A method of selective deposition-based additive manufacturing includes conveying a layer (28) of material to previously built layers (22) of material. A determination is made as to whether at least one of the conveyed layers (28) of material and a top previously built layer (22) of material contains an unsupported portion (302). When at least one of the conveyed layer (28) of material and the top previously built layer (22) of material contains an unsupported portion, a first set of steps (306, 408, 506) are used to transfer the conveyed layer (28) of material to the top previously built layer (22) of material. When neither of the conveyed layer (28) of material and the top previously built layer (22) of material contains an unsupported portion, a second set of steps (304, 406, 504) are used to transfer the conveyed layer (28) of material to the top previously built layer (22) of material.

The present disclosure relates to a process of manufacturing an article comprising at least one body of a cemented carbide and at least one body of a metal alloy or at least one body of a metal matrix composite and to a product manufactured thereof and wherein the article also comprises an interlayer between the at least one body of a cemented carbide and at least one body of a metal alloy or at least one body of a metal matrix composite in order to prevent deleterious interface phases from forming.

Porous biocompatible structures suitable for use as medical implants and methods for fabricating such structures are disclosed. The disclosed structures may be fabricated using rapid manufacturing techniques. The disclosed porous structures each have a plurality of struts and nodes where no more than two struts intersect one another to form a node. Further, the nodes can be straight, curved, and can include portions that are curved and/or straight. The struts and nodes can form cells that can be fused or sintered to at least one other cell to form a continuous reticulated structure for improved strength while providing the porosity needed for tissue and cell in-growth.

An electronic component includes a body made of an insulator, a coating film covering the body, a conductor located in the body, and outer electrodes each of which is connected to the conductor. The insulator contains a magnetic metal powder. The coating film is composed of resin and cations of a metal which is a cationic element contained in the insulator and which has a standard electrode potential E0 of less than about 0 V.

An electronic component includes a body made of an insulator, a coating film covering the body, a conductor located in the body, and outer electrodes each of which is connected to the conductor. The insulator contains a magnetic metal powder. The coating film is composed of resin and cations of a metal which is a cationic element contained in the insulator and which has a standard electrode potential E0 of less than about 0 V.

A method of impregnating voids of a sintered metal body having a porous structure with resin, the method comprising preparing a resin material that contains a defoamer containing hydrophilic or hydrophobic particles, defoaming the prepared resin material by reducing pressure of the resin material, applying the defoamed resin material onto a surface of the sintered metal body, impregnating the voids with the resin material by reducing pressure of the sintered metal body and the resin material applied to the surface of the sintered metal body so as to expel gas from the voids; and curing the resin material by heating.

A method of impregnating voids of a sintered metal body having a porous structure with resin, the method comprising preparing a resin material that contains a defoamer containing hydrophilic or hydrophobic particles, defoaming the prepared resin material by reducing pressure of the resin material, applying the defoamed resin material onto a surface of the sintered metal body, impregnating the voids with the resin material by reducing pressure of the sintered metal body and the resin material applied to the surface of the sintered metal body so as to expel gas from the voids; and curing the resin material by heating.

A multi-layered material is provided for shielding low-frequency electromagnetic waves. The multi-layered material may include a plurality of repeating sets of alternating layers of materials. Each repeating set of alternating layers may include an electrically conductive layer and a magnetic layer including a continuous layer of a magnetic material. The multi-layered material is generally configured to shield electromagnetic waves having a frequency of less than about 1 MHz. In various aspects, the electrically conductive layer may include a conductive metal layer, or a two-dimensional transitional metal carbide. The multi-layered material may be provided as a thin film, or can be shaped or sized as flakes for use with a resin composite that is deposited via a spray application technique.

A bonding structure includes: a plurality of carbon nanotubes; a first bonded member; and a first metal sintered compact bonding first end portions of the plurality of carbon nanotubes and the first bonded member, wherein the first metal sintered compact enters spaces between the first end portions of the plurality of carbon nanotubes, and bonds to the plurality of carbon nanotubes while covering side faces and end faces of the first end portions of the plurality of carbon nanotubes.

A bonding structure includes: a plurality of carbon nanotubes; a first bonded member; and a first metal sintered compact bonding first end portions of the plurality of carbon nanotubes and the first bonded member, wherein the first metal sintered compact enters spaces between the first end portions of the plurality of carbon nanotubes, and bonds to the plurality of carbon nanotubes while covering side faces and end faces of the first end portions of the plurality of carbon nanotubes.