Patent classifications
B23D57/0053
Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes
Slices are cut from workpieces using a wire saw having a wire array tensioned in a plane between two wire guide rollers each supported between fixed and floating bearings and comprising a chamber and a shell enclosing a core and having guide grooves for wires. During a cut-off operation, a workpiece is fed through the wire array perpendicular to a workpiece axis and the wire array plane. The workpiece is fed through the wire array while simultaneously: changing shell lengths by adjusting chamber temperatures in dependence on a depth of cut and a first correction profile; and moving the workpiece along the workpiece axis in accordance with a second correction profile. The correction profiles are opposed to a shape deviation.
Bearing unit with sensorized inner ring
A bearing unit for a marble cutting machine, comprising a radially outer ring, rotatable about an axis of rotation (X) of the bearing unit and provided with a radially outer flange portion; a stationary radially inner ring having a raceway and a through hole; a row of rolling bodies interposed between the radially outer ring and the radially inner ring; a seat formed in the radially inner ring and shaped as a portion of a circular crown; and a sensor fit in the seat, wherein a ratio between an internal diameter (D) of the through hole and an axial thickness (t) of the radially inner ring is between 6.7 and 11.1.
Method for simultaneously cutting a multiplicity of slices of particularly uniform thickness from a workpiece
A method for simultaneously cutting a multiplicity of slices from a cylindrical workpiece, along strictly convex cutting faces, by supplying a suspension of hard substances in a carrier liquid, as cutting medium, to wire portions, while the wire portions, having a longitudinal tension, define a relative motion to the workpiece as a result of wire guide roller rotation with continual alternation between a first direction of rotation and a second direction of rotation, which is opposite to the first direction of rotation, wherein, during the rotation in the first direction, the wire is moved a first length, and during the rotation in the second direction, the wire is moved a second length, and the second length is shorter than the first, and at the cutting operation start a first longitudinal wire tension is greater than a second longitudinal tension at the end.
MACHINING APPARATUS AND MACHINING METHOD
According to one implementation, a machining apparatus includes an electromotive saw and an attaching structure. The electromotive saw cuts off a workpiece to be machined. The attaching structure attaches the saw to an arm of a robot. Further, according to one implementation, a machining method is provided. In the machining method, a machined product is manufactured by processing a composite material or a honeycomb structure with a cutting tool attached to an arm of a robot. Further, according to one implementation, a machining method is provided. In the machining method, a machined product is manufactured by processing a workpiece to be machined with a cutting tool attached to an arm of a robot. The workpiece is processed along a shape of a jig for setting the workpiece. The workpiece is processed with contacting a guide with the jig. The guide is attached to the arm.
Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes
A method uses a wire saw to cut slices from a workpiece. The wire saw has an array of saw wire tensioned in a plane between two rollers supported between fixed and floating bearings. During a cut-off operation, the workpiece is fed through the wire array with simultaneous axial movement of the floating bearings by adjusting the temperature of the fixed bearings with a cooling fluid in accordance with the temperature of the cooling fluid being in dependence on a depth of cut and correlating with a first correction profile, which specifies the travel of the floating bearings in dependence on the depth of cut. Also, the workpiece is fed through the wire array while simultaneously moving the workpiece along the workpiece axis in accordance with a second correction profile, specifying the travel of the workpiece. The first and second correction profiles are opposed to a shape deviation.
AUTOMATIC STROKE SETTING APPARATUS OF CUTTING DEVICE USING MULTI-WIRE
An apparatus configured to automatically set a stroke range of a cutting device includes: a driver including a rotary shaft on which a bobbin is detachably mounted; a traverse configured to move an attachment point of a wire with respect to the bobbin; and a sensor configured to measure a distance between the driver and the bobbin. The apparatus further includes a controller configured to adjust the stroke range of the traverse to move in parallel based on the distance measured by the sensor. The sensor is configured to measure, as first distance data, a distance between a side of the driver and a side of the bobbin.
Nuclear structure dry cutting apparatus
A wire saw apparatus comprises: a first pulley system from which a wire is withdrawn toward a structure to be cut; a second pulley system into which the wire is introduced from the structure; a first dust collection pipe unit provided to surround the wire between an end part at which surrounding of the structure by the wire ends and a part at which the wire is introduced into the first pulley system; and a second dust collection pipe unit provided to surround the wire between a start part at which surrounding of the structure by the wire starts and a part at which the wire is withdrawn from the second pulley system.
Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes
A method cuts slices from workpieces using a wire saw with a wire array tensioned in a plane between two wire guide rollers supported between fixed and floating bearings. A workpiece is fed through the wire array perpendicular to a workpiece axis and the wire array plane. The workpiece is fed through the wire array while controlling a temperature of the workpiece with a cooling medium, with simultaneous axial movement of the floating bearings by adjusting a temperature of the fixed bearings in dependence on a depth of cut and in correlation with a first correction profile, and while simultaneously moving the workpiece along the workpiece axis in accordance with a specification of a second correction profile, which specifies a travel of the workpiece. The first correction profile and the second correction profile being opposed to a shape deviation.
DIAMOND WIRE CUTTING MACHINE
A diamond wire cutting machine includes a spool on which a diamond wire is wound. The spool includes two end flanges having respective frustoconical faces adapted, by cooperation of shape with frustoconical faces of two adapters, to center the spool on an axis of revolution. A drum extends from one of the end flanges to another of the end flanges. The drum includes a cylindrical outer face of circular cross-section on which the diamond wire is wound. The drum defines a central hole through which a drive shaft passes. The drum and the end flanges form a single plastic block.
Method for separating multiple slices of workpieces by means of a wire saw during a sequence of separation processes
Wafers are sliced from a workpiece using a wire saw during slicing operations. The wire saw has a wire web of sawing wire and a setting device. The wire web is stretched in a plane between wire guide rollers that are mounted between fixed and moveable bearings. During each of the slicing operations, the setting device feeds the workpiece through the wire web along a feed direction perpendicular to a workpiece axis and perpendicular to the plane of the wire web. During each of the slicing operations, the movable bearings move oscillatingly axialy. The feeding of the workpiece through the wire web includes a simultaneous displacement of the workpiece along the workpiece axis using the setting element in accordance with a correction profile, which includes an oscillating component that is opposite to the effect which the axial moving of the movable bearings has on the shape of the sliced-off wafers.