A method for simultaneously cutting a multiplicity of slices from a cylindrical workpiece, along strictly convex cutting faces, by supplying a suspension of hard substances in a carrier liquid, as cutting medium, to wire portions, while the wire portions, having a longitudinal tension, define a relative motion to the workpiece as a result of wire guide roller rotation with continual alternation between a first direction of rotation and a second direction of rotation, which is opposite to the first direction of rotation, wherein, during the rotation in the first direction, the wire is moved a first length, and during the rotation in the second direction, the wire is moved a second length, and the second length is shorter than the first, and at the cutting operation start a first longitudinal wire tension is greater than a second longitudinal tension at the end.

Slices are cut from workpieces during a sequence of cut-off operations by a wire saw, having a wire array. The wire array is tensioned in a plane between two wire guide rollers supported between fixed and floating bearings. During each cut-off operation, a workpiece is fed through the wire array perpendicular to a workpiece axis and the wire array plane. The workpiece is fed with simultaneous axial movement of the floating bearings by adjusting a temperature of the fixed bearings in correlation with a first correction profile, which specifies a travel of the floating bearings in dependence on the depth of cut. In dependence on the depth of cut, operating parameters are set, such as the feed rate, an amount of working fluid fed to the wire array per unit time, a temperature of the working fluid, a wire speed, a wire consumption per cut-off operation, or a wire tension.

A method uses a wire saw to cut slices from a workpiece. The wire saw has an array of saw wire tensioned in a plane between two rollers supported between fixed and floating bearings. During a cut-off operation, the workpiece is fed through the wire array with simultaneous axial movement of the floating bearings by adjusting the temperature of the fixed bearings with a cooling fluid in accordance with the temperature of the cooling fluid being in dependence on a depth of cut and correlating with a first correction profile, which specifies the travel of the floating bearings in dependence on the depth of cut. Also, the workpiece is fed through the wire array while simultaneously moving the workpiece along the workpiece axis in accordance with a second correction profile, specifying the travel of the workpiece. The first and second correction profiles are opposed to a shape deviation.

An object of the invention is achieved by a method for cutting an elongated shell-type object. The method may include steps of providing a gantry defining a portal and comprising a wire grid operable in the portal; operating the wire grid, whilst moving the shell-type object through the wire grid along a lateral-axis (Z) substantially perpendicular to the portal. The method is performed by a stationary gantry, where the shell-type object is moved through the portal. Thereby, the method is simplified as there is no need for a rail system for moving the gantry.

A method cuts slices from workpieces using a wire saw with a wire array tensioned in a plane between two wire guide rollers supported between fixed and floating bearings. A workpiece is fed through the wire array perpendicular to a workpiece axis and the wire array plane. The workpiece is fed through the wire array while controlling a temperature of the workpiece with a cooling medium, with simultaneous axial movement of the floating bearings by adjusting a temperature of the fixed bearings in dependence on a depth of cut and in correlation with a first correction profile, and while simultaneously moving the workpiece along the workpiece axis in accordance with a specification of a second correction profile, which specifies a travel of the workpiece. The first correction profile and the second correction profile being opposed to a shape deviation.

A system for slicing wafers from a monocrystalline semiconductor ingot includes a wire saw, a bond beam, the monocrystalline semiconductor ingot, and two sacrificial disks. The wire saw includes a wire web and wire guides operable to drive the wire web during a slicing operation. The bond beam is connected to the wire saw. The wire saw is operable to move the bond beam in a movement direction towards the wire web during the slicing operation to slice the wafers from the ingot. The ingot includes longitudinal end faces and a circumferential edge extending between the longitudinal end faces. The ingot is attached to the bond beam along the circumferential edge. One sacrificial disk is positioned adjacent each of the longitudinal end faces of the ingot to inhibit uncontrolled breakage of the wafers during the slicing operation.