A method of manufacturing a composite material for thermal shields, and a composite material manufactured by the method are proposed. The method may include preparing a mixed powder including (i) a metal powder including a powder of aluminum or aluminum alloy and (ii) a polymer or ceramic powder. The method may also include sintering the mixed powder through pressureless sintering or spark plasma sintering to produce a composite material. According to the present disclosure, a powder of polymer, ceramic, and/or metal which have a relatively low level of thermal conductivity can be compounded with a metal material including aluminum through a sintering process of powder metallurgy, such as pressureless sintering or spark plasma sintering. Thus, a heterogeneous composite material with a low-level thermal conductivity (10 W/mk or less) can be obtained, and the composite material can be used as a material for various thermal shields.

Disclosed are a method of manufacturing an aluminum alloy clad section, and an aluminum alloy clad section manufactured by the method. The method includes preparing a composite powder by ball-milling aluminum powder and carbon nanotubes, preparing a billet from the composite powder, and subjecting the billet to direct extrusion using an extrusion die. The method is simple in procedure and uses simple equipment because it is based on direct extrusion which is suitable for mass production. Thus, the method is capable of producing a lightweight high-strength functional aluminum alloy clad section having a competitive advantage in terms of price over conventional aluminum alloy clad sections.

Disclosed are a method of manufacturing an aluminum alloy clad section, and an aluminum alloy clad section manufactured by the method. The method includes preparing a composite powder by ball-milling aluminum powder and carbon nanotubes, preparing a billet from the composite powder, and subjecting the billet to direct extrusion using an extrusion die. The method is simple in procedure and uses simple equipment because it is based on direct extrusion which is suitable for mass production. Thus, the method is capable of producing a lightweight high-strength functional aluminum alloy clad section having a competitive advantage in terms of price over conventional aluminum alloy clad sections.

Disclosed are a method of manufacturing an aluminum alloy clad section, and an aluminum alloy clad section manufactured by the method. The method includes preparing a composite powder by ball-milling aluminum powder and carbon nanotubes, preparing a billet from the composite powder, and subjecting the billet to direct extrusion using an extrusion die. The method is simple in procedure and uses simple equipment because it is based on direct extrusion which is suitable for mass production. Thus, the method is capable of producing a lightweight high-strength functional aluminum alloy clad section having a competitive advantage in terms of price over conventional aluminum alloy clad sections.

A pure copper powder with a Si coating formed thereon, wherein a Si adhesion amount is 5 wtppm or more and 200 wtppm or less, a C adhesion amount is 15 wtppm or more, and a weight ratio C/Si is 3 or less. An object of the present invention is to provide a pure copper powder with a Si coating formed thereon and a production method thereof, as well as an additive manufactured object using such pure copper powder capable of suppressing the partial sintering of the pure copper powder caused by the preheating thereof in additive manufacturing based on the electron beam (EB) method, and suppressing the loss of the degree of vacuum caused by carbon (C) during the molding process.

A method for manufacturing a functionally graded composite material for a printed circuit board (PCB) is proposed. The method may include preparing two or more types of mixed powders with different contents of polymer or ceramic powder, each mixed powder comprising (i) a metal powder comprising a powder made of aluminum or an aluminum alloy and a powder of magnesium and (ii) the polymer or ceramic powder. The method may also include laminating the two or more types of mixed powders to form a functionally graded laminate in which a ratio of the content of the polymer or ceramic powder to the content of the metal powder in each of layers stacked in sequence from bottom to the top of the laminate differs. The method may further include preparing a functionally graded composite material by sintering the functionally graded laminate by pressureless sintering or spark plasma sintering.

A method for manufacturing a functionally graded composite material for a printed circuit board (PCB) is proposed. The method may include preparing two or more types of mixed powders with different contents of polymer or ceramic powder, each mixed powder comprising (i) a metal powder comprising a powder made of aluminum or an aluminum alloy and a powder of magnesium and (ii) the polymer or ceramic powder. The method may also include laminating the two or more types of mixed powders to form a functionally graded laminate in which a ratio of the content of the polymer or ceramic powder to the content of the metal powder in each of layers stacked in sequence from bottom to the top of the laminate differs. The method may further include preparing a functionally graded composite material by sintering the functionally graded laminate by pressureless sintering or spark plasma sintering.

A method for manufacturing a functionally graded composite material for a printed circuit board (PCB) is proposed. The method may include preparing two or more types of mixed powders with different contents of polymer or ceramic powder, each mixed powder comprising (i) a metal powder comprising a powder made of aluminum or an aluminum alloy and a powder of magnesium and (ii) the polymer or ceramic powder. The method may also include laminating the two or more types of mixed powders to form a functionally graded laminate in which a ratio of the content of the polymer or ceramic powder to the content of the metal powder in each of layers stacked in sequence from bottom to the top of the laminate differs. The method may further include preparing a functionally graded composite material by sintering the functionally graded laminate by pressureless sintering or spark plasma sintering.

This application relates to a method of manufacturing an electrostatic chuck having good characteristics in heat dissipation, thermal shock resistance, and lightness. In one aspect, the method includes preparing a composite powder by ball-milling (i) aluminum or aluminum alloy powder and (ii) carbon-based nanomaterial powder. The method may also include preparing an electrode layer by sintering the composite powder through spark plasma sintering (SPS), and forming a dielectric layer on the electrode layer.

This application relates to a method of manufacturing an electrostatic chuck having good characteristics in heat dissipation, thermal shock resistance, and lightness. In one aspect, the method includes preparing a composite powder by ball-milling (i) aluminum or aluminum alloy powder and (ii) carbon-based nanomaterial powder. The method may also include preparing an electrode layer by sintering the composite powder through spark plasma sintering (SPS), and forming a dielectric layer on the electrode layer.