A recoating unit for equipping and/or retrofitting a device for producing a three-dimensional object by means of selectively solidifying, layer by layer, of a building material in powder form. The recoating unit is configured, depending on its movement in the first direction or in its opposite direction, to receive building material in that chamber that is the trailing chamber in the respective direction of movement and to spread the building material received in the respective trailing chamber to a uniform layer by means of the respective trailing recoating element.

A device for fabricating a three-dimensional part by selectively melting a powder bed, the device including a first tank for containing a first powder and provided with a first powder dispenser valve, a second tank for containing a second different powder and provided with a second powder dispenser valve, a first and a second monitoring device for monitoring the quantity of first powder delivered by the first valve and the quantity of second powder delivered by the second valve, a mixer chamber in communication with the first and second valves and including a third powder dispenser valve, and a mixer for mixing the powder particles in the chamber, a support for receiving the powder delivered by the third valve and on which the parts is to be fabricated, a powder spreader for spreading powder on the support, and a heater member for locally melting the powder spread on the support.

A device for fabricating a three-dimensional part by selectively melting a powder bed, the device including a first tank for containing a first powder and provided with a first powder dispenser valve, a second tank for containing a second different powder and provided with a second powder dispenser valve, a first and a second monitoring device for monitoring the quantity of first powder delivered by the first valve and the quantity of second powder delivered by the second valve, a mixer chamber in communication with the first and second valves and including a third powder dispenser valve, and a mixer for mixing the powder particles in the chamber, a support for receiving the powder delivered by the third valve and on which the parts is to be fabricated, a powder spreader for spreading powder on the support, and a heater member for locally melting the powder spread on the support.

An additive manufacturing machine (10) comprises a working plane (18) comprising a working zone (20) allowing an overlay of different layers of powder to be received, and a powder dispensing device (32) comprising a powder intake (36) allowing powder to be delivered on top of the working plane. The powder dispensing device (32) comprises a tank (44) of powder mounted to move above the working plane (18) and that can be displaced to under the powder intake (36), the bottom part (45) of the tank (44) comprises a powder dispensing point (P1), and the powder dispensing device (32) comprises a control device (48) controlling the flow of powder via the powder dispensing point during a displacement of the tank. The tank (44) is mounted on a weighing sensor (68).

A three-dimensional fabrication apparatus includes a fabrication chamber in which a fabrication object is formed, a powder supply unit configured to supply powder to the fabrication chamber, a driver configured to scan the powder supply unit above the fabrication chamber, a measurement unit configured to measure a powder supply amount, the powder supply amount being an amount of the powder supplied from the powder supply unit to the fabrication chamber, and circuitry configured to perform a feedback control to control a fluctuation amount of the powder supply amount to be smaller than a preset amount based on the powder supply amount measured by the measurement unit.

A three-dimensional fabrication apparatus includes a fabrication chamber in which a fabrication object is formed, a powder supply unit configured to supply powder to the fabrication chamber, a driver configured to scan the powder supply unit above the fabrication chamber, a measurement unit configured to measure a powder supply amount, the powder supply amount being an amount of the powder supplied from the powder supply unit to the fabrication chamber, and circuitry configured to perform a feedback control to control a fluctuation amount of the powder supply amount to be smaller than a preset amount based on the powder supply amount measured by the measurement unit.

A three-dimensional fabrication apparatus includes a fabrication chamber in which a fabrication object is formed, a powder supply unit configured to supply powder to the fabrication chamber, a driver configured to scan the powder supply unit above the fabrication chamber, a measurement unit configured to measure a powder supply amount, the powder supply amount being an amount of the powder supplied from the powder supply unit to the fabrication chamber, and circuitry configured to perform a feedback control to control a fluctuation amount of the powder supply amount to be smaller than a preset amount based on the powder supply amount measured by the measurement unit.

A printing apparatus is for printing a three-dimensional object having an operative surface; a plurality of supply hoppers for dispensing powder, the powder being adapted to be melted by an energy beam, wherein the supply hoppers are configured to form a plurality of vertically-aligned powder beds adjacent to one another on the operative surface simultaneously; and an energy source for emitting an energy beam onto each powder bed simultaneously to melt or fuse a topmost layer of the powder bed onto an underlying powder bed layer or substrate.

A three-dimensional, additive manufacturing system is disclosed. The first and second printer modules form sequences of first patterned single-layer objects and second patterned single-layer objects on the first and second carrier substrates, respectively. The patterned single-layer objects are assembled into a three-dimensional object on the assembly plate of the assembly station. A controller controls the sequences and patterns of the patterned single-layer objects formed at the printer modules, and a sequence of assembly of the first patterned single-layer objects and the second patterned single-layer objects into the three-dimensional object on the assembly plate. The first transfer module transfers the first patterned single-layer objects from the first carrier substrate to the assembly apparatus in a first transfer zone and the second transfer module transfers the second patterned single-layer objects from the second carrier substrate to the assembly apparatus in a second transfer zone. The first and second printer modules are configured to deposit first and second materials under first and second deposition conditions, respectively. The first and second materials are different and/or the first and second deposition conditions are different.

A three-dimensional, additive manufacturing system is disclosed. The first and second printer modules form sequences of first patterned single-layer objects and second patterned single-layer objects on the first and second carrier substrates, respectively. The patterned single-layer objects are assembled into a three-dimensional object on the assembly plate of the assembly station. A controller controls the sequences and patterns of the patterned single-layer objects formed at the printer modules, and a sequence of assembly of the first patterned single-layer objects and the second patterned single-layer objects into the three-dimensional object on the assembly plate. The first transfer module transfers the first patterned single-layer objects from the first carrier substrate to the assembly apparatus in a first transfer zone and the second transfer module transfers the second patterned single-layer objects from the second carrier substrate to the assembly apparatus in a second transfer zone. The first and second printer modules are configured to deposit first and second materials under first and second deposition conditions, respectively. The first and second materials are different and/or the first and second deposition conditions are different.