Patent classifications
B22F2003/208
Passivation and alloying element retention in gas atomized powders
A method for gas atomization of a titanium alloy, nickel alloy, or other alumina (Al.sub.2O.sub.3)-forming alloy wherein the atomized particles are exposed as they solidify and cool in a very short time to multiple gaseous reactive agents for the in-situ formation of a passivation reaction film on the atomized particles wherein the reaction film retains a precursor halogen alloying element that is subsequently introduced into a microstructure formed by subsequent thermally processing of the atomized particles to improve oxidation resistance.
Passivation and alloying element retention in gas atomized powders
A method for gas atomization of a titanium alloy, nickel alloy, or other alumina (Al.sub.2O.sub.3)-forming alloy wherein the atomized particles are exposed as they solidify and cool in a very short time to multiple gaseous reactive agents for the in-situ formation of a passivation reaction film on the atomized particles wherein the reaction film retains a precursor halogen alloying element that is subsequently introduced into a microstructure formed by subsequent thermally processing of the atomized particles to improve oxidation resistance.
Graphene-reinforced alloy composite material and preparation method thereof
A graphene-reinforced alloy composite material and a preparation method thereof are disclosed. The method includes preparing a porous graphene colloid, smelting a first-part alloy, pouring it into the porous graphene colloid to be formed, subjecting the formed product to a hot extrusion, and pulverizing into a powder I; smelting a second-part alloy into an alloy melt II, adding a high-purity silicon powder therein, mixing by stirring, and atomizing to obtain a powder II; mixing the powder I and the powder II, to obtain a pretreated alloy powder; placing the pretreated alloy powder in a high-purity ark, transferring the high-purity ark to a high-temperature tubular furnace, subjecting the pretreated alloy powder to a redox treatment, and introducing methane and hydrogen to grow graphene, to obtain a coated alloy powder; subjecting the coated alloy powder to a pre-compressing molding and sintering, to obtain the graphene-reinforced alloy composite material.
Graphene-reinforced alloy composite material and preparation method thereof
A graphene-reinforced alloy composite material and a preparation method thereof are disclosed. The method includes preparing a porous graphene colloid, smelting a first-part alloy, pouring it into the porous graphene colloid to be formed, subjecting the formed product to a hot extrusion, and pulverizing into a powder I; smelting a second-part alloy into an alloy melt II, adding a high-purity silicon powder therein, mixing by stirring, and atomizing to obtain a powder II; mixing the powder I and the powder II, to obtain a pretreated alloy powder; placing the pretreated alloy powder in a high-purity ark, transferring the high-purity ark to a high-temperature tubular furnace, subjecting the pretreated alloy powder to a redox treatment, and introducing methane and hydrogen to grow graphene, to obtain a coated alloy powder; subjecting the coated alloy powder to a pre-compressing molding and sintering, to obtain the graphene-reinforced alloy composite material.
METHOD FOR MANUFACTURING A LEAD-FREE OR LOW LEAD CONTENT BRASS BILLET AND BILLET THUS OBTAINED
A method for obtaining a lead-free or low lead content brass billet subjects a mixture of lead-free or low lead content brass chips and graphite powder to extrusion, either direct or inverted. The method obtains lead-free or low lead content brass billets.
METHOD FOR MANUFACTURING A LEAD-FREE OR LOW LEAD CONTENT BRASS BILLET AND BILLET THUS OBTAINED
A method for obtaining a lead-free or low lead content brass billet subjects a mixture of lead-free or low lead content brass chips and graphite powder to extrusion, either direct or inverted. The method obtains lead-free or low lead content brass billets.
Methods of producing bonded magnet and compound for bonded magnets
Included is a method of preparing a compound for bonded magnets, the method including: coating a magnetic material having an average particle size of 10 μm or less with a thermosetting resin and a curing agent at a ratio of the equivalent weight of the curing agent to the equivalent weight of the thermosetting resin of 2 or higher and 10 or lower to obtain a coated material; granulating the coated material by compression to obtain a granulated product; milling the granulated product to obtain a milled product; and surface treating the milled product with a silane coupling agent to obtain a compound for bonded magnets, the method either including, between the granulation and the milling, heat curing the granulated product to obtain a cured product, or including, between the milling and the surface treatment, heat curing the milled product to obtain a cured product.
Methods of producing bonded magnet and compound for bonded magnets
Included is a method of preparing a compound for bonded magnets, the method including: coating a magnetic material having an average particle size of 10 μm or less with a thermosetting resin and a curing agent at a ratio of the equivalent weight of the curing agent to the equivalent weight of the thermosetting resin of 2 or higher and 10 or lower to obtain a coated material; granulating the coated material by compression to obtain a granulated product; milling the granulated product to obtain a milled product; and surface treating the milled product with a silane coupling agent to obtain a compound for bonded magnets, the method either including, between the granulation and the milling, heat curing the granulated product to obtain a cured product, or including, between the milling and the surface treatment, heat curing the milled product to obtain a cured product.
Sputtering target material
A method of making a sputtering target in which an atomized powder including, in at. %, 10 to 50% of B, 0 to 20% in total of one or more elements selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Ru, Rh, Ir, Ni, Pd, Pt, Cu, and Ag, and a balance of one or both of Co and Fe, and unavoidable impurities is provided. Fine particles are removed from the atomized powder to obtain a powder having a particle distribution where the cumulative volume of particles having a particle diameter of 5 μm or less is 10% or less, and the cumulative volume of particles having a particle diameter of 30 μm or less is 5-40%. The obtained powder is sintered to form a sputtering target comprising a sintered body. The sputtering target comprises hydrogen of 20 ppm or less.
Sputtering target material
A method of making a sputtering target in which an atomized powder including, in at. %, 10 to 50% of B, 0 to 20% in total of one or more elements selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Ru, Rh, Ir, Ni, Pd, Pt, Cu, and Ag, and a balance of one or both of Co and Fe, and unavoidable impurities is provided. Fine particles are removed from the atomized powder to obtain a powder having a particle distribution where the cumulative volume of particles having a particle diameter of 5 μm or less is 10% or less, and the cumulative volume of particles having a particle diameter of 30 μm or less is 5-40%. The obtained powder is sintered to form a sputtering target comprising a sintered body. The sputtering target comprises hydrogen of 20 ppm or less.