B22F2301/255

SILVER SINTERING PREPARATION AND THE USE THEREOF FOR THE CONNECTING OF ELECTRONIC COMPONENTS
20220324021 · 2022-10-13 ·

A silver sintering preparation in the form of a silver sintering paste comprising 70 to 95 wt.-% of coated silver particles (A) and 5 to 30 wt.-% of organic solvent (B) or in the form of a silver sintering preform comprising 74.5 to 100 wt.-% of coated silver particles (A) and 0 to 0.5 wt.-% of organic solvent (B), wherein the coating of the coated silver particles (A) comprises silver acetylacetonate (silver 2,4-pentanedionate) and/or at least one silver salt of the formula C.sub.nH.sub.2n+1COOAg with n being an integer in the range of 7 to 10, and wherein the at least one silver salt is thermally decomposable at >160° C.

METHOD FOR PREPARING POWDER MATERIAL AND APPLICATION THEREOF
20230158568 · 2023-05-25 ·

The present disclosure provides a method for preparing a powder material and an application thereof. The preparation method includes: obtaining an initial alloy ribbon including a matrix phase and a dispersed particle phase by solidifying an alloy melt, and then removing the matrix phase in the initial alloy ribbon while retaining the dispersed particle phase, so as to obtain a powder material composed of original dispersed particle phase. The preparation method of the present disclosure is simple in process and can prepare multiple powder materials of nano-level, sub-micron-level and micro-level. The powder materials have good application prospects in the fields such as catalytic materials, powder metallurgy, composite materials, wave-absorbing materials, sterilization materials, metal injection molding, 3D printing and coating.

SILVER POWDER, METHOD FOR PRODUCING THE SAME, AND CONDUCTIVE PASTE
20230159376 · 2023-05-25 · ·

A silver powder containing: silver particles; and an adherent that is attached to surfaces of the silver particles and contains a metal oxide that has a melting point lower than a melting point of silver.

METAL MACROSTRUCTURES
20230112201 · 2023-04-13 ·

The invention includes apparatus and methods for instantiating precious metals in a nanoporous carbon powder.

METHOD OF MAKING SILVER NANOPARTICLES

A method of synthesis of silver nanoparticles (AgNP's) using an orange peel extract is described. The method includes preparing an orange peel extract by cutting a portion of an orange peel into smaller pieces and washing the cut orange peel pieces with de-ionized water to form a washed orange peel. The method further includes boiling the washed orange peel in de-ionized water for at least 3 minutes to form an extract solution and filtering the extract solution from the orange peel to obtain the orange peel extract. The method further includes forming a synthesis mixture of at least one silver salt and the orange peel extract and reacting the silver salt and the orange peel extract to form the silver nanoparticles within 1 minute. The silver nanoparticles find application in detection of mercury ions in an aqueous solution.

Three dimensional chiral nanostructures

A three-dimensional chiral nanostructure according to an embodiment of the present invention comprises: metal nanoparticles having a chiral structure: and a coating layer enclosing the metal nanoparticles. The metal nanoparticle is formed in a polyhedral structure having an R region and an S region in which atoms are arranged clockwise and counterclockwise, respectively, in the order of (111), (100), and (110) crystal faces on the basis of the chiral center, wherein at least a portion of the edges form a curve tilting and extending from the R or S region so that the metal nanoparticle has a chiral structure.

Process and device for low-temperature pressure sintering

Process for producing an electronic subassembly by low-temperature pressure sintering, comprising the following steps: arranging an electronic component on a circuit carrier having a conductor track, connecting the electronic component to the circuit carrier by the low-temperature pressure sintering of a joining material which connects the electronic component to the circuit carrier, characterized in that, to avoid the oxidation of the electronic component or of the conductor track, the low-temperature pressure sintering is carried out in a low-oxygen atmosphere having a relative oxygen content of 0.005 to 0.3%.

Porous substrate with porous nano-particles structure and production method thereof

In the porous substrate loaded with porous nano-particles structure and one-step micro-plasma production method thereof, since the micro-plasma system enhances the electron density and promotes reaction speed in the reaction without generating thermal effect, the method may be performed at an atmosphere environment. The nano-particles also can be quickly obtained by aforementioned micro-plasma system. The electromagnetic field generated by the micro-plasma can drive the nano-particles to be loaded onto the porous substrate in a one step, rapid and low cost process to improve the conventional techniques which require a relatively long procedure time and a complicated process.

SILVER SINTERING COMPOSITION CONTAINING COPPER ALLOY FOR METAL BONDING
20220319733 · 2022-10-06 ·

This invention relates to a silver sintering composition. In particular, the present invention relates to a silver sintering composition containing a copper alloy, which is capable of being stably sintered on various metal substrates such as copper, gold or silver with good adhesion and sintering strength.

ENCAPSULATED PARTICLES
20230141354 · 2023-05-11 ·

The invention relates to an encapsulated metal particle comprising a core encapsulated in a shell, wherein the core comprises a metallic substance, and wherein the shell comprises a insulating substance. The invention also relates to a polymer composition comprising a plurality of the encapsulated metal particles, a mixture comprising a plurality of encapsulated metal particles and plurality of polymer particles, and the use of the encapsulated metal particle as an additive for increasing the thermal conductivity and/or radio frequency (RF) conductivity of a matrix substance such as an adhesive.