B22F12/88

Workpiece processing method

A workpiece processing method is a method for successively processing a plurality of workpieces including a first workpiece and a second workpiece in a single machining area. The workpiece processing method includes: performing additive manufacturing on the second workpiece in the machining area; and performing subtractive manufacturing on the first workpiece in the machining area while keeping on standby the second workpiece on which additive manufacturing is performed. In this way, the workpiece processing method with improved productivity is provided.

LIFTING AND REMOVAL DEVICE FOR ADDITIVE MANUFACTURING SYSTEM

An attachment device for lifting and removing build plates and additive manufactured parts built on the build plates from an additive manufacturing machine. The attachment device may fit onto a lift trolley to cooperatively engage with and lift the build plate upward off of a surface of the additive manufacturing machine. The attachment device may include a support bar, two lifting arms, and a mounting bracket. The support bar may have a slider track formed therethrough, so that the lifting arms can be adjusted to correspond with a width of the build plate. The lifting arms may each having a channel formed along a length thereof and an interfacing portion slidably located within the slider track. The channels may be sized and shaped to engage with a bottom surface and/or opposing edges of the build plates. The mounting bracket may attach to a lifting device of the lift trolley.

CONTROLLING COLD SPRAY DEPOSITION ADHESION FOR INDUCED SUBSTRATE RELEASE

A system and method for controlling cold spray deposit adhesion for induced release of a deposit from a substrate includes tuning a material surface condition of a substrate used to support a build of a cold spray material to a level proportionate with deposition conditions of the cold spray material for adhesion to the substrate; selecting an impact velocity for deposition of the cold spray material to be substantially equal to or greater than a critical velocity for adhesion of the cold spray material to the substrate; depositing the cold spray material on the substrate to form a deposit; and releasing the deposit from the substrate without permanently damaging the substrate to allow for reuse of the substrate for a subsequent cold spray deposition process.

CONTROLLING COLD SPRAY DEPOSITION ADHESION FOR INDUCED SUBSTRATE RELEASE

A system and method for controlling cold spray deposit adhesion for induced release of a deposit from a substrate includes tuning a material surface condition of a substrate used to support a build of a cold spray material to a level proportionate with deposition conditions of the cold spray material for adhesion to the substrate; selecting an impact velocity for deposition of the cold spray material to be substantially equal to or greater than a critical velocity for adhesion of the cold spray material to the substrate; depositing the cold spray material on the substrate to form a deposit; and releasing the deposit from the substrate without permanently damaging the substrate to allow for reuse of the substrate for a subsequent cold spray deposition process.

PLATE MOUNTING IN ADDITIVE MANUFACTURING
20210402480 · 2021-12-30 · ·

Build plate assemblies and their methods of use for an additive manufacturing system are disclosed. In some embodiments, a build plate assembly may include a build plate with a build surface and one or more recesses formed in the build plate. One or more inserts may be inserted into the corresponding one or more recesses of the build plate such that a portion of the one or more inserts are accessible through one or more corresponding openings formed in the build surface associated with the recesses.

PLATE MOUNTING IN ADDITIVE MANUFACTURING
20210402480 · 2021-12-30 · ·

Build plate assemblies and their methods of use for an additive manufacturing system are disclosed. In some embodiments, a build plate assembly may include a build plate with a build surface and one or more recesses formed in the build plate. One or more inserts may be inserted into the corresponding one or more recesses of the build plate such that a portion of the one or more inserts are accessible through one or more corresponding openings formed in the build surface associated with the recesses.

Additive manufacturing system having blade and dispenser on common support

An additive manufacturing system includes a platen, a dispenser apparatus positioned above the platen to dispense a layer of powder over the platen, and an energy source to selectively fuse the layer of powder. The dispenser apparatus includes a support structure, a dispenser secured to the support structure and including a reservoir to hold the powder and one or more openings configured to deliver powder from the reservoir in a linear region that extends along a first axis, a spreader extending along the first axis and secured to the support structure and positioned to spread powder already delivered on the platen by the dispenser, and a drive system to move the support structure along a second axis perpendicular to the first axis such that the dispenser and blade move together to sweep the linear region along the second axis to deposit and level the powder.

POWDER BED FUSION APPARATUS AND METHODS

A powder bed fusion apparatus for building an object in a layer-by-layer manner includes a build platform movable within a build sleeve to define a build volume, a layer formation device for forming layers of powder across the build volume in a working plane and an irradiation device for irradiating powder in the working plane to selectively fuse the powder. The powder bed fusion apparatus further includes a mechanical manipulator arranged to engage with the object and/or a build substrate, to which the object is attached, to tilt the object in a raised position above the working plane such that powder is freed from the object and deposited at a location above the working plane and/or into the build volume.

METHODS AND DEVICES FOR PRODUCING THREE-DIMENSIONAL COMPONENTS BY SELECTIVE SOLIDIFICATION
20210379662 · 2021-12-09 ·

The disclosure relates to methods and devices for producing three-dimensional components by selective solidification from build material applied in layered fashion by providing a building cylinder in which substrate plates are stacked one above the other, applying the build material to the uppermost substrate plate with an application device, generating at least one beam and directing the beam onto the applied layer of the build material, moving the application device along a working plane at least along the building cylinder and at least one collecting chamber for non-solidified build material, and moving the substrate plate out in relation to the building cylinder such that a bottom of the substrate plate lies in the working plane, wherein the substrate plate which has been moved out of the building cylinder is transferred by the application device from the building cylinder into the adjacent collecting chamber.

METHODS AND DEVICES FOR PRODUCING THREE-DIMENSIONAL COMPONENTS BY SELECTIVE SOLIDIFICATION
20210379662 · 2021-12-09 ·

The disclosure relates to methods and devices for producing three-dimensional components by selective solidification from build material applied in layered fashion by providing a building cylinder in which substrate plates are stacked one above the other, applying the build material to the uppermost substrate plate with an application device, generating at least one beam and directing the beam onto the applied layer of the build material, moving the application device along a working plane at least along the building cylinder and at least one collecting chamber for non-solidified build material, and moving the substrate plate out in relation to the building cylinder such that a bottom of the substrate plate lies in the working plane, wherein the substrate plate which has been moved out of the building cylinder is transferred by the application device from the building cylinder into the adjacent collecting chamber.