An object of the present invention is to provide an electrically conductive paste having excellent bonding strength when bonded to an electronic substrate and the like, a laminated body, and a method for bonding a Cu substrate or Cu electrode to an electrical conductor.

An electrically conductive paste comprising: a flake-like silver powder A having a particle size in the range of 1 μm or more and 15 μm or less and having a median diameter D50 of 2 μm or more and 5 μm or less; a silver powder B having a particle size in the range of 25 μm or more and 100 μm or less and having a median diameter D50 of 30 μm or more and 40 μm or less; a silver powder C having a particle size in the range of 10 nm or more and 190 nm or less and having a median diameter D50 of 50 nm or more and 150 nm or less; and a solvent, wherein the content of the silver powder C is more than 5.0 parts by mass and less than 90.0 parts by mass based on 100 parts by mass in total of the flake-like silver powder A, the silver powder B, and the silver powder C.

Provided herein is a composition for eutectic metal alloy nanoparticles having an average particle size ranging from about 0.5 nanometers to less than about 5000 nanometers and at least one organoamine stabilizer. Also provided herein is a process for preparing eutectic metal alloy nanoparticles comprising mixing at least one organic polar solvent, at least one organoamine stabilizer, and a eutectic metal alloy to create a mixture; sonicating the mixture at a temperature above the melting point of the eutectic metal alloy; and collecting a composition comprising a plurality of eutectic metal alloy nanoparticles having an average particle size ranging from about 0.5 nanometers to less than about 5000 nanometers. Further disclosed herein are hybrid conductive ink compositions comprising a component comprising a plurality of metal nanoparticles and a component comprising a plurality of eutectic metal alloy nanoparticles.

A magnet includes hard magnetic particles containing a rare-earth metal, and a soft magnetic material interposed between the hard magnetic particles to bind together the hard magnetic particles.

A magnet includes hard magnetic particles containing a rare-earth metal, and a soft magnetic material interposed between the hard magnetic particles to bind together the hard magnetic particles.

Devices, systems, and methods are directed to the use of nanoparticles for improving strength fabrication of three-dimensional objects formed through layer-by-layer process in which an ink is delivery of a binder delivered onto successive layers of a powder of inorganic particles in a powder bed. More specifically, nanoparticles of inorganic material can may be introduced into one or more layers of the metal powder in the powder bed and thermally processed to facilitate sinter necking, in the powder bed, of the metal particles forming the three-dimensional object. Such sinter necking in the powder bed can may improve strength of the three-dimensional objects being fabricated and, also or instead, can may reduce the likelihood of defects associated with subsequent processing of the three-dimensional objects (e.g., slumping and shrinking in a final sintering stage and/or inadequate densification of the final part).

A cemented carbide body includes WC in a metallic binder phase. The cemented carbide body has a bulk portion and a surface portion. The grain size of the WC in the surface portion is smaller than the grain size in the bulk portion of the body and this gives an increased surface hardness and an increased wear resistance. The median grain thickness, tg, of WC in the surface portion is 20-300 nm and the average grain size in the bulk portion is 0.5-8 μm. A method of surface hardening a cemented carbide body is also provided.

A caster assembly configured to process and store a material includes a reaction chamber, a storage assembly configured to store material processed in the reaction chamber, and a blower configured to process and store the material. The reaction chamber includes a vessel configured to hold the material in a melted state prior to processing and a powder generating assembly configured to receive the material from the melting vessel. The powder generating assembly includes a feeding chamber and a feeding device disposed at least partially within the feeding chamber. The feeding device includes at least one nozzle configured to inject inert fluid, where the fluid is a gas, liquid, or combination of the two into the feeding chamber and a material inlet through which the material is configured to flow into the feeding chamber to be exposed to the inert fluid, where the fluid is a gas, liquid, or combination of the two.

A three-dimensional printing kit can include a binder fluid and a particulate build material. The particulate build material can include metal particles in an amount from about 95 wt % to about 99.995 wt % and carbon black particles in an amount from about 0.005 wt % to about 2 wt %, wherein weight percentages are based on a total weight of the particulate build material.

Disclosed is a double frame nanoparticle synthesis method including: forming a first platinum layer of a closed loop structure on an edge region of a 2-dimensional gold nanoparticle; removing a portion of the gold nanoparticle in an exposed inner region thereof free of the first platinum layer, thereby forming a single frame structure; growing a first gold thin film on the single frame structure; forming a second platinum layer on inner and outer edge regions of the first gold thin film; removing a portion of the first gold thin film in an exposed region thereof free of the second platinum layer, thereby forming a double frame structure, wherein the double frame structure has an inner frame of a closed loop structure, and an outer frame having a closed loop structure surrounding the inner frame, and partially connected to the inner frame; and forming a second gold thin film on a surface of the double frame structure.

Disclosed is a double frame nanoparticle synthesis method including: forming a first platinum layer of a closed loop structure on an edge region of a 2-dimensional gold nanoparticle; removing a portion of the gold nanoparticle in an exposed inner region thereof free of the first platinum layer, thereby forming a single frame structure; growing a first gold thin film on the single frame structure; forming a second platinum layer on inner and outer edge regions of the first gold thin film; removing a portion of the first gold thin film in an exposed region thereof free of the second platinum layer, thereby forming a double frame structure, wherein the double frame structure has an inner frame of a closed loop structure, and an outer frame having a closed loop structure surrounding the inner frame, and partially connected to the inner frame; and forming a second gold thin film on a surface of the double frame structure.