Process for formation of composite coatings and composite coatings formed thereby. A process for formation of a metal-matrix composite coating on a surface of a substrate is provided. The substrate is an aluminum alloy. The metal-matrix composite coating is formed on the substrate through laser deposition using filler materials comprising aluminum, silicon and graphite. The particles forming the metal-matrix composite coating are formed in-situ from the filler materials. A metal-matrix composite coating obtained by the laser deposition process with in-situ formation of particles is also provided.

Process for formation of composite coatings and composite coatings formed thereby. A process for formation of a metal-matrix composite coating on a surface of a substrate is provided. The substrate is an aluminum alloy. The metal-matrix composite coating is formed on the substrate through laser deposition using filler materials comprising aluminum, silicon and graphite. The particles forming the metal-matrix composite coating are formed in-situ from the filler materials. A metal-matrix composite coating obtained by the laser deposition process with in-situ formation of particles is also provided.

The present invention provides a thick-film paste for printing the front side of a solar cell device having one or more insulating layers. The thick film paste comprises an electrically conductive metal, and a lead-tellurium-lithium-oxide dispersed in an organic medium.

The present invention provides a thick-film paste for printing the front side of a solar cell device having one or more insulating layers. The thick film paste comprises an electrically conductive metal, and a lead-tellurium-lithium-oxide dispersed in an organic medium.

[Object] There is provided a porous sintered body has a uniform porosity, a high level of freedom in body formation which allows formation into varieties shapes and various levels of porosity, and a very large surface area. [Solution] The porous sintered body includes: hollow cores which follow a vanished shape of an interlaced or otherwise structured fibriform vanisher material; sintered walls 226 which extend longitudinally of the cores and obtained by sintering a first sintering powder held around the cores; and voids formed between the sintered walls. The cores and the voids communicate with each other via absent regions formed in the sintered walls. The sintered walls have surfaces formed with a sintered microparticulate layer 232 made from a material containing a second sintering powder which has a smaller diameter than the first sintering powder, and has predetermined pores 231.

The metal thin film production method of the present invention includes, in the following order, the steps of: preparing a substrate (1) having thereon an underlayer (2) formed of an insulating resin; subjecting a surface of the underlayer (2) to a physical surface treatment for breaking bonds of organic molecules constituting the insulating resin; subjecting the substrate (1) to a heat treatment at a temperature of 200° C. or lower; applying a metal nanoparticle ink to the underlayer (2); and sintering metal nanoparticles contained in the metal nanoparticle ink at a temperature equal to or higher than a glass transition temperature of the underlayer (2). A fused layer (4) having a thickness of 100 nm or less is formed between the underlayer (2) and a metal thin film (3) formed by sintering the metal nanoparticles.

The metal thin film production method of the present invention includes, in the following order, the steps of: preparing a substrate (1) having thereon an underlayer (2) formed of an insulating resin; subjecting a surface of the underlayer (2) to a physical surface treatment for breaking bonds of organic molecules constituting the insulating resin; subjecting the substrate (1) to a heat treatment at a temperature of 200° C. or lower; applying a metal nanoparticle ink to the underlayer (2); and sintering metal nanoparticles contained in the metal nanoparticle ink at a temperature equal to or higher than a glass transition temperature of the underlayer (2). A fused layer (4) having a thickness of 100 nm or less is formed between the underlayer (2) and a metal thin film (3) formed by sintering the metal nanoparticles.

A method for forming a metallization structure is provided, including forming a metallic powder layer on a substrate; performing a first laser sintering on a first portion of the metallic powder layer to form a metal layer; and in the presence of oxygen, performing a second laser sintering on a second portion of the metallic powder layer to form a metal oxide layer to serve as a first dielectric layer.

A method for forming a metallization structure is provided, including forming a metallic powder layer on a substrate; performing a first laser sintering on a first portion of the metallic powder layer to form a metal layer; and in the presence of oxygen, performing a second laser sintering on a second portion of the metallic powder layer to form a metal oxide layer to serve as a first dielectric layer.

On aspect is a housing for an implantable medical device, including a first portion of metal and having integrated features and a second portion also of metal. The first and second portions are sealed together thereby forming the housing with an internal space that is within first and second portions and that fully contains the features such that they are hermetically sealed relative to an external space outside the housing.