer in an amount from about 5 wt % to about 80 wt % based on a total weight of the polymeric powder, and low aspect ratio filler particles in an amount from about 20 wt % to about 95 wt % based on a total weight of the polymeric powder. The high aspect ratio composite particles can have an aspect ratio from about 7:1 to about 30:1 and the low aspect ratio filler particles can have an aspect ratio from 1:1 to less than 7:1.

THREE-DIMENSIONAL PRINTING

A three-dimensional printing formulation can include polymeric powder. The polymeric powder can include high aspect ratio composite particles including glass fibers coated with an encapsulating polymer in an amount from about 5 wt % to about 80 wt % based on a total weight of the polymeric powder, and low aspect ratio filler particles in an amount from about 20 wt % to about 95 wt % based on a total weight of the polymeric powder. The high aspect ratio composite particles can have an aspect ratio from about 7:1 to about 30:1 and the low aspect ratio filler particles can have an aspect ratio from 1:1 to less than 7:1.

Applying an additive manufacturing agent based on actual platform displacement

In one example, a control process for an additive manufacturing machine includes displacing a platform, measuring the actual displacement of the platform, determining that the actual displacement varies from a nominal displacement, and determining an amount of an agent to be applied to build material layered on the displaced platform based on the determined variation.

Applying an additive manufacturing agent based on actual platform displacement

In one example, a control process for an additive manufacturing machine includes displacing a platform, measuring the actual displacement of the platform, determining that the actual displacement varies from a nominal displacement, and determining an amount of an agent to be applied to build material layered on the displaced platform based on the determined variation.

ADDITIVE MANUFACTURING

In one example, a control process for an additive manufacturing machine includes displacing a platform, measuring the actual displacement of the platform, determining that the actual displacement varies from a nominal displacement, and determining an amount of an agent to be applied to build material layered on the displaced platform based on the determined variation.