A metal fine particle dispersion including metal fine particles A, a polyalkylene glycol dialkyl ether B, and a polyol C. A content mass ratio of the polyalkylene glycol dialkyl ether B to the metal fine particles A (polyalkylene glycol dialkyl ether B/metal fine particles A) is not less than 0.5 and not more than 1.5, and the metal fine particles A are dispersed in the dispersion with a dispersant D.

A new seedless synthesis of anisotropic nanoscale gold nanoflower (AuNF) particles uses bidentate thiolate ligands to protect the nanoparticle surface and a combination of reagents (for example, ligand, ascorbic acid, and hydroxide) to synthesis AuNF with controlled size and anisotropic properties. Compared to prior art gold nanospheres, AuNF produced approximately a 15-fold improvement in a drug delivery assay.

Nano-engineered materials for powder metallurgy and workpieces created using the materials. Workpieces include primary phase powders having nano-engineered partial or complete coatings and/or secondary phases adhered to interfaces of their constituent materials. Nano-engineered coatings are provided for metallic, polymeric and/or ceramic powder metallurgy feedstock powders to produce workpieces with superior performance and/or functional benefits, as are methods of manufacturing injection molding and additive manufacturing feedstock powders containing these coatings and additional respective functional benefits.

The invention relates to a method for producing a composite material consisting of a metal and ceramic alloy, comprising steps of: producing a mixture of metal powder and ceramic powder, the particle size of the metal powder being micrometric and the particle size of the ceramic powder being nanometric; and exposing said mixture to a focused energy source that selectively fuses part of a bed of said powder mixture.

Methods for preparing highly stable concentrated dispersions of silver nanoparticles and described herein. Contemplated methods comprise combining a selected polysaccharidic dispersant with a selected non-reacting dispersant to yield concentrated silver dispersions with enhanced stability and lowered undesirable residual organics. Contemplated methods further comprise selecting an appropriate source of silver ions to reduce the ionic strength of the reaction medium and final silver dispersions.

To provide a fine nickel powder for an internal electrode paste of an electronic component, the nickel powder obtained by a wet method and having high crystallinity, excellent sintering characteristics, and heat-shrinking characteristics. The nickel powder is obtained by precipitating nickel by a reduction reaction in a reaction solution including at least water-soluble nickel salt, salt of metal nobler than nickel, hydrazine as a reducing agent, and alkali metal hydroxide as a pH adjusting agent and water; the reaction solution is prepared by mixing a nickel salt solution including the water-soluble nickel salt and the salt of metal nobler than nickel with a mixed reducing agent solution including hydrazine and alkali metal hydroxide; and the hydrazine is additionally added to the reaction solution after a reduction reaction initiates in the reaction solution.

A film-shaped firing material 1 is provided, including sinterable metal particles 10 and a binder component 20, in which a content of the sinterable metal particles 10 is in a range of 15% to 98% by mass, a content of the binder component 20 is in a range of 2% to 50% by mass, a shrinkage factor in a planar direction of the film-shaped firing material after being pressurized and fired under conditions of a temperature of 350° C. and a pressure of 10 MPa for 3 minutes is 10% or less with respect to the shrinkage factor before the firing, and a volume shrinkage factor thereof is in a range of 15% to 90% with respect to the volume shrinkage factor before the firing, and a contact ratio of the film-shaped firing material with an adherend after being pressurized and fired under conditions of a temperature of 350° C. and a pressure of 10 MPa for 3 minutes in a state in which the film-shaped firing material is in contact with the adherend is 90% or greater with respect to a contact area of the adherend.

The present invention is a method for manufacturing silver nanowires, including using a growth control agent and a halide salt in a polyol to obtain silver nanowires from a silver salt, and further using an α-hydroxycarbonyl compound (a) represented by formula (1) below: (in general formula (1), R indicates any of a hydrogen atom and a hydrocarbon group having 1 to 6 carbon atoms). ##STR00001##

Provided is a thermosetting resin composition containing: (A) silver particles including secondary particles having an average particle size from 0.5 to 5.0 μm, the secondary particles being formed by aggregation of primary particles having an average particle size from 10 to 100 nm; and (B) a thermosetting resin.

The present invention provides novel silver particles that when used as a conductive adhesive, are satisfactorily sintered at a low temperature without application of pressure during sintering of the conductive adhesive, and form a sintered body with high denseness and high mechanical strength (shear strength). Silver particles comprising silver particles A with an average particle diameter in the range of 50 to 500 nm, and silver particles B with an average particle diameter in the range of 0.5 to 5.5 μm, wherein the silver particles satisfy a relationship in which the average particle diameter of the silver particles B is 5 to 11 times the average particle diameter of the silver particles A.