Techniques regarding forming flip chip interconnects are provided. For example, one or more embodiments described herein can comprise a three-dimensionally printed flip chip interconnect that includes an electrically conductive ink material that is compatible with a three-dimensional printing technology. The three-dimensionally printed flip chip interconnect can be located on a metal surface of a semiconductor chip.

A set of multi-mode elastic wave generating and detecting devices and field sensors are utilized in a real-time in-situ monitoring system based on the quality assessment of a specially designed article made by an additive manufacturing machine. The original invention disclosed in U.S. patent application Ser. No. 15/731,366 involves the transmission and reception of waves into a periodic test artifact while it is being built. The current invention involves the transmission and reception of multi-mode waves into a test artifact, the processing of data from narrow and wide field-of-view sensors, and correlating and relating the waveforms and sensor data while it is being built using physics-based and machine learning models. The disclosed system may initiate control and real-time corrective actions based on the properties and characteristics of the obtained waveforms and sensor data and their correlations and functional relationships.

A powder dispensing assembly for an additive manufacturing machine is provided. The powder dispensing assembly includes a housing that defines a powder reservoir that receives additive powder; a first plate removably connectable to the housing, the first plate defining a first discharge orifice having a first discharge orifice geometry; and a second plate removably connectable to the housing, the second plate defining a second discharge orifice having a second discharge orifice geometry different than the first discharge orifice geometry, wherein with the first plate connected to the housing, the additive powder flows out of the first discharge orifice at a first dosing rate, and wherein with the second plate connected to the housing, the additive powder flows out of the second discharge orifice at a second dosing rate different than the first dosing rate.

Devices, systems, and methods for monitoring a powder layer in additive manufacturing are disclosed. A method of monitoring a powder layer includes receiving image data corresponding the powder layer supported by a powder bed within a build chamber from imaging devices, determining leading and trailing regions of interest located adjacent to a leading end and a trailing end of the moving powder distributor, respectively, the leading and trailing regions of interest moving according to movement of the moving powder distributor, selecting at least one point located in the leading region of interest from the image data, determining first characteristics of the point, when the point is located within the trailing region of interest, determining second characteristics of the point, and comparing the first characteristics to the second characteristics.

Devices, systems, and methods for monitoring a powder layer in additive manufacturing are disclosed. A method of monitoring a powder layer includes receiving image data corresponding the powder layer supported by a powder bed within a build chamber from imaging devices, determining leading and trailing regions of interest located adjacent to a leading end and a trailing end of the moving powder distributor, respectively, the leading and trailing regions of interest moving according to movement of the moving powder distributor, selecting at least one point located in the leading region of interest from the image data, determining first characteristics of the point, when the point is located within the trailing region of interest, determining second characteristics of the point, and comparing the first characteristics to the second characteristics.

The present invention relates to a method for the additive manufacture of components (2), wherein a pulverulent or wire-shaped metal construction material is deposited on a platform (4) in layers, melted using a primary heating device (7), in particular using a laser or electron beam (14), and is heated using an induction heating device (8), which has an alternating voltage supply device (9) with an induction generator (16) and at least one induction coil (10) which can be moved above the platform (4). The induction generator (16) is controlled such that the induction generator is driven with a different output at different specified positions of the at least one induction coil (10). The invention additionally relates to a device, to a control method, and to a storage medium.

The present invention relates to a method for the additive manufacture of components (2), wherein a pulverulent or wire-shaped metal construction material is deposited on a platform (4) in layers, melted using a primary heating device (7), in particular using a laser or electron beam (14), and is heated using an induction heating device (8), which has an alternating voltage supply device (9) with an induction generator (16) and at least one induction coil (10) which can be moved above the platform (4). The induction generator (16) is controlled such that the induction generator is driven with a different output at different specified positions of the at least one induction coil (10). The invention additionally relates to a device, to a control method, and to a storage medium.

A method of compensating for sintering warpage due to powder spreading density variations in binder jetting additive manufacturing, including receiving an initial design file defining an object geometry, representing the object geometry as a part mesh and filling the mesh with a grid of voxels to create a voxel grid, each voxel having at least one shrinkage coefficient. For each voxel, determining a distortion factor caused by a powder density variation induced during a powder spreading process and adjusting the at shrinkage coefficient of each voxel according to its respective distortion factor. Next, a shrinkage of the grid of voxels is simulated according to a sintering process. A negative compensation is applied to the voxel grid, according to the simulated shrinkage of the grid of voxels, to form a compensated voxel grid. Lastly, the change in the voxel grid is mapped to the compensated voxel grid onto the part mesh to create a pre-processed compensated part mesh.

A method of compensating for sintering warpage due to powder spreading density variations in binder jetting additive manufacturing, including receiving an initial design file defining an object geometry, representing the object geometry as a part mesh and filling the mesh with a grid of voxels to create a voxel grid, each voxel having at least one shrinkage coefficient. For each voxel, determining a distortion factor caused by a powder density variation induced during a powder spreading process and adjusting the at shrinkage coefficient of each voxel according to its respective distortion factor. Next, a shrinkage of the grid of voxels is simulated according to a sintering process. A negative compensation is applied to the voxel grid, according to the simulated shrinkage of the grid of voxels, to form a compensated voxel grid. Lastly, the change in the voxel grid is mapped to the compensated voxel grid onto the part mesh to create a pre-processed compensated part mesh.

A method of compensating for shrinking and distortion of an object resulting from a manufacturing process. A scan is performed of an object following a manufacturing process to produce scan data. The scan data is aligned to a part mesh of the object. The part mesh is adjusted to substantially coincide with the scan data by moving part mesh vertices. Delta vectors are computed by subtracting initial part mesh vertex positions from final part mesh vertex positions. The inverse of the delta vectors are applied to the preprocessed part mesh to give a scan adjusted pre-processed shape.