The invention aims to provide a contactless method to create small conductive tracks on a substrate. To this end a method is provided for selective material deposition, comprising depositing a first material on a substrate; followed by solidifying the first material selectively in a first solidified pattern by one or more energy beams; and followed by propelling non-solidified material away from the substrate by a large area photonic exposure, controlled in timing, energy and intensity to leave the solidified first pattern of the first material.

A powder bed fusion apparatus for building an object in a layer-by-layer manner includes a build platform movable within a build sleeve to define a build volume, a layer formation device for forming layers of powder across the build volume in a working plane and an irradiation device for irradiating powder in the working plane to selectively fuse the powder. The powder bed fusion apparatus further includes a mechanical manipulator arranged to engage with the object and/or a build substrate, to which the object is attached, to tilt the object in a raised position above the working plane such that powder is freed from the object and deposited at a location above the working plane and/or into the build volume.

A powder bed fusion apparatus for building an object in a layer-by-layer manner includes a build platform movable within a build sleeve to define a build volume, a layer formation device for forming layers of powder across the build volume in a working plane and an irradiation device for irradiating powder in the working plane to selectively fuse the powder. The powder bed fusion apparatus further includes a mechanical manipulator arranged to engage with the object and/or a build substrate, to which the object is attached, to tilt the object in a raised position above the working plane such that powder is freed from the object and deposited at a location above the working plane and/or into the build volume.

A supply module (2) for supplying additive manufacturing powder comprises: a main hopper (29) for storing additive manufacturing powder, the main hopper (29) being designed to be connected to a manufacturing module (4) configured to additively manufacture an object from the powder; an inlet (211) of the supply module (2) designed to be connected to the manufacturing module (4) and to receive powder located in the manufacturing module (4); a glovebox (25) being able to be closed in a sealed manner; a provisioning circuit configured to transfer powder located in the glovebox (25) to the main hopper (29); and a circulation system designed to set powder in motion according to a circulation loop closed on itself, the circulation system comprising a suction system (21) designed to evacuate gas present in the circulation loop, the circulation loop passing through the main hopper (29) and the suction system (21).

A supply module (2) for supplying additive manufacturing powder comprises: a main hopper (29) for storing additive manufacturing powder, the main hopper (29) being designed to be connected to a manufacturing module (4) configured to additively manufacture an object from the powder; an inlet (211) of the supply module (2) designed to be connected to the manufacturing module (4) and to receive powder located in the manufacturing module (4); a glovebox (25) being able to be closed in a sealed manner; a provisioning circuit configured to transfer powder located in the glovebox (25) to the main hopper (29); and a circulation system designed to set powder in motion according to a circulation loop closed on itself, the circulation system comprising a suction system (21) designed to evacuate gas present in the circulation loop, the circulation loop passing through the main hopper (29) and the suction system (21).

Provision module (2) for providing additive manufacturing powder, comprising a main hopper (29) for storing additive manufacturing powder, the main hopper (29) being designed to be connected to a manufacturing module (4) configured to additively manufacture an object from the powder located in the main hopper (29), an inlet (211) of the provision module (2), which inlet is designed to be connected to the manufacturing module (4) and to receive powder located in the manufacturing module (4), a glovebox (25) designed to receive a container (28), the glovebox (25) being able to be closed in a sealed manner, a supply circuit configured to transfer powder located in the glovebox (25) to the main hopper (29), an extraction circuit that is different from the supply circuit and is configured to transfer additive manufacturing powder from the inlet (211) of the provision module (2) to the container (28), when the container (28) is received in the glovebox (25), the glovebox (25) comprising gloves (251) for closing the container (28) once it has been filled with powder, while the glovebox (25) is closed.

Provision module (2) for providing additive manufacturing powder, comprising a main hopper (29) for storing additive manufacturing powder, the main hopper (29) being designed to be connected to a manufacturing module (4) configured to additively manufacture an object from the powder located in the main hopper (29), an inlet (211) of the provision module (2), which inlet is designed to be connected to the manufacturing module (4) and to receive powder located in the manufacturing module (4), a glovebox (25) designed to receive a container (28), the glovebox (25) being able to be closed in a sealed manner, a supply circuit configured to transfer powder located in the glovebox (25) to the main hopper (29), an extraction circuit that is different from the supply circuit and is configured to transfer additive manufacturing powder from the inlet (211) of the provision module (2) to the container (28), when the container (28) is received in the glovebox (25), the glovebox (25) comprising gloves (251) for closing the container (28) once it has been filled with powder, while the glovebox (25) is closed.

An example of a composition includes a host metal present in an amount ranging from about 95.00 weight percent to about 99.99 weight percent, based on a total weight of the composition. A flow additive is present in an amount ranging from about 0.01 weight percent to about 5.00 weight percent, based on the total weight of the composition. The flow additive consists of a metal containing compound that is reducible to an elemental metal in a reducing environment at a reducing temperature less than or equal to a sintering temperature of the host metal. The elemental metal is capable of being incorporated into a bulk metal phase of the host metal in a final metal object. The composition is spreadable, having a Hausner Ratio less than 1.25.

An example of a composition includes a host metal present in an amount ranging from about 95.00 weight percent to about 99.99 weight percent, based on a total weight of the composition. A flow additive is present in an amount ranging from about 0.01 weight percent to about 5.00 weight percent, based on the total weight of the composition. The flow additive consists of a metal containing compound that is reducible to an elemental metal in a reducing environment at a reducing temperature less than or equal to a sintering temperature of the host metal. The elemental metal is capable of being incorporated into a bulk metal phase of the host metal in a final metal object. The composition is spreadable, having a Hausner Ratio less than 1.25.

A system and method of monitoring a powder-bed additive manufacturing process using a plurality of energy sources is provided. A layer of additive powder is deposited on a powder bed and is fused using a first energy source, a second energy source, or any other suitable number of energy sources. The electromagnetic energy emissions at a first melt pool are monitored by a melt pool monitoring system and recorded as raw emission signals. The melt pool monitoring system may also monitor emissions from the powder bed using off-axis sensors or from a second melt pool using on-axis sensors, and these emissions may be used to modify the raw emission signals to generate compensated emission signals. The compensated emission signals are analyzed to identify outlier emissions and an alert may be provided or a process adjustment may be made when outlier emissions exceed a predetermined signal threshold.