A three-dimensional shaped article production method includes a layer formation step of forming a layer by ejecting a composition containing particles and a solvent in a predetermined pattern using a dispenser, a measurement step of determining the height of the layer, and a bonding step of subjecting a stacked body including a plurality of layers to a bonding treatment for bonding the particles, wherein when n represents an arbitrary integer of 1 or more, by selecting driving waveform data for the dispenser when ejecting the composition from a data group including a plurality of pieces of driving waveform data based on the information of the height of the layer in the n-th position (n-th layer) determined in the measurement step, the ejection amount of the composition per unit area onto the n-th layer in the layer formation step of forming the layer in the (n+1)th position ((n+1)th layer) is adjusted.

A copper/ceramic bonded body includes: a copper member made of copper or a copper alloy; and a ceramic member made of a silicon nitride, wherein the copper member and the ceramic member are bonded to each other, a magnesium oxide layer is provided on a ceramic member side of a bonded interface between the copper member and the ceramic member, a Mg solid solution layer is provided between the magnesium oxide layer and the copper member and contains Mg in a state of a solid solution in a Cu primary phase, and a magnesium nitride phase is present on a magnesium oxide layer side of the Mg solid solution layer.

A process for removing metallic support structures, sinter cakes and/or discharge lugs on an additively manufactured metal component, wherein the metal component is treated electrolytically in an acidic electrolyte, the metal component being operated as an anode for a defined period of time, wherein, during the defined period of time, a higher voltage and then a lower voltage or a higher current density and then a lower current density are alternately applied to the metal component multiple times.

A process for removing metallic support structures, sinter cakes and/or discharge lugs on an additively manufactured metal component, wherein the metal component is treated electrolytically in an acidic electrolyte, the metal component being operated as an anode for a defined period of time, wherein, during the defined period of time, a higher voltage and then a lower voltage or a higher current density and then a lower current density are alternately applied to the metal component multiple times.

Cables, cable connectors, and support structures for cantilever package and/or cable attachment may be fabricated using additive processes, such as a coldspray technique, for integrated circuit assemblies. In one embodiment, cable connectors may be additively fabricated directly on an electronic substrate. In another embodiment, seam lines of cables and/or between cables and cable connectors may be additively fused. In a further embodiment, integrated circuit assembly attachment and/or cable attachment support structures may be additively formed on an integrated circuit assembly.

A camera assembly is employed in additive manufacturing to improve the fidelity of a printed object. The camera may scan the surface of a build plate of a 3D printer and an object as it is being printed to generate image data. The image data is processed to detect errors in the build plate or printed object. The printer compensates for the detected errors, which can including modifying the printer configuration and/or modifying the instructions for printing a given object. Using the updated configuration, subsequent objects may then be printed, under a corrected process, to produce an object with fidelity to an original object model.

In a method for producing a three-dimensional workpiece (12), a first raw material powder (50) is applied to a substrate (18) in order to produce a raw material powder layer consisting of the first raw material powder (50). The raw material powder layer consisting of the first raw material powder (50) is selectively irradiated with electromagnetic radiation or particle radiation in order to produce a solidified first workpiece layer portion (52) from the first raw material powder (50). Non-solidified first raw material powder (50) is then removed from the substrate (18). In the next step, a second raw material powder (54) is applied to the substrate (18), in order to produce a raw material powder layer portion consisting of the second raw material powder (54) adjacent to the first workpiece layer portion (52), The raw material powder layer portion is selectively irradiated with electromagnetic radiation or particle radiation in order to produce a solidified second workpiece layer portion (56) from the second raw material powder (54) adjacent to the first workpiece layer portion (52). The non-solidified second raw material powder (54) is heated in order to produce a continuous porous sintered layer portion (58) from the second raw material powder (54) adjacent to the first workpiece layer portion (52) and the second workpiece layer portion (56).

The disclosure relates to systems and methods for using additive manufacturing (AM) to fabricate printed circuits having side-mounted components and contacts. More specifically, the disclosure is directed to additive manufacturing methods for fabricating electronic components (AME), for example; printed circuit board (PCB), flexible printed circuit (FPC) and high-density interconnect printed circuit board (HDIPCB) (the PCBs, FPCs, and HDIPCB's together referred to as AMEs, or AME circuits), having conductive contacts and/or components along the Z axis of side walls or facets of the each of the printed AMEs.

A structural joint between two components of metal material is obtained by carrying out an electrical resistance welding spot between said components and subsequently performing a step of applying a cladding of metal material by an additive manufacturing technology. In one example, after a first step of applying a coarse base cladding, a second step of applying a fine cladding is carried out, again by additive manufacturing technology. The fine cladding can include a distribution of stiffening micro-ribs above the base cladding. The same method can also be applied to a single sheet metal component, rather than to a welded joint.

The disclosure relates to methods and compositions for direct printing of composite components. Specifically, the disclosure relates to the continuous printing of colored resin and metallic composite components using inkjet printing.