Patent classifications
B22F2304/058
SILVER POWDER AND METHOD OF PRODUCING SAME
Provided are a silver powder having powder physical properties enabling reduction of volume resistivity after firing and a method of producing this silver powder. The silver powder has a tap density of 4.8 g/mL or more, a TAP/D50 value (value determined by dividing the tap density (g/mL) by the volume-based median diameter (?m)) of not less than 7 and not more than 15, and a specific surface area of not less than 0.75 m.sup.2/g and not more than 1.3 m.sup.2/g.
ALUMINUM ALLOY POWDER AND METHOD OF PRODUCING THE SAME, ALUMINUM ALLOY EXTRUDED MATERIAL AND METHOD OF PRODUCING THE SAME
An aluminum alloy extruded material consists of: Fe: 5.0 mass % to 9.0 mass %; V: 0.1 mass % to 3.0 mass %; Mo: 0.1 mass % to 3.0 mass %; Zr: 0.1 mass % to 2.0 mass %; Ti: 0.02 mass % to 2.0 mass %; one or two kinds of metals selected from the group consisting of Cr and Mn: 0.02 mass % to 2.0 mass %, respectively; and the balance being Al and inevitable impurities, wherein the aluminum alloy extruded material contains an AlFe based intermetallic compound, and wherein in a cross-sectional structure of the aluminum alloy extruded material, an average circle equivalent diameter of the AlFe based intermetallic compound is in a range of 0.1 m to 3.0 m. It is possible to provide an aluminum alloy extruded material excellent in mechanical properties at high temperature.
MATERIAL FOR THIN, SMOOTH, AND HIGH-VELOCITY FLAME SPRAYED COATINGS WITH INCREASED DEPOSITION EFFICIENCY
A thermal spray material feedstock is provided for flash-carbide coatings. Flash carbide coatings are thin, dense, and smooth thermal spray coatings that self-activate the substrate. Flash-carbide coatings form and peen the coating to impart compressive stress for good adhesion and corrosion resistance. To achieve this combination of properties and performance, a powder that includes fine, dense, and angular particles is used; however, this powder alone results in a poor deposition efficiency of typically less than 20%. The present disclosure mitigates the poor deposition efficiency of this powder alone by providing a composition having two or more different particles at a specific ratio to improve deposition efficiency with sufficient optimized stress and corrosion properties and, in some cases, an increase in coating performance.
COPPER PARTICLES AND METHOD FOR MANUFACTURING SAME
Copper particles are provided mainly containing a copper element. In the copper particles, a ratio (S1/B) of a first crystallite size S1 to a particle size B is 0.23 or less, where the first crystallite size is obtained using Scherrer equation from a full width at half maximum of a peak derived from (111) plane of copper in X-ray diffraction measurement, and the particle size is calculated from a BET specific surface area. In the copper particles, a ratio (S1/S2) of the first crystallite size S1 to a second crystallite size S2 is 1.35 or less, where the second crystallite size is obtained using Scherrer equation from a full width at half maximum of a peak derived from (220) plane of copper in X-ray diffraction measurement. A method for manufacturing the copper particles is also provided.
Powder mixtures containing uniform dispersions of ceramic particles in superalloy particles and related methods
Embodiments of a method for producing powder mixtures having uniform dispersion of ceramic particles within larger superalloy particles are provided, as are embodiments of superalloy powder mixtures. In one embodiment, the method includes producing an initial powder mixture comprising ceramic particles mixed with superalloy mother particles having an average diameter larger than the average diameter of the ceramic particles. The initial powder mixture is formed into a consumable solid body. At least a portion of the consumable solid body is gradually melted, while the consumable solid body is rotated at a rate of speed sufficient to cast-off a uniformly dispersed powder mixture in which the ceramic particles are embedded within the superalloy mother particles.
SILVER PARTICLE DISPERSING SOLUTION, METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING CONDUCTIVE FILM USING SILVER PARTICLE DISPERSING SOLUTION
There is provided an inexpensive silver particle dispersing solution being usable as a slurry for ink jet, a method for producing the same, and a method for producing a conductive film using the silver particle dispersing solution. In a silver particle dispersing solution containing a silver powder and a solvent, the silver powder has an average primary particle diameter (D.sub.SEM) of 0.15 to 0.5 m, and the ratio (D.sub.50/D.sub.SEM) of a particle diameter (D.sub.50), which corresponds to 50% of accumulation in volume-based cumulative distribution of the silver powder, to the average primary particle diameter (D.sub.SEM) is not less than 1.7, the silver powder having a fatty acid adhered to the surface thereof, and the solvent containing a monohydric higher alcohol having a carbon number of 6 to 12, butyl carbitol or butyl carbitol acetate as the main component thereof.
Powders based on niobium-tin compounds for producing superconductive components
A powder for the production of a superconducting component. The powder includes Nb.sub.xSn.sub.y, where 1?x?6 and 1?y?5, and three-dimensional agglomerates having a particle size D90 of less than 400 ?m, as determined via a laser light scattering. The three-dimensional agglomerates have primary particles which have an average particle diameter of less than 15 ?m, as determined via a scanning electron microscopy, and pores of which at least 90% have a diameter of from 0.1 to 20 ?m, as determined via a mercury porosimetry.
Indirect additive manufacturing process for fabricating bonded soft magnets
A bonded soft magnet object comprising bonded soft magnetic particles of an iron-containing alloy having a soft magnet characteristic, wherein the bonded soft magnetic particles have a particle size of at least 200 nm and up to 100 microns. Also described herein is a method for producing the bonded soft magnet by indirect additive manufacturing (IAM), such as by: (i) producing a soft magnet preform by bonding soft magnetic particles with an organic binder, wherein the magnetic particles have an iron-containing alloy composition with a soft magnet characteristic, and wherein the particles of the soft magnet material have a particle size of at least 200 nm and up to 100 microns; (ii) subjecting the preform to an elevated temperature sufficient to remove the organic binder to produce a binder-free preform; and (iii) sintering the binder-free preform at a further elevated temperature to produce the bonded soft magnet.
PASTE COMPOSITION, SEMICONDUCTOR DEVICE, ELECTRICAL COMPONENT AND ELECTRONIC COMPONENT
A paste composition including first copper particles, wherein the first copper particles are formed by covering copper particles serving as a base material with at least one type of compound selected from the group consisting of an amine compound (a) and a carboxylic acid amine salt (b), and a total content of the amine compound (a) and the carboxylic acid amine salt (b) detected in the paste composition is less than 1 mass % of an entire amount of the paste composition.
Selective Modification of Nanoparticle Structures
Systems and methods for selective modification of nanoparticle structures are described. The selective modification processes include applying a localized heat source to the deposited nanoparticle structures and removing the areas that are not activated by the localized heat.