Patent classifications
B22F9/12
NOVEL ADDITIVE NANOMANUFACTURING SYSTEM AND METHOD
A device including a chamber and a nozzle detachably connected to the chamber, the nozzle defining an aperture, a target carousel disposed within the chamber, a first laser configured to generate a first beam directed toward the target carousel to perform in-situ ablation to form a laser plume, a gas flow system configured to supply gas into the chamber, such that the gas interacts with the laser plume and causes condensation and formation of nanoparticles, and a second laser configured to generate a second beam directed through the interior of the chamber, through the aperture of the nozzle, and toward a substrate disposed outside the device, the second laser beam configured to sinter and crystalize on the substrate the nanoparticles exiting the nozzle.
COPPER MICROPARTICLES
Provided are copper microparticles which have exceptional oxidation resistance, in which oxidation is reduced even when the copper microparticles are held at a firing temperature in an oxygen-containing atmosphere, and in which sintering also occurs. The copper microparticles have a particle diameter of 10-100 nm, have a surface coating material, and are such that, after the copper microparticles are held for one hour at a temperature of 400 C. in an oxygen-containing atmosphere, the particle diameter exceeds 100 nm while a copper state is retained.
COPPER MICROPARTICLES
Provided are copper microparticles which have exceptional oxidation resistance, in which oxidation is reduced even when the copper microparticles are held at a firing temperature in an oxygen-containing atmosphere, and in which sintering also occurs. The copper microparticles have a particle diameter of 10-100 nm, have a surface coating material, and are such that, after the copper microparticles are held for one hour at a temperature of 400 C. in an oxygen-containing atmosphere, the particle diameter exceeds 100 nm while a copper state is retained.
SILVER FINE PARTICLE PRODUCTION METHOD AND SILVER FINE PARTICLES
Provided are: a production method for silver fine particles that retain capabilities such as conductivity and make it possible to form wiring at even lower temperatures; and silver fine particles. A silver fine particle production method in which silver powder is used to produce silver fine particles by means of a gas phase method. The silver fine particle production method has a step for supplying an organic acid to the silver fine particles. The gas phase method is, for example, a plasma method or a flame method. The silver fine particles have a surface coating that includes at least a carboxyl group.
SILVER FINE PARTICLE PRODUCTION METHOD AND SILVER FINE PARTICLES
Provided are: a production method for silver fine particles that retain capabilities such as conductivity and make it possible to form wiring at even lower temperatures; and silver fine particles. A silver fine particle production method in which silver powder is used to produce silver fine particles by means of a gas phase method. The silver fine particle production method has a step for supplying an organic acid to the silver fine particles. The gas phase method is, for example, a plasma method or a flame method. The silver fine particles have a surface coating that includes at least a carboxyl group.
SILVER FINE PARTICLE PRODUCTION METHOD AND SILVER FINE PARTICLES
Provided are: a production method for silver fine particles that retain capabilities such as conductivity and make it possible to form wiring at even lower temperatures; and silver fine particles. A silver fine particle production method in which silver powder is used to produce silver fine particles by means of a gas phase method. The silver fine particle production method has a step for supplying an organic acid to the silver fine particles. The gas phase method is, for example, a plasma method or a flame method. The silver fine particles have a surface coating that includes at least a carboxyl group.
METALLIC POWDERS FOR USE AS ELECTRODE MATERIAL IN MULTILAYER CERAMIC CAPACITORS AND METHOD OF MANUFACTURING AND OF USING SAME
The present disclosure generally relates to metallic powders for use in multilayer ceramic capacitors, to multilayer ceramic capacitors containing same and to methods of manufacturing such powders and capacitors. The disclosure addresses the problem of having better controlled smaller particle size distribution, with minimal contaminant contents which can be implemented at an industrial scale.
METALLIC POWDERS FOR USE AS ELECTRODE MATERIAL IN MULTILAYER CERAMIC CAPACITORS AND METHOD OF MANUFACTURING AND OF USING SAME
The present disclosure generally relates to metallic powders for use in multilayer ceramic capacitors, to multilayer ceramic capacitors containing same and to methods of manufacturing such powders and capacitors. The disclosure addresses the problem of having better controlled smaller particle size distribution, with minimal contaminant contents which can be implemented at an industrial scale.
APPARATUS FOR THE PRODUCTION OF NANOPARTICLES AND METHOD FOR PRODUCING NANOPARTICLES
An apparatus for the production of nanoparticles is provided. The apparatus includes a main tube that is closed at a bottom, an inlet channel arranged within the main tube and includes a first opening to the outside of the apparatus and a second opening to the main tube, and a main opening in the main tube. The main tube includes a sample position at the bottom, the cross section of the main tube at the sample position is smaller than at other positions of the main tube, and the second opening of the inlet channel is arranged closer to the sample position than the main opening. Furthermore, an arrangement for the production of nanoparticles and a method for producing nanoparticles are provided.
Extreme creep resistant nano-crystalline metallic materials
Novel metallic systems and methods for their fabrication provide an extreme creep-resistant nano-crystalline metallic material. The material comprises a matrix formed of a solvent metal with crystalline grains having diameters of no more than about 500 nm, and a plurality of dispersed metallic particles formed on the basis of a solute metal in the solvent metal matrix and having diameters of no more than about 200 nm. The particle density along the grain boundary of the matrix is as high as about 2 nm.sup.2 of grain boundary area per particle so as to substantially block grain boundary motion and rotation and limit creep at temperatures above 35% of the melting point of the material.