Patent classifications
B22F3/225
Plasticization device, three-dimensional shaping device, and injection molding device
A plasticization device includes: a rotor rotated by a drive motor and having a groove forming surface in which a first groove portion is formed along a rotation direction; a rotor case configured to accommodate the rotor; a barrel facing the groove forming surface and having a through hole; a first heating unit configured to heat the rotor or the barrel; and a cooling mechanism configured to cool a side surface of the rotor. In the plasticization device, a material supplied between the first groove portion and the barrel is plasticized by rotation of the rotor and heating by the first heating unit to flow out from the through hole, and the side surface of the rotor has a material guiding port configured to guide the material to the first groove portion, and a second groove portion configured to feed the material supplied between the rotor and the rotor case to the material guiding port.
MACHINE TOOL COMPONENT AND METHOD FOR PRODUCING THE MACHINE TOOL COMPONENT
In order to improve a usage of machine tool components, it is provided that the machine tool component is formed at least partially, in particular essentially, or alternatively completely from an amorphous metal. It is provided that the tool component is produced using injection molding or 3D printing or plastic deformation.
Plasticizing Device, Three-Dimensional Modeling Device, And Injection Molding Device
A plasticizing device includes a material reservoir which has an input port and is configured to retain a material, a plasticizer which has a screw and a case housing the screw and provided with a feed port communicated with the input port, and which is configured to plasticize the material to generate a plasticized material, a coupling pipe having a coupling path configured to connect the input port and the feed port to each other, a material sensor which has a light emitter configured to emit light toward the screw via the feed port, and a light receiver configured to receive reflected light of the light, and which is configured to detect a remaining amount of the material, and a controller configured to control the material reservoir, wherein the material reservoir has a material feed mechanism configured to feed the material to the coupling path, and the controller controls the material feed mechanism to feed the material to the coupling path when the remaining amount of the material detected by the material sensor is smaller than a reference value.
METHOD OF FORMING ARTICLE, COATED POWDER AND ARTICLE
A method of forming an article includes producing a base powder including a plurality of base particles. Each base particle includes an external surface and a first material. The method further includes removing one or more oxides from the external surface of each base particle to form a cleaned powder including a plurality of cleaned particles. Each cleaned particle includes a cleaned external surface made of the first material. The method further includes coating the cleaned external surface of each cleaned particle with a second material having a greater oxidation resistance than the first material to form a coated powder including a plurality of coated particles. Each coated particle includes an external layer including the second material that fully covers the cleaned external surface made of the first material. The method further includes forming the article using the coated powder.
METHOD OF FORMING ARTICLE, COATED POWDER AND ARTICLE
A method of forming an article includes producing a base powder including a plurality of base particles. Each base particle includes an external surface and a first material. The method further includes removing one or more oxides from the external surface of each base particle to form a cleaned powder including a plurality of cleaned particles. Each cleaned particle includes a cleaned external surface made of the first material. The method further includes coating the cleaned external surface of each cleaned particle with a second material having a greater oxidation resistance than the first material to form a coated powder including a plurality of coated particles. Each coated particle includes an external layer including the second material that fully covers the cleaned external surface made of the first material. The method further includes forming the article using the coated powder.
Manufacturing method of integrated circuit packaging structure
A manufacturing method of an integrated circuit (IC) packaging structure includes the following steps. One or a plurality of dies is disposed on a packaging substrate. An encapsulation material is formed on the packaging substrate. The encapsulation material is configured to encapsulate the one or the plurality of the dies on the packaging substrate. At least one trench is formed in the encapsulation material. A heat dissipation structure is formed on the encapsulation material, and at least a part of the heat dissipation structure is formed in the at least one trench. The step of forming the heat dissipation structure includes the following steps. A first slurry is formed in the at least one trench, and a first curing process is performed to the first slurry for forming a first portion of the heat dissipation structure.
Manufacturing method of integrated circuit packaging structure
A manufacturing method of an integrated circuit (IC) packaging structure includes the following steps. One or a plurality of dies is disposed on a packaging substrate. An encapsulation material is formed on the packaging substrate. The encapsulation material is configured to encapsulate the one or the plurality of the dies on the packaging substrate. At least one trench is formed in the encapsulation material. A heat dissipation structure is formed on the encapsulation material, and at least a part of the heat dissipation structure is formed in the at least one trench. The step of forming the heat dissipation structure includes the following steps. A first slurry is formed in the at least one trench, and a first curing process is performed to the first slurry for forming a first portion of the heat dissipation structure.
Mechanically alloyed powder feedstock
Disclosed herein are embodiments of mechanically alloyed powder feedstock and methods for spheroidizing them using microwave plasma processing. The spheroidized powder can be used in metal injection molding processes, hot isostatic processing, and additive manufacturing. In some embodiments, mechanical milling, such as ball milling, can be used to prepare high entropy alloys for microwave plasma processing.
METHOD FOR PRODUCING COMPOSITE MAGNETIC BODY, MAGNETIC POWDER, COMPOSITE MAGNETIC BODY AND COIL COMPONENT
A method for producing a composite magnetic body includes: pressure molding a metal magnetic material into a predetermined shape, the metal magnetic material being an Fe—Si-based metal magnetic material; performing a primary heat treatment of heating the metal magnetic material in an atmosphere with a first oxygen partial pressure to form an Si oxide coating film on a surface of the metal magnetic material; and performing a secondary heat treatment of heating the metal magnetic material that has undergone the primary heat treatment in an atmosphere with a second oxygen partial pressure, which is higher than the first oxygen partial pressure, to form an Fe oxide layer at least partially on a surface of the Si oxide coating film.
METHOD FOR PRODUCING COMPOSITE MAGNETIC BODY, MAGNETIC POWDER, COMPOSITE MAGNETIC BODY AND COIL COMPONENT
A method for producing a composite magnetic body includes: pressure molding a metal magnetic material into a predetermined shape, the metal magnetic material being an Fe—Si-based metal magnetic material; performing a primary heat treatment of heating the metal magnetic material in an atmosphere with a first oxygen partial pressure to form an Si oxide coating film on a surface of the metal magnetic material; and performing a secondary heat treatment of heating the metal magnetic material that has undergone the primary heat treatment in an atmosphere with a second oxygen partial pressure, which is higher than the first oxygen partial pressure, to form an Fe oxide layer at least partially on a surface of the Si oxide coating film.