A production method for silver fine particles retain capabilities such as conductivity and make it possible to form wiring at even lower temperatures; and silver fine particles. A silver fine particle production method in which silver powder is used to produce silver fine particles by means of a gas phase method. The silver fine particle production method has a step for supplying an organic acid to the silver fine particles. The gas phase method is, for example, a plasma method or a flame method. The silver fine particles have a surface coating that includes at least a carboxyl group.

A production method for silver fine particles retain capabilities such as conductivity and make it possible to form wiring at even lower temperatures; and silver fine particles. A silver fine particle production method in which silver powder is used to produce silver fine particles by means of a gas phase method. The silver fine particle production method has a step for supplying an organic acid to the silver fine particles. The gas phase method is, for example, a plasma method or a flame method. The silver fine particles have a surface coating that includes at least a carboxyl group.

A production method for silver fine particles retain capabilities such as conductivity and make it possible to form wiring at even lower temperatures; and silver fine particles. A silver fine particle production method in which silver powder is used to produce silver fine particles by means of a gas phase method. The silver fine particle production method has a step for supplying an organic acid to the silver fine particles. The gas phase method is, for example, a plasma method or a flame method. The silver fine particles have a surface coating that includes at least a carboxyl group.

A plasma atomization metal powder manufacturing process includes providing a heated metal source and contacting the heated metal source with the plasma of at least one plasma source under conditions effective for causing atomization of the heated metal source. The atomization may be carried out using a gas to metal ratio of less than about 20, thereby obtaining a raw metal powder having a 0-106 μm particle size distribution yield of at least 80%. The process may further include aligning the heated metal source with the plasma of at least one plasma source. An atomizing system may include an alignment system positioned upstream of the plasma source and adapted to adjust an orientation of the metal source relative to the at least one plasma source.

A plasma atomization metal powder manufacturing process includes providing a heated metal source and contacting the heated metal source with the plasma of at least one plasma source under conditions effective for causing atomization of the heated metal source. The atomization may be carried out using a gas to metal ratio of less than about 20, thereby obtaining a raw metal powder having a 0-106 μm particle size distribution yield of at least 80%. The process may further include aligning the heated metal source with the plasma of at least one plasma source. An atomizing system may include an alignment system positioned upstream of the plasma source and adapted to adjust an orientation of the metal source relative to the at least one plasma source.

A plasma atomization metal powder manufacturing process includes providing a heated metal source and contacting the heated metal source with the plasma of at least one plasma source under conditions effective for causing atomization of the heated metal source. The atomization may be carried out using a gas to metal ratio of less than about 20, thereby obtaining a raw metal powder having a 0-106 μm particle size distribution yield of at least 80%. The process may further include aligning the heated metal source with the plasma of at least one plasma source. An atomizing system may include an alignment system positioned upstream of the plasma source and adapted to adjust an orientation of the metal source relative to the at least one plasma source.

There is provided a method of manufacturing nanoparticles comprising the steps of feeding a core precursor into a plasma torch in a plasma reactor, thereby producing a vapor of silicon or alloy thereof; and allowing the vapor to migrate to a quenching zone of the plasma reactor, thereby cooling the vapor and allowing condensation of the vapor into a nanoparticle core made of the silicon or alloy thereof, wherein the quenching gas comprises a passivating gas precursor that reacts with the surface of the core in the quenching zone produce a passivation layer covering the core, thereby producing said nanoparticles. The present invention also relates to nanoparticles comprising a core covered with a passivation layer, the core being made of silicon or an alloy thereof, as well as their use, in particular in the manufacture of anodes.

There is provided a method of manufacturing nanoparticles comprising the steps of feeding a core precursor into a plasma torch in a plasma reactor, thereby producing a vapor of silicon or alloy thereof; and allowing the vapor to migrate to a quenching zone of the plasma reactor, thereby cooling the vapor and allowing condensation of the vapor into a nanoparticle core made of the silicon or alloy thereof, wherein the quenching gas comprises a passivating gas precursor that reacts with the surface of the core in the quenching zone produce a passivation layer covering the core, thereby producing said nanoparticles. The present invention also relates to nanoparticles comprising a core covered with a passivation layer, the core being made of silicon or an alloy thereof, as well as their use, in particular in the manufacture of anodes.

Provided are copper microparticles which have exceptional oxidation resistance, in which oxidation is reduced even when the copper microparticles are held at a firing temperature in an oxygen-containing atmosphere, and in which sintering also occurs. The copper microparticles have a particle diameter of 10-100 nm, have a surface coating material, and are such that, after the copper microparticles are held for one hour at a temperature of 400° C. in an oxygen-containing atmosphere, the particle diameter exceeds 100 nm while a copper state is retained.

Provided are copper microparticles which have exceptional oxidation resistance, in which oxidation is reduced even when the copper microparticles are held at a firing temperature in an oxygen-containing atmosphere, and in which sintering also occurs. The copper microparticles have a particle diameter of 10-100 nm, have a surface coating material, and are such that, after the copper microparticles are held for one hour at a temperature of 400° C. in an oxygen-containing atmosphere, the particle diameter exceeds 100 nm while a copper state is retained.