Patent classifications
B22F2304/054
SILVER FINE PARTICLE PRODUCTION METHOD AND SILVER FINE PARTICLES
A production method for silver fine particles retain capabilities such as conductivity and make it possible to form wiring at even lower temperatures; and silver fine particles. A silver fine particle production method in which silver powder is used to produce silver fine particles by means of a gas phase method. The silver fine particle production method has a step for supplying an organic acid to the silver fine particles. The gas phase method is, for example, a plasma method or a flame method. The silver fine particles have a surface coating that includes at least a carboxyl group.
AG PASTE COMPOSITION AND BONDING FILM PRODUCED USING SAME
The present disclosure relates to an Ag paste composition and a bonding film produced using same, the Ag paste composition being coated on a first object, and the first object being pressure sintered toward a second object side, thereby forming a sintered bonding layer between the first object and the second object, wherein the Ag paste composition comprises 90˜99 wt % of Ag powder, and 1˜10 wt % of an organic binder. The present disclosure controls the specific surface area and grain shape of the Ag powder, even without applying a spherical nanoparticle powder, and thus has the advantages of lowering a bond temperature and increasing bond density, thereby enabling the improvement of bond strength and reliability.
COPPER FINE PARTICLES, CONDUCTIVE MATERIAL, APPARATUS FOR PRODUCING COPPER FINE PARTICLES, AND METHOD FOR PRODUCING COPPER FINE PARTICLES
One object of the present invention is to provide copper fine particles which have sufficient dispersibility when made into a paste and can be sintered at 150° C. or lower, the present invention provides copper fine particles, wherein the copper fine particles have a coating film containing copper carbonate and cuprous oxide on at least a part of the surface thereof, and a ratio between the following Db and the following Dv (Db/Dv) is in a range of 0.50˜0.90, Dv: an average value (nm) of the area equivalent circle diameter of the copper fine particles obtained by acquiring SEM images for 500 or more copper fine particles using a scanning electron microscope, and calculating by image analysis software, Db: a particle size (nm) of the copper fine particles obtained by measuring a specific surface area (SSA (m.sup.2/g)) of the copper fine particles using a specific surface area meter, and calculating by the following formula (1), Db=6/(SSA×ρ)×10.sup.9 . . . (1) in the formula (1), ρ is a density of copper (g/m.sup.3).
Pure-Phase Cubic Ni1-xMox Alloy Nanoparticles as Low-Cost and Earth Abundant Electrocatalysts
Low-cost and earth abundant, Ni.sub.1−xMo.sub.x alloy nanocrystals, with sizes ranging from 18-43 nm and varying Mo composition (0.0-11.4%), were produced by a colloidal chemistry method for alkaline HER reactions. For a water splitting current density of ˜10 mA/cm.sup.2, these alloys demonstrate over-potentials of −62 to −177 mV, which are comparable to commercial Pt-based electrocatalysts (−68 to −129 mV). The cubic Ni.sub.0.934Mo.sub.0.066 alloy nanocrystals exhibit the highest activity as alkaline HER electrocatalysts, outperforming commercial Pt/C (20 wt %) catalyst.
METHOD FOR MANUFACTURING CONDUCTIVE LAMINATE
An object of the present disclosure is to provide a method for manufacturing a conductive laminate having an excellent steady contact between a conductive layer and an overcoat layer. The present disclosure provides a method for manufacturing a conductive laminate 10 including a substrate 11, a conductive layer 12, and an overcoat layer 13 being laminated, the method including the following Steps: Step A: forming the conductive layer 12 on the substrate 11 using a conductive ink containing a metal nanoparticle and a first ink resin; and Step B: forming the overcoat layer 13 on the conductive layer 12 using an overcoat layer-forming composition, the overcoat layer-forming composition containing an overcoat layer resin and an overcoat layer solvent, the overcoat layer solvent having an SP value, where a difference between the SP value and an SP value of the first ink resin is 1.0 or less in absolute value.
FINE COPPER PARTICLES, METHOD FOR PRODUCING FINE COPPER PARTICLES AND METHOD FOR PRODUCING SINTERED BODY
A method for producing fine copper particles includes producing fine copper particles having a coating film containing cuprous oxide on a surface by heating copper or a copper compound in a reducing flame formed by a burner. The fine copper particles are produced by adjusting a mixing ratio between a combustible gas and a combustion supporting gas which form the reducing flame such that a volume ratio of CO/CO.sub.2 is in a range of 1.5 to 2.4.
Fabrication of palladium-chromium alloy microparticles
Methods for making a plurality of microparticles from a reaction solution that includes an organic acid in a solvent are provided. The method may include adding a chromium salt and a palladium salt to the reaction solution; bringing the reaction solution to a reaction temperature of 0° C. to 150° C. to form palladium cations and chromium cations within the reaction solution such that the palladium cations and chromium cations combine to form the plurality of microparticles that precipitate from the reaction solution; and collecting the microparticles from the reaction mixture. The plurality of microparticles comprises a palladium-chromium alloy. The palladium-chromium alloy may comprise chromium in a weight percentage of 1% to 20% of the total weight of the palladium-chromium alloy.
Antimicrobial Moisture Avoidance Powers and Substances
Described herein is a composition for antimicrobial moisture avoidance powders and substances. Copper and copper alloys have been known to possess antimicrobial activity. Calcium carbonate and magnesium carbonate that is infused with chalk are effective at not only drying the skin and avoiding moisture, but also possess strong antimicrobial activity. According to one embodi-ment, a composition for a moisture avoidance powder comprises copper oxide with one or more of calcium carbonate and magnesium carbonate. The copper oxide may be included in the composition at a minimum ratio of 1 part copper oxide to 1000 parts of the combination mixture of one or more of calcium carbonate and magnesium carbonate. That composition can be combined with alcohol to produce a moisture avoidance substance in a liquid or cream form with antimicrobial properties.
Fine silver particle dispersion
This disclosure relates to a fine silver particle dispersion including: (1) 65 to 95.4% by weight of fine silver particles which have an average primary particle diameter of 10 to 190 nm and which comprise 25% by number or less of silver particles having a primary particle diameter of 100 nm or larger, (2) 4.5 to 34.5% by weight of a solvent, and (3) 0.1 to 1.0% by weight of ethyl cellulose having a weight average molecular weight of 10,000 to 120,000.
Process for producing a beta-alloy titanium niobium zirconium (TNZ) with a very low modulus of elasticity for biomedical applications and its embodiment by additive manufacturing
The invention relates to a forming method of an alloy comprising predominantly Ti β or nearby β stage, comprising the steps of: Preparation of a homogeneous mixture of particle powder comprising micrometric particles of pure Ti and nanoscale particles of at least one additional element or compound promoting the beta phase of the Ti during its cooling from its phase transition temperature. exposing said particle powder mixture to a focused energy source that is selectively heat at least a portion of a bed of said homogeneous powder mixture at a temperature between 850 and 1850° C. cooling of the part having undergone this exposure with conservation of the phase b of the Ti.