B22F3/1035

GRAIN BOUNDARY ENGINEERING OF SINTERED MAGNETIC ALLOYS AND THE COMPOSITIONS DERIVED THEREFROM
20230154657 · 2023-05-18 ·

The present disclosure is directed at methods of preparing rare earth-based permanent magnets having improved coercivity and remanence, the method comprising one or more steps comprising: (a) homogenizing a first population of particles of a first GBM alloy with a second population of particles of a second core alloy to form a composite alloy preform, the first GBM alloy being substantially represented by the formula: AC.sub.bR.sub.xCo.sub.yCu.sub.dM.sub.z, the second core alloy being substantially represented by the formula G.sub.2Fe.sub.14B, where AC, R, M, G, b, x, y, and z are defined; (b) heating the composite alloy preform particles to form a population of mixed alloy particles; (c) compressing the mixed alloy particles, under a magnetic field of a suitable strength to align the magnetic particles with a common direction of magnetization and inert atmosphere, to form a green body; (d) sintering the green body; and (e) annealing the sintered body. Particular embodiments include magnets comprising neodymium-iron-boron core alloys, including Nd.sub.2Fe.sub.14B.

SYSTEM AND METHOD FOR ADDITIVE METAL MANUFACTURING
20230028908 · 2023-01-26 ·

A system for additive metal manufacturing, including a deposition mechanism, a translation mechanism mounting the deposition mechanism to the working volume, and a stage. A method for additive metal manufacturing including: selectively depositing a material carrier within the working volume; removing an additive from the material carrier; and treating the resultant material.

System and method for additive metal manufacturing

A system for additive metal manufacturing, including a deposition mechanism, a translation mechanism mounting the deposition mechanism to the working volume, and a stage. A method for additive metal manufacturing including: selectively depositing a material carrier within the working volume; removing an additive from the material carrier; and treating the resultant material.

COPPER PASTE, WICK FORMATION METHOD, AND HEAT PIPE

Provided is a copper paste for forming a wick of a heat pipe, the copper paste containing copper particles, thermally decomposable resin particles, a dispersion medium for dispersing the copper particles and the thermally decomposable resin particles, and a thermally decomposable resin that is soluble in the dispersion medium.

Lightweight structures having increased structural integrity and an ultra-low coefficient of thermal expansion

The present invention is directed toward an additive manufacturing method for manufacturing silica-based structures that have a low linear cure shrinkage percentage and an ultra-low coefficient of thermal expansion. The structure may be constructed with a powder mixture that contains at least a first set of silica-based particles that are spherical and that have a first size, and a second set of submicron silica-based particles that are jagged, spherical, or both jagged and spherical. The silica-based powder mixture may be combined with a surfactant in order to create a slurry that can be used to create a 3D printed structure that has a low linear cure shrinkage percentage and an ultra-low coefficient of thermal expansion.

ADDITIVE MANUFACTURED 3D ELECTRONIC SUBSTRATE
20230381863 · 2023-11-30 ·

A method of forming electronic substrates and assemblies is provided. The method includes forming a first layer, including co-depositing a first material and a second material, where the first material and the second material are co-deposited as powders, binders, slurries, inks, or combinations thereof, and at least partially sintering or curing the first layer of co-deposited materials. Further, the method includes forming a second layer, including co-depositing the first material and the second material, and at least partially sintering or curing the second layer of co-deposited materials. Additionally, the method includes retrieving a solid electronic substrate wherein the sintered or cured first material of the first layer forms the solid electronic substrate and the sintered or cured second material of the first layer forms a feature in or on the solid electronic substrate.

METALLIC SINTERING COMPOSITIONS INCLUDING BORON ADDITIVES AND RELATED METHODS
20220324219 · 2022-10-13 ·

The disclosure relates to sintering compositions that can be used in three-dimensional printing or additive manufacturing processes. The sintering compositions generally include one or more metallic iron-containing powders and a minor amount of a boron-containing powder as a sintering aid. Sintered models or products formed from the sintering compositions have substantially improved density and surface roughness values relative to models formed without the boron-containing powder.

METALLIC SINTERING COMPOSITIONS INCLUDING BORON ADDITIVES AND RELATED METHODS
20220324219 · 2022-10-13 ·

The disclosure relates to sintering compositions that can be used in three-dimensional printing or additive manufacturing processes. The sintering compositions generally include one or more metallic iron-containing powders and a minor amount of a boron-containing powder as a sintering aid. Sintered models or products formed from the sintering compositions have substantially improved density and surface roughness values relative to models formed without the boron-containing powder.

THREE DIMENSIONAL PRINTING OF CERMET OR CEMENTED CARBIDE
20220258237 · 2022-08-18 ·

A method of making a 3D printed cermet or cemented carbide body including a hard phase and a metallic binder phase whereby the 3D printed green body is subjected to a sintering process including a holding step prior to a liquid phase sintering step. The sintered bodies have a reduced porosity.

Thermoelectric conversion material, thermoelectric conversion module using same, and method of manufacturing thermoelectric conversion material

A thermoelectric conversion material includes a sintered body including a main phase including a plurality of crystal grains including Ce, Mn, Fe, and Sb and forming a skutterudite structure, and a grain boundary between crystal grains adjacent to each other. The grain boundary includes a sintering aid phase including at least Mn, Sb, and O. Thus, with respect to a skutterudite-type thermoelectric conversion material including Sb, which is a sintering-resistant material, it is possible to improve sinterability while maintaining a practical dimensionless figure-of-merit ZT, and to reduce processing cost.