A method for coating a metal based component surface wherein said metal based component has an inner and/or outer surface portion that is to be coated, and which surface portion comprises a carbide forming composition. A cavity having one or more cavity walls, wherein said at least one inner and/or outer surface portion forms at least a portion of said one or more cavity walls is provided, and a portion of the cavity is filled with diamond powder. Thereafter gas is removed from the interface between said diamond powder and said at least one inner and/or outer surface portion, and the cavity is subjected to a hot pressing process for a predetermined time at a predetermined pressure and a predetermined temperature such that said diamond powder diffusion bonds to said at least one one inner and/or outer surface portion. Finally at least a part of said diamond powder is removed from said at least one cavity.

A method of producing a heat dissipation substrate, the method including: providing a composite material containing diamond and a metal; performing a treatment on a surface of the composite material to reduce a thickness of the composite material, the treatment forming a processed surface of the composite material; and subsequently, performing pulsed electric current sintering with a pressure of less than 50 MPa applied to the composite material, to heat the composite material.

An abrasive particle can include a body including abrasive particles contained in a bond matrix. The bond matrix can include a first phase and a second phase. In an embodiment, the body can have a Microstructure Feature of greater than 1 and a Non-Bond Value of not greater than 50%. In another embodiment, the body can include a Microstructure Feature including a Spacing Value of at least 0.01.

A diamond sintered material includes diamond grains, wherein a content ratio of the diamond grains is more than or equal to 80 volume % and less than or equal to 99 volume % with respect to the diamond sintered material, an average grain size of the diamond grains is more than or equal to 0.1 μm and less than or equal to 50 μm, and a dislocation density of the diamond grains is more than or equal to 8.1×10.sup.13 m.sup.−2 and less than 1.0×10.sup.16 m.sup.−2.

The inventive concept relates to method for manufacturing a metal based component comprising at least one protrusion. The method comprises: providing a metal based substrate comprising a surface having at least one cavity; providing a metal based protrusion element comprising a first portion and a second portion, wherein said first portion has a shape that conforms to a shape of the cavity; arranging the first portion of the protrusion element in said cavity such that at least the second portion of the protrusion element protrudes at least 5 mm from a surface of the metal based substrate, to form a substrate comprising a protrusion; placing said substrate comprising a protrusion in a canister such that a void is formed between the canister and the surface of the substrate comprising the protrusion; filling at least a portion of the void with a diamond powder such that the surface of the substrate comprising the protrusion is covered by the inert filler material; removing gas from the interface between said diamond powder and said substrate comprising

The invention relates to a method for producing an indexable insert comprising the following steps: a) providing a starting material for use in an additive manufacturing method in several layers of material; and b) bonding each layer of the starting material in the form of an indexable insert.

A superhard polycrystalline construction comprises a body of polycrystalline superhard material formed of a mass of superhard grains exhibiting inter-granular bonding and defining a plurality of interstitial regions therebetween, and a non-superhard phase at least partially filling a plurality of the interstitial regions and having an associated shape factor of greater than around 0.65 and a substrate bonded to the body of superhard material along an interface, the substrate having a region adjacent the interface comprising hinder material in an amount at least 5% less than the remainder of the substrate.

A super hard construction comprises a substrate comprising a peripheral surface, an interface surface and a longitudinal axis extending in a plane and a super hard material layer formed over the substrate and having an exposed outer surface, a peripheral surface extending therefrom and an interface surface. One of the interface surface of the substrate or the interface surface of the super hard material layer comprises one or more projections arranged to project from the interface surface, the one or more projections being spaced from the peripheral surface of the substrate and a peripheral flange extending between the peripheral side edge and the interface surface. The peripheral flange is inclined at an angle of between around 5 degrees to around 30 degrees to a plane substantially perpendicular to the plane through which the longitudinal axis extends.

A mirror support for an optical mirror and a method for producing an optical mirror are disclosed. In an embodiment a mirror support includes a mirror body comprising a diamond particle reinforced aluminum composite material and a polishing layer arranged on the mirror body, wherein a content of diamond particles in the aluminum composite material is between 5% by mass and 50% by mass inclusive and is selected such that a thermal coefficient of linear expansion of the mirror body is adapted to a thermal coefficient of linear expansion of the polishing layer.

A diamond joined body is a diamond joined body including a hard substrate and a polycrystalline diamond layer arranged on the hard substrate, wherein an area ratio of carbon grains in a region of the hard substrate is less than 0.03%, the region being a region enclosed by an interface between the hard substrate and the polycrystalline diamond layer and an imaginary line x in a cross section parallel to a normal direction of the interface, the imaginary line x being parallel to the interface on the hard substrate side and having a distance of 500 μm from the interface.