A method for binder jetting additive manufacturing of an object, the method comprising: (i) separately feeding a powder from which said object is to be manufactured and a solution comprising an adhesive polymer dissolved in a solvent into an additive manufacturing device, wherein said adhesive polymer is an amine-containing polymer having a molecular weight of at least 200 g/mole and is present in said solution in a concentration of 1-30 wt % to result in said solution having a viscosity of 2-25 mPa.Math.s and a surface tension of 25-45 mN/m at room temperature; and (ii) dispensing selectively positioned droplets of said adhesive polymer, from a printhead of said additive manufacturing device, into a bed of said powder to bind particles of said powder with said adhesive polymer to produce a preform having a shape of the object to be manufactured.

A semiconductor sintered body comprising a polycrystalline body, wherein the polycrystalline body includes silicon or a silicon alloy, wherein the average grain size of the crystal grains forming the polycrystalline body is 1 m or less, and wherein nanoparticles including one or more of a carbide of silicon, a nitride of silicon, and an oxide of silicon are present at a grain boundary of the grains.

Aluminium-silicon powder mixtures comprising a hypereutectic AlSi powder, a near eutectic AlSi powder, and a third powder which is aluminium or a hypoeutectic aluminium alloy containing alloying constituents other than silicon and less than 9 wt % silicon, with a sintering aid comprising a fourth, zinc-containing powder, are pressed and sintered to provide powder metallurgy products suitable for automotive component use in particular. The third powder in the composition permits such AlSi powder mixtures to be compressed to a density approaching that obtained by use of an annealed powder mixture, but without the annealing step.

Aluminium-silicon powder mixtures comprising a hypereutectic AlSi powder, a near eutectic AlSi powder, and a third powder which is aluminium or a hypoeutectic aluminium alloy containing alloying constituents other than silicon and less than 9 wt % silicon, with a sintering aid comprising a fourth, zinc-containing powder, are pressed and sintered to provide powder metallurgy products suitable for automotive component use in particular. The third powder in the composition permits such AlSi powder mixtures to be compressed to a density approaching that obtained by use of an annealed powder mixture, but without the annealing step.

A semiconductor sintered body comprising a polycrystalline body, wherein the polycrystalline body comprises silicon or a silicon alloy, and the average grain size of the crystal grains constituting the polycrystalline body is 1 m or less, and the electrical conductivity is 10,000 S/m or higher.

A semiconductor sintered body comprising a polycrystalline body, wherein the polycrystalline body comprises magnesium silicide or an alloy containing magnesium silicide, and the average grain size of the crystal grains constituting the polycrystalline body is 1 m or less, and the electrical conductivity is 10,000 S/m or higher.

Provided is a method for manufacturing photonic sintering particles. According to an embodiment, the method includes: preparing nano particles; and forming oxide films having different thicknesses with reference to the thermal conductivity of a substrate, on which the nano particles are to be formed, on surfaces of the nano particles.

Provided is a method for manufacturing photonic sintering particles. According to an embodiment, the method includes: preparing nano particles; and forming oxide films having different thicknesses with reference to the thermal conductivity of a substrate, on which the nano particles are to be formed, on surfaces of the nano particles.

The present invention belongs to the technical field of high throughput preparation and hot working of materials, and in particular to a high throughput micro-synthesis method of multi-component materials based on the temperature gradient field controlled by microwave energy. This invention, characterized by flexible material selection, quick temperature rising and high-efficient heating, uses microwave heating both to achieve quick preparation of small block combinatorial materials under the same temperature field in one time and to realize micro-synthesis under the different temperature gradient fields in one time including high-throughput sintering-melting and heat treatment of materials. This invention successfully overcomes drawbacks of current material preparation, such as unitary combination of components, low-efficient external heating, unique control temperature, huge material consumption and high cost during material preparation and heat treatment.

The present invention belongs to the technical field of high throughput preparation and hot working of materials, and in particular to a high throughput micro-synthesis method of multi-component materials based on the temperature gradient field controlled by microwave energy. This invention, characterized by flexible material selection, quick temperature rising and high-efficient heating, uses microwave heating both to achieve quick preparation of small block combinatorial materials under the same temperature field in one time and to realize micro-synthesis under the different temperature gradient fields in one time including high-throughput sintering-melting and heat treatment of materials. This invention successfully overcomes drawbacks of current material preparation, such as unitary combination of components, low-efficient external heating, unique control temperature, huge material consumption and high cost during material preparation and heat treatment.