A printer includes a heat control device configured to cause a temperature of a part that is printed by the printer to remain within a predetermined range as a height of the part increases from about 0 mm to about 30 mm. The predetermined range is from about 545° C. to about 600° C. The heat control device includes a heat plate that is configured to generate heat in a downward direction toward the part.

A printer includes a heat control device configured to cause a temperature of a part that is printed by the printer to remain within a predetermined range as a height of the part increases from about 0 mm to about 30 mm. The predetermined range is from about 545° C. to about 600° C. The heat control device includes a heat plate that is configured to generate heat in a downward direction toward the part.

In the context of additive manufacturing processes wherein an object is built by layered accumulations of discrete instantaneous deposits of feedstock material at specific locations according to a three-dimensional digital data model, systems and methods are taught for operating multiple independently-moving depositing devices in a shared build space to build the object. In some embodiments, depositing components perform discrete material depositing actions according to sequential lists of deposit location instructions which are dynamically sortable, enabling a control methodology to alleviate collision risks among depositing components and to improve thermal conditions of a workpiece during construction. Further embodiments provide for dynamic apportionment of discrete deposition actions among the available depositing devices for load balancing and fault tolerance.

In the context of additive manufacturing processes wherein an object is built by layered accumulations of discrete instantaneous deposits of feedstock material at specific locations according to a three-dimensional digital data model, systems and methods are taught for operating multiple independently-moving depositing devices in a shared build space to build the object. In some embodiments, depositing components perform discrete material depositing actions according to sequential lists of deposit location instructions which are dynamically sortable, enabling a control methodology to alleviate collision risks among depositing components and to improve thermal conditions of a workpiece during construction. Further embodiments provide for dynamic apportionment of discrete deposition actions among the available depositing devices for load balancing and fault tolerance.

The invention aims to provide a contactless method to create small conductive tracks on a substrate. To this end a method is provided for selective material deposition, comprising depositing a first material on a substrate; followed by solidifying the first material selectively in a first solidified pattern by one or more energy beams; and followed by propelling non-solidified material away from the substrate by a large area photonic exposure, controlled in timing, energy and intensity to leave the solidified first pattern of the first material.

The invention aims to provide a contactless method to create small conductive tracks on a substrate. To this end a method is provided for selective material deposition, comprising depositing a first material on a substrate; followed by solidifying the first material selectively in a first solidified pattern by one or more energy beams; and followed by propelling non-solidified material away from the substrate by a large area photonic exposure, controlled in timing, energy and intensity to leave the solidified first pattern of the first material.

The invention aims to provide a contactless method to create small conductive tracks on a substrate. To this end a method is provided for selective material deposition, comprising depositing a first material on a substrate; followed by solidifying the first material selectively in a first solidified pattern by one or more energy beams; and followed by propelling non-solidified material away from the substrate by a large area photonic exposure, controlled in timing, energy and intensity to leave the solidified first pattern of the first material.

The invention relates to a process for manufacturing a part comprising a formation of successive solid metal layers (201 . . . 20n) that are stacked on top of one another, each layer describing a pattern defined using a numerical model (M), each layer being formed by the deposition of a metal (25), referred to as solder, the solder being subjected to an input of energy so as to start to melt and to constitute, by solidifying, said layer, wherein the solder takes the form of a powder (25), the exposure of which to an energy beam (32) results in melting followed by solidification so as to form a solid layer (201 . . . 20n). The process is characterized in that the solder (25) is an aluminum alloy comprising at least the following alloy elements: —Fe, in a weight fraction of from 1 to 3.7%, preferably from 1 to 3.6%; —Zr and/or Hf and/or Er and/or Sc and/or Ti, in a weight fraction of from 0.5 to 4%, preferably from 1 to 4%, more preferably from 1.5 to 3.5%, even more preferably from 1.5 to 2% each, and in a weight fraction of less than or equal to 4%, preferably less than or equal to 3%, more preferably less than or equal to 2% in total; —Si, in a weight fraction of from 0 to 4%, preferably from 0.5 to 3%; —V, in a weight fraction of from 0 to 4%, preferably from 0.5 to 3%. The invention also relates to a part obtained by this process. The alloy used in the additive manufacturing process according to the invention makes it possible to obtain parts having remarkable features.

The invention relates to a process for manufacturing a part comprising a formation of successive solid metal layers (201 . . . 20n) that are stacked on top of one another, each layer describing a pattern defined using a numerical model (M), each layer being formed by the deposition of a metal (25), referred to as solder, the solder being subjected to an input of energy so as to start to melt and to constitute, by solidifying, said layer, wherein the solder takes the form of a powder (25), the exposure of which to an energy beam (32) results in melting followed by solidification so as to form a solid layer (201 . . . 20n). The process is characterized in that the solder (25) is an aluminum alloy comprising at least the following alloy elements: —Fe, in a weight fraction of from 1 to 3.7%, preferably from 1 to 3.6%; —Zr and/or Hf and/or Er and/or Sc and/or Ti, in a weight fraction of from 0.5 to 4%, preferably from 1 to 4%, more preferably from 1.5 to 3.5%, even more preferably from 1.5 to 2% each, and in a weight fraction of less than or equal to 4%, preferably less than or equal to 3%, more preferably less than or equal to 2% in total; —Si, in a weight fraction of from 0 to 4%, preferably from 0.5 to 3%; —V, in a weight fraction of from 0 to 4%, preferably from 0.5 to 3%. The invention also relates to a part obtained by this process. The alloy used in the additive manufacturing process according to the invention makes it possible to obtain parts having remarkable features.

The invention relates to a process for manufacturing a part comprising a formation of successive solid metal layers (201 . . . 20n) that are stacked on top of one another, each layer describing a pattern defined using a numerical model (M), each layer being formed by the deposition of a metal (25), referred to as solder, the solder being subjected to an input of energy so as to start to melt and to constitute, by solidifying, said layer, wherein the solder takes the form of a powder (25), the exposure of which to an energy beam (32) results in melting followed by solidification so as to form a solid layer (201 . . . 20n). The process is characterized in that the solder (25) is an aluminum alloy comprising at least the following alloy elements: —Fe, in a weight fraction of from 1 to 3.7%, preferably from 1 to 3.6%; —Zr and/or Hf and/or Er and/or Sc and/or Ti, in a weight fraction of from 0.5 to 4%, preferably from 1 to 4%, more preferably from 1.5 to 3.5%, even more preferably from 1.5 to 2% each, and in a weight fraction of less than or equal to 4%, preferably less than or equal to 3%, more preferably less than or equal to 2% in total; —Si, in a weight fraction of from 0 to 4%, preferably from 0.5 to 3%; —V, in a weight fraction of from 0 to 4%, preferably from 0.5 to 3%. The invention also relates to a part obtained by this process. The alloy used in the additive manufacturing process according to the invention makes it possible to obtain parts having remarkable features.